US4583227A
Expired / Lapsed
US
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Temperature compensating semiconductor lasers
Assignee: STC PLC
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Filing: 1983-02-08
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Granted: 1986-04-15
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Expires: 2003-02-08
Abstract
Abstract A semiconductor laser is constructed such that at least a part of the laser optical feedback is provided by an external reflector spaced from the semiconductive material of the laser so as to form a composite optical cavity bounded by the semiconductive material and the reflector. The external reflector is supported on a mount constructed such that in response to changes in temperature the mount moves the external reflector relative to the adjacent surface of the semiconductive material so as to provide the external part of the optical cavity with a thermal coefficient substantially matched with the mode wavelength expansion coefficient of the internal part of the cavity. In another embodiment the external reflector is supported on a mount constructed such that in response to changes in temperature it moves the external reflector relative to the adjacent surface of the semiconductor material so as to provide the external part of the optical cavity with a thermal expansion coefficient substantially matched with the peak gain wavelength expansion coefficient. In other embodiments, the external reflector is supported on a mount constructed such that in response to temperature changes it moves the reflector relative to the anti-reflection coated adjacent surface of the semiconductor material so as to provide the external part of the cavity with a thermal expansion coefficient such that the composite cavity has a mode wavelength expansion coefficient substantially equal to zero or the composite cavity has a mode wavelength expansion coefficient substantially equal to the peak gain wavelength coefficient.
Inventors
- 👤 Paul A. Kirkby
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:52
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/10; H01S5/14; H01S5/02; H01S5/022; H01S5/023; H01S3/00; H01S3/05; H01S3/08; H01S3/08059; H01S5/0225; H01S5/02251; H01S5/02325; H01S5/0233; H01S5/0235; H01S5/06; H01S5/068; H01S5/06804; H01S5/0683; H01S5/1039; H01S5/141; H01S5/146; H01S5/147
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
208 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate, said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip, said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficients such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between said external surface of the reflector and the nearest external surface of said semiconductor chip is such that the said external cavity part has a thermal expansion coefficient substantially matched with the mode wavelength expansion coefficient of said internal optical cavity according to the equation (dL A /dT)(1/L A )=(dλ m /dT)(1/λ m ) where L A is the distance between said external surface of said reflector and said external surface of said semiconductor chip, λ m =mode wavelength, and T=temperature.
Claim 2
Dependent Claim
208 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate, said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip, said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficients such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between said external surface of the reflector and the nearest external surface of said semiconductor chip is such that the said external cavity part has a thermal expansion coefficient substantially matched with the mode wavelength expansion coefficient of said internal optical cavity according to the equation (dL A /dT)(1/L A )=(dλ m /dT)(1/λ m ) where L A is the distance between said external surface of said reflector and said external surface of said semiconductor chip, λ m =mode wavelength, and T=temperature.
Claim 3
Dependent Claim
38 words
A semiconductor laser as claimed in claim 1 wherein the optical path length of the external part of the composite optical cavity is between one fifth and one twentyfifth of the optical path length of the semiconductor part.
Claim 4
Dependent Claim
28 words
A semiconductor laser as claimed in claim 1 wherein the external reflector comprises an etalon providing spectral selectivity of reflection discriminated between longitudinal modes of adjacent mode number.
Claim 5
Dependent Claim
27 words
The semiconductor laser as claimed in claim 1, wherein the external surface of the reflector comprises a photodetector adapted to monitor the output power of the laser.
Claim 6
Dependent Claim
210 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip; said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficients such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between said external surface of the reflector and the nearest external surface of said semiconductor chip is such that said external cavity part has a thermal expansion coefficient substantially matched with the peak gain wavelength expansion coefficient of said internal optical cavity according to the equation (dL A /dT)(1/L A )=(dλ p /dT(1/λ p ) where L A is the distance between said external surface of said reflection and said external surface of said semiconductor chip, λ p is the peak wavelength, and T=Temperature.
Claim 7
Dependent Claim
210 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip; said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficients such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between said external surface of the reflector and the nearest external surface of said semiconductor chip is such that said external cavity part has a thermal expansion coefficient substantially matched with the peak gain wavelength expansion coefficient of said internal optical cavity according to the equation (dL A /dT)(1/L A )=(dλ p /dT(1/λ p ) where L A is the distance between said external surface of said reflection and said external surface of said semiconductor chip, λ p is the peak wavelength, and T=Temperature.
