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US4602316A Expired / Lapsed US ⏱️ 0.0 years remaining

Structure and method for interconnecting printed circuit boards

Assignee: RCA Licensing Corp
•
Filing: 1985-03-29
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Granted: 1986-07-22
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Expires: 2005-03-29
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Abstract

Abstract A technique for interconnecting a plurality of stacked printed circuit boards, each board having a plurality of spaced contact areas at an edge thereof, utilizes a multiconductor cable having a plurality of insulation-stripped window regions therein at predetermined intervals. The cable is continuous through a plurality of the window regions which are positioned, respectively, adjacent the edges of the printed circuit boards so that, at each window region, each stripped wire is aligned with a different contact area. The stripped wires are soldered in bulk to their respective contact areas.

Inventors

  • 👤 Walter B. Feick

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 08:54
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/59; H01R12/62; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H05K1/00; H05K1/02; H05K1/14; H05K1/144; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/05; H05K2201/056; H05K2201/09; H05K2201/09145; H05K2201/09181; H05K3/40; H05K3/403; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49147; Y10T29/49149

Claims Analysis

Total Claims: 18
Claim 1
Independent Claim 129 words
A method for interconnecting a plurality of printed circuit boards, each board having a plurality of spaced contact areas at an edge thereof, comprising the steps of: removing insulation from an insulated multiconductor cable at predetermined intervals to form a plurality of insulation-stripped window regions in said cable, said cable having a plurality of conducting wires juxtaposed in a substantially planar relationship at said window regions; positioning said window regions, respectively, adjacent said edges of the printed circuit boards so that, at each window region, each stripped wire is aligned with a different contact area; forming the stripped wires around said edges of the respectively adjacent printed circuit circuit boards so that each wire touches its adjacent contact area; and soldering the stripped wires to their respective contact areas.
Claim 2
Independent Claim 129 words
A method for interconnecting a plurality of printed circuit boards, each board having a plurality of spaced contact areas at an edge thereof, comprising the steps of: removing insulation from an insulated multiconductor cable at predetermined intervals to form a plurality of insulation-stripped window regions in said cable, said cable having a plurality of conducting wires juxtaposed in a substantially planar relationship at said window regions; positioning said window regions, respectively, adjacent said edges of the printed circuit boards so that, at each window region, each stripped wire is aligned with a different contact area; forming the stripped wires around said edges of the respectively adjacent printed circuit circuit boards so that each wire touches its adjacent contact area; and soldering the stripped wires to their respective contact areas.
Claim 3
Dependent Claim 35 words
A method as recited in claim 1 wherein said insulated multiconductor cable comprises a flat cable, and wherein said removing step is performed by removing the insulation therefrom across the complete width of said cable.
Claim 4
Dependent Claim 37 words
A method as recited in claim 2 wherein said flat cable is initially wound on a spool, and wherein said removing step is performed by feeding the flat cable from said spool and into a wire stripper.
Claim 5
Dependent Claim 40 words
A method as recited in claim 3 wherein said positioning step is performed by continuing to feed said flat cable from said wire stripper towards each of said printed circuit boards in a direction orthogonal to the planar surface thereof.
Claim 6
Dependent Claim 53 words
A method as recited in claim 4 wherein said forming step is performed by placing a U-shaped applicator against the stripped wires opposite each of said edges and pressing the open U-shaped portion of said applicator over said edges, whereby said wires are forcibly bent around said edges to form a U-shaped profile.
Claim 7
Dependent Claim 38 words
A method as recited in claim 5 wherein said printed circuit boards are disposed parallel to each other in a spaced stack-like arrangement, and wherein said forming step is performed simultaneously with respect to all printed circuit boards.
Claim 8
Dependent Claim 38 words
A method as recited in claim 6 wherein each of said contact areas is notched with a V-shaped groove in order to prevent lateral movement of said stripped wires during said forming step and before said soldering step.
Claim 9
Dependent Claim 33 words
A method as recited in claim 1 wherein said contact areas comprise copper etched edge pad terminals that are pre-tinned, and wherein said soldering step is performed by solder reflow during infrared heating.
Claim 10
Dependent Claim 21 words
A method as recited in claim 8 wherein said soldering step is performed simultaneously with respect to all printed circuit boards.
Claim 11
Dependent Claim 24 words
A method as recited in claim 1 wherein said soldering step is performed simultaneously with respect to all printed circuit boards by wave soldering.
Claim 12
Dependent Claim 116 words
A structure including a plurality of interconnected printed circuit boards, each board having a plurality of spaced contact areas at an edge thereof, comprising an insulated multiconductor cable having a plurality of insulation-stripped window regions therein at predetermined levels, said cable being continuous through a plurality of said window regions and having a plurality of conducting wires juxtaposed in a substantially parallel relationship at said window regions, the window regions being positioned, respectively, adjacent said edges of the printed circuit boards so that, at each window region, each stripped wire is aligned with a different contact area and bent around said edge to have a U-shaped profile, said wires being soldered to their respective contact areas.
Claim 13
Dependent Claim 116 words
A structure including a plurality of interconnected printed circuit boards, each board having a plurality of spaced contact areas at an edge thereof, comprising an insulated multiconductor cable having a plurality of insulation-stripped window regions therein at predetermined levels, said cable being continuous through a plurality of said window regions and having a plurality of conducting wires juxtaposed in a substantially parallel relationship at said window regions, the window regions being positioned, respectively, adjacent said edges of the printed circuit boards so that, at each window region, each stripped wire is aligned with a different contact area and bent around said edge to have a U-shaped profile, said wires being soldered to their respective contact areas.
Claim 14
Dependent Claim 33 words
A structure as defined in claim 11 wherein said isulated multiconductor cable comprises a flat cable, and wherein said window regions have the insulation stripped therefrom across the complete width of said cable.
Claim 15
Dependent Claim 23 words
A structure as defined in claim 11 wherein said printed circuit boards are disposed parallel to each other in a spaced stack-like arrangement.
Claim 16
Dependent Claim 19 words
A structure as defined in claim 13 wherein each of said contact areas has a V-shaped groove notched therein.
Claim 17
Dependent Claim 26 words
A structure is defined in claim 11 wherein said contact areas comprise copper etched edge pad terminals that are pre-tinned, and wherein said wires are soldered.
Claim 18
Dependent Claim 13 words
A structure as defined in claim 11 wherein said wires are wave soldered.

References Cited (Backward Citations)

US3553532A Cited
US3794522A Cited
DE2320202A1 Cited
US4245876A Cited
US4109299A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-07-21 1990-01-20 1990-07-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-07-21 1994-01-20 1994-07-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-07-21 1998-01-20 1998-07-22 $7700.00 Window Closed / Lapsed

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