Tape bonding of two integrated circuits into one tape frame

Claim 1

A method of tape bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape type lead frame comprising the steps of: providing a first integrated circuit chip having a plurality of contact pads situated on a surface of said chip, providing a length of said tape containing a plurality of said sites each having a first and a second group of finger leads, each finger lead having an inner free end, said tape having first and second opposed major surfaces, bonding said inner free ends of said first group of finger leads in one such site to the corresponding contact pads on said first chip such that contact bumps interconnect the chip contact pads to the first group of finger leads on said first major surface of the tape by compressing said finger leads and said chip between a heated thermode member and an anvil member, providing a second integrated circuit chip having a plurality of contact pads situated on a surface of said chip that cooperate with the second group of finger leads to provide interconnection sites outside the periphery of the first integrated circuit as bonded to the lead frame site, bonding said inner free ends of said second group of finger leads in said site to the corresponding contact pads on said second chip by compressing said finger leads and said chip between a thermode member and an anvil member, said thermode member having a recess in its surface accommodating said first bonded chip so that no pressure is applied to said chip when bonding the second group of finger leads to the second chip.

Claim 2

A method of tape bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape type lead frame comprising the steps of: providing a first integrated circuit chip having a plurality of contact pads situated on a surface of said chip, providing a length of said tape containing a plurality of said sites each having a first and a second group of finger leads, each finger lead having an inner free end, said tape having first and second opposed major surfaces, bonding said inner free ends of said first group of finger leads in one such site to the corresponding contact pads on said first chip such that contact bumps interconnect the chip contact pads to the first group of finger leads on said first major surface of the tape by compressing said finger leads and said chip between a heated thermode member and an anvil member, providing a second integrated circuit chip having a plurality of contact pads situated on a surface of said chip that cooperate with the second group of finger leads to provide interconnection sites outside the periphery of the first integrated circuit as bonded to the lead frame site, bonding said inner free ends of said second group of finger leads in said site to the corresponding contact pads on said second chip by compressing said finger leads and said chip between a thermode member and an anvil member, said thermode member having a recess in its surface accommodating said first bonded chip so that no pressure is applied to said chip when bonding the second group of finger leads to the second chip.

Claim 3

A method of tape bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape type lead frame comprising the steps of: providing a length of said tape containing a plurality of said sites each having a first and a second group of finger leads, each finger lead having an inner free end, said tape having a top and a bottom surface, providing a first integrated circuit chip having a plurality of contact pads situated on a surface of said chip, bonding said inner free ends of said first group of finger leads in one such site to contact bumps on the chip contact pads interconnect the first group of finger leads on said bottom surface of the tape by compressing said finger leads and said chip between a heated thermode member and an anvil member situated in an inner lead bonder machine, flipping said tape in an upside down position such that said bottom surface of the tape containing said first bonded chip is facing upward, feeding said tape in said upside down position through an inner lead bonder machine containing a heated thermode member and an anvil member, said thermode member having a recess in its surface accommodating said first bonded chip, providing and positioning a second integrated circuit chip having a plurality of contact pads situated on a surface of said chip on said anvil member of said second inner lead bonder machine, said contact pads cooperate with the second group of finger leads to provide interconnection sites outside the periphery of the first integrated circuit as bonded to the lead frame site, bonding said inner free ends of said second group of finger leads in said site to contact bumps on the second chip by compressing the lower surface of said finger leads and said second chip between said heated thermode member and said anvil member, whereby the recess in the surface of said thermode member accommodates said first bonded chip such that no pressure is applied on said first chip when bonding the second chip to the lead frame.