Claim 8
Dependent Claim
38 words
The semiconductor laser as claimed in claim 5, wherein the optical path length of the external part of the composite optical cavity is between one fifth and one twentyfifth of the optical path length of the semiconductor part.
Claim 9
Dependent Claim
205 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip; said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficients such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between said external surface of the reflector and the nearest external surface of said semiconductor chip is such that said composite optical cavity has a mode wavelength expansion coefficient substantially equal to zero as represented by the equation dL A /dT=-dL S /dT where L A is the distance between said external surface of said reflector and said external surface of said semiconductor chip, L s is the optical path length of said semiconductor chip, and T is temperature.
Claim 10
Dependent Claim
205 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip; said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficients such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between said external surface of the reflector and the nearest external surface of said semiconductor chip is such that said composite optical cavity has a mode wavelength expansion coefficient substantially equal to zero as represented by the equation dL A /dT=-dL S /dT where L A is the distance between said external surface of said reflector and said external surface of said semiconductor chip, L s is the optical path length of said semiconductor chip, and T is temperature.
Claim 11
Dependent Claim
31 words
A semiconductor laser as claimed in claim 7 wherein the external reflector consists of or incorporates a grating providing spectral selectivity of reflection discriminated between longitudinal modes of adjacent mode number.
Claim 12
Dependent Claim
48 words
A semiconductor as claimed in claim 7, wherein the external reflector incorporates a single mode fibre with a lens at the end nearer the semiconductive part of the optical cavity and spectral selectivity of reflection by the external reflector is provided by an etalon at the other end.
Claim 13
Dependent Claim
30 words
A semiconductor laser as claimed in claim 7, wherein the external reflecting surface is provided by the surface of a photodetector adapted to monitor the output power of the laser.
Claim 14
Dependent Claim
54 words
A semiconductor as claimed in claim 7 wherein the external reflector incorporates a single mode fibre with a lens at the end nearer the semiconductor part of the optical cavity and spectral selectivity of reflection by the external reflector is provided by a grating interacting with the evanescent filed of the fibre propagating mode.
Claim 15
Dependent Claim
205 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip; said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficient such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between an external surface of the reflector and the nearest external surface of said semiconductor chip is such that provide said composite optical cavity with a mode wavelength expansion coefficient substantially equal to the peak gain wavelength expansion coefficient of said internal optical cavity according to the equation (dL C /dT)(1/L C )=(dλ p /dT)(1/λ p ) where L C is the optical path length of said composite optical cavity, λ p is peak wavelength, and T is temperature.
Claim 16
Dependent Claim
205 words
A temperature compensating semiconductor laser comprising: a semiconductor laser chip; a substrate on which said chip is mounted; a support member mounted on said substrate said support member having a different thermal expansion coefficient from that of said substrate; a reflector mounted on said support member and aligned with an internal optical cavity of said chip; said chip and said reflector forming a composite optical cavity comprising said internal optical cavity of said chip and an external cavity part of shorter optical path length comprising a space between the chip and an external surface of said reflector, said substrate and said support member having thermal expansion coefficient such that in response to temperature changes the reflector moves such that the thermal expansion coefficient of the space between an external surface of the reflector and the nearest external surface of said semiconductor chip is such that provide said composite optical cavity with a mode wavelength expansion coefficient substantially equal to the peak gain wavelength expansion coefficient of said internal optical cavity according to the equation (dL C /dT)(1/L C )=(dλ p /dT)(1/λ p ) where L C is the optical path length of said composite optical cavity, λ p is peak wavelength, and T is temperature.
Claim 17
Dependent Claim
27 words
The semiconductor laser as claimed in claim 12, wherein the reflector comprises a grating providing spectral selectivity of reflection discriminated between longitudinal modes of adjacent mode number.
Claim 18
Dependent Claim
27 words
The semiconductor laser a claimed in claim 12, wherein the reflector comprises an etalon providing spectral selectivity of reflection discriminated between longitudinal modes of adjacent mode number.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-04-14 | 1989-10-14 | 1990-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-04-14 | 1993-10-14 | 1994-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-04-14 | 1997-10-14 | 1998-04-15 | $7700.00 | Window Closed / Lapsed |