Process and apparatus for etching printed circuit boards

Claim 2

In a process for etching a printed circuit board by immersion in an etching solution, the improvement comprising: contacting in an etching zone said printed circuit board with a stream of etching solution in turbulent flow to effect etching of said printed circuit board; and electrolyzing in an electrolyzing zone said etching solution whereby copper is plated out on an electrode, said etching zone being in fluid flow communication with said electrolyzing zone and wherein thermodynamic flow of liquid is enhanced by deposition of copper and generation of gases therein.

Claim 3

The improved process as defined in claim 1 wherein said gases are admixed with recycled etching solution prior to the step of contacting said printed circuit board with a stream of etching solution.

Claim 4

The improved process as defined in claim 1 wherein capacity for electrolyzing said etching solution is greater than capacity for etching.

Claim 5

The improved process as defined in claim 1 wherein the step of electrolysis is initiated by a preselect maximum concentration of copper ions.

Claim 6

The improved process as defined in claim 4 wherein electrolysis is discontinued at a preselect minimum concentration of copper ions.

Claim 7

The improved process as defined in claims 1 or 4 wherein concentration of coppers ions is sensed in a quiescent zone of said electrolyzing zone.

Claim 8

In an apparatus for etching a printed circuit board in an etch chamber by immersion in an etching solution including means for positioning a printed circuit board therein, the improvement comprising: pump means for pressurizing an etching solution; first conduit means in fluid communication with a discharge size of said pump means; an ejector disposed in said first conduit means; nozzle means in fluid communication with said first conduit means and disposed in said etch chamber for directing pressurized etching solution in turbulent flow against said printed circuit board; second conduit means in fluid communication with a suction side of said pump means for withdrawing etching solution from said etch chamber; and third conduit means in fluid communication with a suction side of said ejector and having an inlet above a level of said etching solution in said etch chamber.

Claim 9

In an apparatus for etching a printed circuit board in an etch chamber by immersion in an etching solution including means for positioning a printed circuit board therein, the improvement comprising: pump means for pressurizing an etching solution; first conduit means in fluid communication with a discharge size of said pump means; an ejector disposed in said first conduit means; nozzle means in fluid communication with said first conduit means and disposed in said etch chamber for directing pressurized etching solution in turbulent flow against said printed circuit board; second conduit means in fluid communication with a suction side of said pump means for withdrawing etching solution from said etch chamber; and third conduit means in fluid communication with a suction side of said ejector and having an inlet above a level of said etching solution in said etch chamber.

Claim 10

The apparatus as defined in claim 7 and further including an electrolysis chamber including a cathode and an anode and means for introducing etching solution into said electrolysis chamber from said etch chamber.

Claim 11

The apparatus as defined in claim 8 and further including switching means for placing an electric potential across said cathode and said anode.

Claim 12

The apparatus as defined in claim 9 wherein said switch means is closed in response to a preselect maximum concentration of copper ions in said etching solution.

Claim 13

The apparatus as defined in claim 10 wherein said switching means is open in response to a preselect minimum concentration of copper ions in said etching solution.

Claim 14

The apparatus as defined in claim 8 wherein said third conduit means is positioned in said electrolytic chamber.

Claim 16

The apparatus as defined in claim 13 wherein said sensor means is disposed beneath an inlet orifice of said second conduit means proximate said anode.

Claim 17

The apparatus as defined in claim 14 wherein said sensor means is positioned proximate said means for introducing etching solution into said electrolysis chamber.

Claim 18

The apparatus as defined in claim 8 wherein said etch chamber and electrolysis chamber are separated by a separating means including said means for introducing etching solution into said electrolysis chamber from said etch chamber.

Claim 19

The apparatus as defined in claim 16 wherein said separating means is said anode.

Claim 20

The apparatus as defined in claim 17 wherein said anode includes orifices as said means for introducing etching solution into said electrolysis chamber from said etch chamber.

Claim 21

The apparatus as defined in claim 7 and further including: a rinse chamber including positioning means for positioning an etched circuit board; pump means for pressurizing a rinse solution; first rinse conduit means in fluid communication with a discharge side of said pump means; and nozzle means in fluid communication with said first rinse conduit means and disposed in said rinse chamber for directing pressurized etching solution in turbulent flow against said etched circuit board.

Claim 22

The apparatus as defined in claim 19 and further including ion exchange resins disposed in said rinse chamber.

Claim 23

The apparatus as defined in claim 20 wherein said ion exchange resins are contained in cartridge means.

Claim 24

The apparatus as defined in claim 21 wherein said cartridge means are at least partially transparent and said ion exchange resin is color responsive.

Claim 25

The aparatus as defined in claim 19 and further including second rinse conduit means in fluid communication between said rinse chamber and a suction side of said pump means.

Claim 26

The apparatus as defined in claim 23 wherein said conduit means and said rinse chamber are dimensioned to provide a liquid level in said rinse chamber higher than a liquid level above an inlet orifice of said second rinse conduit means.

Claim 27

The apparatus as defined in claim 19 wherein said chambers are formed in a unitary vessel.