US4583676A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of wire bonding a semiconductor die and apparatus therefor
Assignee: Motorola Solutions Inc
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Filing: 1982-05-03
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Granted: 1986-04-22
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Expires: 2002-05-03
Abstract
Abstract A semiconductor die surface heater and a method of using the die surface heater as a wire bonding assembly are provided. In the preferred form, the semiconductor die surface heater comprises two heaters. A preheater heats the surface of a semiconductor die which is attached to a lead frame via radiant energy. A clamp which positions both the semiconductor die and lead frame during the wire bonding has a window portion with a surface clamp heater for heating at least the portion of the clamp around the window.
Inventors
- 👤 Edward Pena
- 👤 S. L. Cheong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 05:32
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/02; B23K20/023; B23K20/24; H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07178; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
75 words
A semiconductor die surface heater in combination with a wire bonding assembly having a hold down clamp used for positioning a lead frame having a semiconductor die attached thereto with the die positioned within a window through said clamp prior to wire bonding said semiconductor die to a bonding surface of said lead frame, comprising: a surface heater positioned around said window and above the lead frame for raising the temperature of said bonding surface.
Claim 2
Dependent Claim
75 words
A semiconductor die surface heater in combination with a wire bonding assembly having a hold down clamp used for positioning a lead frame having a semiconductor die attached thereto with the die positioned within a window through said clamp prior to wire bonding said semiconductor die to a bonding surface of said lead frame, comprising: a surface heater positioned around said window and above the lead frame for raising the temperature of said bonding surface.
Claim 3
Dependent Claim
43 words
The semiconductor die surface heater of claim 1 further comprising: a surface pre-heater positioned substantially adjacent said window and above said lead frame, for pre-heating the bonding surface of said semiconductor die immediately prior to heating said bonding surface with said surface heater.
Claim 4
Dependent Claim
18 words
The semiconductor die surface heater of claims 1 or 2 wherein said surface heater is a coil heater.
Claim 5
Dependent Claim
16 words
The semiconductor die surface heater of claim 2 wherein said surface pre-heater is a coil heater.
Claim 6
Dependent Claim
76 words
A wire bonding assembly comprising: a hold down clamp for maintaining a lead frame having a semiconductor die attached thereto with the die positioned within a window through said clamp during a wire bonding operation; means for performing a wire bonding operation through said window; and clamp heating means positioned above the lead frame, for heating at least the portion of said clamp around said window, whereby said semiconductor die is heated via radiant heat energy.
Claim 7
Dependent Claim
76 words
A wire bonding assembly comprising: a hold down clamp for maintaining a lead frame having a semiconductor die attached thereto with the die positioned within a window through said clamp during a wire bonding operation; means for performing a wire bonding operation through said window; and clamp heating means positioned above the lead frame, for heating at least the portion of said clamp around said window, whereby said semiconductor die is heated via radiant heat energy.
Claim 8
Dependent Claim
32 words
The wire bonding assembly of claim 5 further comprising: preheating means positioned adjacent said clamp and above the lead frame for heating said semiconductor die immediately prior to said wire bonding operation.
Claim 9
Independent Claim
106 words
A method of wire bonding a semiconductor die to a lead frame comprising the steps of: positioning a lead frame having said semiconductor die mounted thereon within a window of a hold down clamp; clamping the lead frame below said hold down clamp for maintaining a bonding surface of the lead frame within said window; positioning a surface heater around said window and above the lead frame; heating at least the portion of said clamp around said window via radiant heat energy from the surface heater prior to bonding said semiconductor die to said lead frame; and wire bonding said semiconductor die to said lead frame.
Claim 10
Independent Claim
106 words
A method of wire bonding a semiconductor die to a lead frame comprising the steps of: positioning a lead frame having said semiconductor die mounted thereon within a window of a hold down clamp; clamping the lead frame below said hold down clamp for maintaining a bonding surface of the lead frame within said window; positioning a surface heater around said window and above the lead frame; heating at least the portion of said clamp around said window via radiant heat energy from the surface heater prior to bonding said semiconductor die to said lead frame; and wire bonding said semiconductor die to said lead frame.
Claim 11
Dependent Claim
27 words
The method of claim 7 further comprising: preheating said semiconductor die immediately prior to said wire bonding via radiant heat energy originating from above the lead frame.
Claim 12
Dependent Claim
87 words
A wire bonding assembly comprising: a hold down clamp for maintaining a lead frame having a semiconductor die attached thereto with the die positioned within a window through said clamp during a wire bonding operation; clamp heating means positioned above the lead frame for heating at least the portion of said clamp around said window; means for performing a wire bonding operation through said window; and preheating means positioned adjacent said clamp for heating a surface of said semiconductor die immediately prior to said wire bonding operation.
Claim 13
Dependent Claim
87 words
A wire bonding assembly comprising: a hold down clamp for maintaining a lead frame having a semiconductor die attached thereto with the die positioned within a window through said clamp during a wire bonding operation; clamp heating means positioned above the lead frame for heating at least the portion of said clamp around said window; means for performing a wire bonding operation through said window; and preheating means positioned adjacent said clamp for heating a surface of said semiconductor die immediately prior to said wire bonding operation.
Claim 14
Independent Claim
85 words
A method of wire bonding a semiconductor die to a lead frame comprising: preheating said semiconductor die which is to be wire bonded immediately prior to said die being advanced to a wire bonding position; advancing said die and clamping said die in said position with a hold down clamp; heating said clamp by heating means positioned above the lead frame to increase the temperature of said die, thereby enhancing the strength of the wire bond; and wire bonding said die to said lead frame.
Claim 15
Independent Claim
85 words
A method of wire bonding a semiconductor die to a lead frame comprising: preheating said semiconductor die which is to be wire bonded immediately prior to said die being advanced to a wire bonding position; advancing said die and clamping said die in said position with a hold down clamp; heating said clamp by heating means positioned above the lead frame to increase the temperature of said die, thereby enhancing the strength of the wire bond; and wire bonding said die to said lead frame.
Claim 16
Dependent Claim
30 words
The method of claim 10 wherein the die temperature is increased sufficiently to enhance the strength of the wire bond without causing said semiconductor to lift from said lead frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-04-21 | 1989-10-21 | 1990-04-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-04-21 | 1993-10-21 | 1994-04-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-04-21 | 1997-10-21 | 1998-04-22 | $7700.00 | Window Closed / Lapsed |