Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
181 words
A heat sink with bonded interfacing for engagement with an electronic device or the like, comprising a heat sink having surfaces disposed to confront and communicate heat from complementary surfaces of an electronic device or the like, a thin composite of dual layers of heat-conducting material overlying and bonded to said heat sink surfaces, the material of each of said layers being converted at different times from an uncured substantially amorphous condition to a dry and relatively firm state, the upper one of said layers having an upper exposed surface which is compliant after conversion to the dry and relatively firm state, the lower one of said layers being cured in place into contiguous and substantially voidless bonded relation both with said heat sink surfaces and with lower surfaces of said upper one of said layers, whereby an electronic device or the like may be secured to said heat sink in overlying relation to the substantially dry composite of layers with the compliant upper layer thereof occupying substantially all space next to said complementary surfaces and thereby promoting effective heat-conduction therefrom.
Claim 2
Dependent Claim
181 words
A heat sink with bonded interfacing for engagement with an electronic device or the like, comprising a heat sink having surfaces disposed to confront and communicate heat from complementary surfaces of an electronic device or the like, a thin composite of dual layers of heat-conducting material overlying and bonded to said heat sink surfaces, the material of each of said layers being converted at different times from an uncured substantially amorphous condition to a dry and relatively firm state, the upper one of said layers having an upper exposed surface which is compliant after conversion to the dry and relatively firm state, the lower one of said layers being cured in place into contiguous and substantially voidless bonded relation both with said heat sink surfaces and with lower surfaces of said upper one of said layers, whereby an electronic device or the like may be secured to said heat sink in overlying relation to the substantially dry composite of layers with the compliant upper layer thereof occupying substantially all space next to said complementary surfaces and thereby promoting effective heat-conduction therefrom.
Claim 3
Dependent Claim
71 words
A heat sink with bonded interfacing as set forth in claim 1 wherein said upper one of said layers is of a material having compliant properties of an elastomeric substance when cured, and wherein the lower of said layers is of a material compatible with that of said upper one of said layers in respect of bonding securely and substantially voidlessly with it in a cured state upon being cured itself.
Claim 4
Dependent Claim
53 words
A heat sink with bonded interfacing as set forth in claim 2 wherein the material of said upper one of said layers consists essentially of silicone rubber having minute particles of heat-conducting material distributed therethrough, and wherein said upper one of said layers is of a thickness of the order of 21/2- mils.
Claim 5
Dependent Claim
41 words
A heat sink with bonded interfacing as set forth in claim 3 wherein said lower one of said layers consists of substantially the same material as that of said upper one of said layers and is of substantially the same thickness.
Claim 6
Dependent Claim
49 words
A heat sink with bonded interfacing as set forth in claim 2 wherein said upper one of said layers incorporates a relatively thin carrier bonded therewith by the curing thereof at the site of said lower surfaces thereof, said carrier member promoting structural integrity of said composite of layers.
Claim 7
Dependent Claim
23 words
A heat sink with bonded interfacing as set forth in claim 5 wherein said carrier is porous and consists essentially of glass fibers.
Claim 8
Dependent Claim
47 words
A heat sink with bonded interfacing as set forth in claim 6 wherein said carrier is a woven fabric, and wherein the silicone rubber and minute particles in the material of said upper one of said layers penetrate said fabric at the site of said lower surfaces.