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US4590502A Expired / Lapsed US ⏱️ 0.0 years remaining

Camel gate field effect transistor device

Assignee: University of Illinois at Urbana-Champaign
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Filing: 1983-03-07
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Granted: 1986-05-20
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Expires: 2003-03-07
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Abstract

Abstract The disclosed device is a field-effect transistor which includes a support region that may typically comprise a substrate having a buffer layer thereon. A semiconductor channel layer of one conductivity type is disposed on the support region. A first highly-doped semiconductor layer of opposite conductivity type is disposed on the channel layer. A second highly-doped semiconductor layer of said one conductivity type is disposed on the first highly-doped semiconductor layer. Source and drain electrodes are disposed in spaced relation, and contact the channel layer. A gate electrode is disposed on the second highly-doped semiconductor layer in the region between the source and drain electrodes. In a preferred embodiment, the source and drain electrodes are disposed on the second highly-doped semiconductor layer and extend through the second and first highly-doped semiconductor layers to the channel layer. The first and second highly-doped layers are thin enough to be fully depleted by adjacent layers. This being the case, it is not necessary to etch these highly-doped layers in the regions between the gate and the source and drain electrodes, since they do not act as current-carrying paths.

Inventors

  • 👤 Hadis Morkoc

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 05:53
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/80

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 100 words
A field-effect transistor device, comprising: a support region; a semiconductor channel layer of one conductivity type disposed on the support region; a first highly-doped semiconductor layer of opposite conductivity type disposed on said channel layer; a second highly-doped semiconductor layer of said one conductivity type disposed on said first highly-doped semiconductor layer; source and drain electrodes disposed in spaced relation on said second higly-doped semiconductor layer and extending through said second and first highly-doped semiconductor layers to said channel layer; and a gate electrode disposed on said second highly-doped semiconductor layer in the region between said source and drain electrodes.
Claim 2
Dependent Claim 100 words
A field-effect transistor device, comprising: a support region; a semiconductor channel layer of one conductivity type disposed on the support region; a first highly-doped semiconductor layer of opposite conductivity type disposed on said channel layer; a second highly-doped semiconductor layer of said one conductivity type disposed on said first highly-doped semiconductor layer; source and drain electrodes disposed in spaced relation on said second higly-doped semiconductor layer and extending through said second and first highly-doped semiconductor layers to said channel layer; and a gate electrode disposed on said second highly-doped semiconductor layer in the region between said source and drain electrodes.
Claim 3
Dependent Claim 24 words
The device as defined by claim 1, wherein said first and second highly-doped layers are thin enough to be fully depleted by adjacent layers.
Claim 4
Dependent Claim 21 words
The device as defined by claim 1, wherein said one conductivity type is n-type and said opposite conductivity type is p-type.
Claim 5
Dependent Claim 43 words
The device as defined by claim 1, wherein said channel layer and said second highly-doped layer are formed of gallium arsenide and said first highly-doped layer is formed of a semiconductor selected from the group consisting of gallium arsenide and aluminum gallium arsenide.
Claim 6
Dependent Claim 22 words
The device as defined by claim 4, wherein said highly doped semiconductor layers have at least 10 18 carriers per cubic centimeter.
Claim 7
Dependent Claim 21 words
The device as defined by claim 1, wherein said support region comprises a substrate having a high-resistivity semiconductor buffer layer thereon.
Claim 8
Dependent Claim 21 words
The device as defined by claim 1, wherein said gate electrode forms an ohmic contact with said second highly-doped semiconductor layer.

References Cited (Backward Citations)

US3823352A Cited
US4075651A Cited
US4455564A Cited
US4424525A Cited
US4471367A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-05-19 1989-11-18 1990-05-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-05-19 1993-11-18 1994-05-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-05-19 1997-11-18 1998-05-20 $7700.00 Window Closed / Lapsed

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