Claim 4

A method of tape bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape type lead frame comprising the steps of: providing a length of said tape containing a plurality of said sites each having a first and a second group of finger leads, each finger lead having an inner free end, said tape having a top and a bottom surface, providing a first integrated circuit chip having a plurality of contact pads situated on a surface of said chip, bonding said inner free ends of said first group of finger leads in one such site to contact bumps on the chip contact pads interconnect the first group of finger leads on said bottom surface of the tape by compressing said finger leads and said chip between a heated thermode member and an anvil member situated in an inner lead bonder machine, flipping said tape in an upside down position such that said bottom surface of the tape containing said first bonded chip is facing upward, feeding said tape in said upside down position through an inner lead bonder machine containing a heated thermode member and an anvil member, said thermode member having a recess in its surface accommodating said first bonded chip, providing and positioning a second integrated circuit chip having a plurality of contact pads situated on a surface of said chip on said anvil member of said second inner lead bonder machine, said contact pads cooperate with the second group of finger leads to provide interconnection sites outside the periphery of the first integrated circuit as bonded to the lead frame site, bonding said inner free ends of said second group of finger leads in said site to contact bumps on the second chip by compressing the lower surface of said finger leads and said second chip between said heated thermode member and said anvil member, whereby the recess in the surface of said thermode member accommodates said first bonded chip such that no pressure is applied on said first chip when bonding the second chip to the lead frame.

Claim 5

A method of tape bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape type lead frame comprising the steps of: providing a length of said tape containing a plurality of said sites each having a first and a second group of finger leads, each finger lead having an inner free end, said tape having a first and a second major opposed surface, providing a first integrated circuit chip having a plurality of contact bumps on the chip contact pads situated on a surface of said chip, bonding said inner free ends of said first group of finger leads in one such site to contact bumps on the chip contact pads interconnect the first group of finger leads on said first major surface of the tape by compressing said finger leads and said chip between a first thermode member and an anvil member situated in an inner lead bonder machine, reeling said tape onto a spool mounted in said bonder machine, turning said spool upside down and remounting said spool in said bonder machine, replacing said first thermode member in said bonder machine with a second thermode member having a recess in its surface to accommodate said first bonded chip, unreeling and positioning said tape between said second thermode member and said anvil member such that said first bonded chip being on top of said tape and being accommodated by the recess in said thermode member, providing and positioning a second integrated circuit chip having a plurality of contact pads situated on a surface of said chip on said anvil, said contact pads cooperate with the second group of finger leads to provide interconnection sites outside the periphery of the first integrated circuit as bonded to the lead frame site, bonding said inner free ends of said second group of finger leads in said site to contact bumps on the second chip by compressing said finger leads and said second chip between said second heated thermode member and said anvil member, said thermode member having a recess in its surface accommodates said first bonded chip such that no pressure is applied on said first chip when bonding said second chip to the lead frame.

Claim 6

A method of tape bonding two integrated circuit chips in a face-to-face relationship to a single site of finger leads situated in a tape type lead frame comprising the steps of: providing a length of said tape containing a plurality of said sites each having a first and a second group of finger leads, each finger lead having an inner free end, said tape having a first and a second major opposed surface, providing a first integrated circuit chip having a plurality of contact bumps on the chip contact pads situated on a surface of said chip, bonding said inner free ends of said first group of finger leads in one such site to contact bumps on the chip contact pads interconnect the first group of finger leads on said first major surface of the tape by compressing said finger leads and said chip between a first thermode member and an anvil member situated in an inner lead bonder machine, reeling said tape onto a spool mounted in said bonder machine, turning said spool upside down and remounting said spool in said bonder machine, replacing said first thermode member in said bonder machine with a second thermode member having a recess in its surface to accommodate said first bonded chip, unreeling and positioning said tape between said second thermode member and said anvil member such that said first bonded chip being on top of said tape and being accommodated by the recess in said thermode member, providing and positioning a second integrated circuit chip having a plurality of contact pads situated on a surface of said chip on said anvil, said contact pads cooperate with the second group of finger leads to provide interconnection sites outside the periphery of the first integrated circuit as bonded to the lead frame site, bonding said inner free ends of said second group of finger leads in said site to contact bumps on the second chip by compressing said finger leads and said second chip between said second heated thermode member and said anvil member, said thermode member having a recess in its surface accommodates said first bonded chip such that no pressure is applied on said first chip when bonding said second chip to the lead frame.