Method for curing organopolysiloxane compositions and the compositions

Claim 3

The method according to claim 1 in which (1) and (2) are present in amounts sufficient to provide from 0.1 to 10 moles of organohydrogensiloxane and hydrogensiloxane units in (2) per one mole of alkenyl group in (1).

Claim 4

The method according to claim 1 in which (3) the platinum catalyst is present in an amount of from 0.1 to 1000 parts by weight per million parts by weight of platinum element.

Claim 5

The method according to claim 1 in which (4) is present in an amount of from 0.05 to 10 parts by weight per 100 parts by weight of (1).

Claim 6

The method according to claim 1 in which (B) is present in an amount of from 0.05 to 20 parts by weight.

Claim 7

The method according to claim 2 in which (1) is a polydiorganosiloxane consisting essentially of diorganosiloxane units selected from the group consisting of dimethylsiloxane units, methylphenylsiloxane units, methylvinylsiloxane units, and mixtures thereof, said polydiorganosiloxane is endblocked with dimethylvinylsiloxy units, trimethylsiloxy units, or silicon-bonded hydroxyl groups, and has a vinyl content of from 0.5 to 3 weight percent; (2) is a trimethylsiloxy endblocked polysiloxane containing methylhydrogensiloxane units and optionally dimethylsiloxane units, has a viscosity of from 0.005 to 0.05 Pa·s at 25° C., and is present in an amount of from 2 to 10 parts by weight based on 100 parts by weight of (1); (3) is present in an amount of from 50 to 200 parts by weight of platinum element per million parts by weight of (1); (4) is an alkynol or 3-methyl-3-pentene-1-yne and is present in an amount of from 0.1 to 1.0 part by weight per 100 parts by weight of (1); and (B) is a photosensitizer selected from the group consisting of 4-allylacetophenone, benzophenone, benzoin ethyl ether, and benzil dimethyl ketal, and is present in an amount of from 0.1 to 5 parts by weight per 100 parts by weight of (A).

Claim 8

The method according to claim 6 in which (4) is an alkynol.

Claim 9

The method according to claim 7 in which the alkynol is 3-methyl-1-butyne-3-ol.

Claim 10

The method according to claim 7 in which the alkynol is phenylbutynol.

Claim 11

The method according to claim 7 in which the alkynol is 3,5-dimethyl-1-hexyne-3-ol.

Claim 12

The method according to claim 6 in which (4) is 3-methyl-3-pentene-1-yne.

Claim 17

The method according to claim 1 in which the heating is at a temperature of from 50° to 100° C.

Claim 18

A composition consisting essentially of (A) 100 parts by weight of addition-curable organopolysiloxane composition which consists essentially of (1) organopolysiloxane containing at least two silicon-bonded alkenyl groups per molecule and other organic groups when present are selected from the group consisting of alkyl groups, halogenated alkyl groups, aryl groups, aralkyl groups, and alkaryl groups, (2) organohydrogenpolysiloxane containing at least two organohydrogensiloxane or hydrogensiloxane units per molecule, (3) a platinum catalyst selected from the group consisting of chloroplatinic acid-vinylsiloxane coordination compound and alcohol-modified chloroplatinic acid, and (4) an addition-reaction retarder selected from the group consisting of alkynol, 3-methyl-3-pentene-1-yne, 3,5-dimethyl-3-hexene-1-yne, methylvinylsiloxane cyclics, benzotriazole, and mixtures thereof, and (B) 0.001 to 30 parts by weight photosensitizer.

Claim 19

A composition consisting essentially of (A) 100 parts by weight of addition-curable organopolysiloxane composition which consists essentially of (1) organopolysiloxane containing at least two silicon-bonded alkenyl groups per molecule and other organic groups when present are selected from the group consisting of alkyl groups, halogenated alkyl groups, aryl groups, aralkyl groups, and alkaryl groups, (2) organohydrogenpolysiloxane containing at least two organohydrogensiloxane or hydrogensiloxane units per molecule, (3) a platinum catalyst selected from the group consisting of chloroplatinic acid-vinylsiloxane coordination compound and alcohol-modified chloroplatinic acid, and (4) an addition-reaction retarder selected from the group consisting of alkynol, 3-methyl-3-pentene-1-yne, 3,5-dimethyl-3-hexene-1-yne, methylvinylsiloxane cyclics, benzotriazole, and mixtures thereof, and (B) 0.001 to 30 parts by weight photosensitizer.

Claim 20

The composition according to claim 15 in which (1) and (2) are present in amounts sufficient to provide from 0.1 to 10 moles of organohydrogensiloxanes and hydrogensiloxane units in (2) per one mole of alkenyl group in (1).

Claim 21

The composition according to claim 16 in which (1) is a polydiorganosiloxane consisting essentially of diorganosiloxane units selected from the group consisting of dimethylsiloxane units, methylphenylsiloxane units, methylvinylsiloxane units, and mixtures thereof, said polydiorganosiloxane is endblocked with dimethylvinylsiloxy units, trimethylsiloxy units, or silicon-bonded hydroxyl groups, and has a vinyl content of from 0.5 to 3 weight percent; (2) is a trimethylsiloxy endblocked polysiloxane containing methylhydrogensiloxane units and optionally dimethylsiloxane units, has a viscosity of from 0.005 to 0.05 Pa·s at 25° C., and is present in an amount of from 2 to 10 parts by weight based on 100 parts by weight of (1); (3) is present in an amount of from 50 to 200 parts by weight platinum element per million parts by weight of (1); (4) is an alkynol or 3-methyl-3-pentene-1-yne and is present in an amount of from 0.1 to 1.0 part by weight per 100 parts by weight of (1); and (B) is a photosensitizer selected from the group consisting of 4-allylacetophenone, benzophenone, benzoin ethyl ether, and benzil dimethyl ketal, and is present in an amount of from 0.1 to 5 parts by weight per 100 parts by weight of (A).

Claim 22

The composition according to claim 17 in which (4) is an alkynol.

Claim 23

The method in accordance with claim 1 in which the composition is cured by heating and ultraviolet radiation.

Claim 24

The method in accordance with claim 1 in which the composition is cured by heating and electron beam.