← Back to Patent Explorer
US4597736A Expired / Lapsed US ⏱️ 0.0 years remaining

Method and apparatus for heating semiconductor wafers

Assignee: Yield Engineering Systems Inc
•
Filing: 1985-05-03
•
Granted: 1986-07-01
•
Expires: 2005-05-03
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method and apparatus for heating semiconductor wafers characterized by the release of preheated nitrogen into an oven to considerably reduce heating time for the wafers. The oven is evacuated prior to the release of the preheated nitrogen.

Inventors

  • 👤 William Moffat

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 01:42
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0434; F; F27; F27B; F27B5/00; F27B5/04

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 71 words
A method for heating semiconductor wafers comprising: placing at least one wafer within a chamber of an oven; evacuating said chamber; preheating a quantity of an inert gas by causing said inert gas to move past a heating element of said oven which is external to said chamber; releasing said quantity of preheated inert gas into said previously evacuated chamber; and applying heat energy to said inert gas within said chamber.
Claim 2
Independent Claim 71 words
A method for heating semiconductor wafers comprising: placing at least one wafer within a chamber of an oven; evacuating said chamber; preheating a quantity of an inert gas by causing said inert gas to move past a heating element of said oven which is external to said chamber; releasing said quantity of preheated inert gas into said previously evacuated chamber; and applying heat energy to said inert gas within said chamber.
Claim 3
Dependent Claim 46 words
A method for heating semiconductor wafers as recited in claim 1 further comprising substantially insulating said wafer from thermal conduction with said oven or any support structure located within said oven such that said wafer is heated primarily by convective heat transfer with said inert gas.
Claim 4
Dependent Claim 34 words
A method for heating semiconductor wafers as recited in claim 2 wherein said step of isolating said wafer from from thermal conduction includes the step of placing said wafer within a thermally insulating cassette.
Claim 5
Independent Claim 104 words
An apparatus for heating semiconductor wafers comprising: an oven having a chamber and means disposed within said chamber for supporting at least one semiconductor wafer, said oven having a least one heating element located externally of said chamber; a source of inert gas; means for evacuating said chamber; means for guiding a quantity of said inert gas past said heating element to preheat said inert gas; means for releasing said preheated quantity of gas into said chamber after said chamber has been evacuated; and oven heating means adapted to provide heat energy for said inert gas after it has been released into said chamber.
Claim 6
Independent Claim 104 words
An apparatus for heating semiconductor wafers comprising: an oven having a chamber and means disposed within said chamber for supporting at least one semiconductor wafer, said oven having a least one heating element located externally of said chamber; a source of inert gas; means for evacuating said chamber; means for guiding a quantity of said inert gas past said heating element to preheat said inert gas; means for releasing said preheated quantity of gas into said chamber after said chamber has been evacuated; and oven heating means adapted to provide heat energy for said inert gas after it has been released into said chamber.
Claim 7
Dependent Claim 21 words
An apparatus for heating semiconductor wafers as recited in claim 4 further comprising means for insulating said wafer from heat conduction.
Claim 8
Dependent Claim 23 words
An apparatus for heating semiconductor wafers as recited in claim 5 wherein said means for insulating said wafer includes a heat insulating cassette.
Claim 9
Dependent Claim 126 words
An oven apparatus comprising: a core enclosure provided with a heating chamber and a door opening; a door associated with said door opening and operative to open and close said door opening; a source of inert gas; gas valve means coupling said source of inert gas to said heating chamber; heater means for providing heat energy to the contents of said heating chamber including at least one heater panel attached to exterior surface of said core enclosure; means for preheating said inert gas prior to its release into said heating chamber including a convoluted heat exchange conduit placed in proximity to said heater panel to increase heat exchange therebetween; a low pressure sink; and vacuum valve means coupling said low pressure sink to said heating chamber.
Claim 10
Dependent Claim 126 words
An oven apparatus comprising: a core enclosure provided with a heating chamber and a door opening; a door associated with said door opening and operative to open and close said door opening; a source of inert gas; gas valve means coupling said source of inert gas to said heating chamber; heater means for providing heat energy to the contents of said heating chamber including at least one heater panel attached to exterior surface of said core enclosure; means for preheating said inert gas prior to its release into said heating chamber including a convoluted heat exchange conduit placed in proximity to said heater panel to increase heat exchange therebetween; a low pressure sink; and vacuum valve means coupling said low pressure sink to said heating chamber.
Claim 11
Dependent Claim 19 words
An oven apparatus as recited in claim 7 further comprising an outer shell surrounding much of said core enclosure.
Claim 12
Dependent Claim 22 words
An oven apparatus as recited in claim 8 further comprising thermal insulation means disposed between said outer shell and said core enclosure.

References Cited (Backward Citations)

US1802000A Cited
US4223048A Cited
US4375027A Cited
US4347431A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-06-30 1989-12-30 1990-07-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-06-30 1993-12-30 1994-07-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-06-30 1997-12-30 1998-07-01 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag