US4576689A
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Process for electrochemical metallization of dielectrics
Assignee: INSTITUT FIZIKO-KHIMICHESKIKH OSNOV PERERABOTKI MINERALNOGO SYRIA SIBIRSKOGO OTDELENIA AKADEMII NAUK SSSR USSR NOVOSIBIRSK
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Filing: 1980-04-25
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Granted: 1986-03-18
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Expires: 2000-04-25
Abstract
Abstract A solution for electrochemical metallization of dielectrics comprising a salt of copper, a phosphorus-containing salt, a stabilizing agent and water which contains, as the phosphorus-containing salt, a salt of hypophosphorous acid, the components being employed in the following proportions, g/l: copper salt: 35 to 350 hypophosphorous acid salt: 35 to 400 stabilizing agent: 0.004 to 250 water: up to 1 liter. A process for electrochemical metallization of dielectrics involving preparation of the dielectric surface, formation of a current-conducting layer thereon, electrochemical building-up of a metal coating, characterized in that the dielectric surface activation and formation of a current-conducting layer on this surface are effected simultaneously by wetting the dielectric surface with the above-specified solution, followed by a heat-treatment at a temperature within the range of from 80° to 350° C.
Inventors
- 👤 Almaxud M. Makkaev
- 👤 Oleg I. Lomovsky
- 👤 Jury I. Mikhailov
- 👤 Vladimir V. Boldyrev
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 04:14
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/02; C23C18/08; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; C23C18/1633; C23C18/1655; C23C18/1664; C23C18/1667; C23C18/1675; C23C18/1678; C23C18/168; C23C18/31; C23C18/38; C23C18/40; C23C18/1646; C23C18/165; C23C18/1653; C23C18/18; C23C18/1851; C23C18/1872; C23C18/1886; C23C18/1893; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/2086; C25; C25D; C25D21/00; C25D21/02; C25D3/00; C25D3/02; C25D3/38; C25D3/46; C25D5/00; C25D5/10; C25D5/48; H; H01; H01G; H01G4/00; H01G4/002; H01G4/005; H01G4/008; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/40; H05K3/42; H05K3/422; H05K3/423; H05K3/424; Y; Y02; Y02T; Y02T50/00; Y02T50/60; Y10; Y10S; Y10S205/00; Y10S205/918
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
89 words
A process for producing a conductive layer on a dielectric consisting essentially of: (a) wetting at least a portion of the surface of the dielectric with a solution comprising: ______________________________________
grams/liter
______________________________________
copper salt 50-350
hypophosphorous acid salt
50-350
stabilizing agent 0.004-250
water up to 1 liter
______________________________________ (b) heat-treating at least the portion of the surface of the dielectric wetted with the solution at a temperature in the range of 80° to 350° C. to evaporate the water and decompose the solution whereby a conductive layer is formed.
Claim 2
Dependent Claim
89 words
A process for producing a conductive layer on a dielectric consisting essentially of: (a) wetting at least a portion of the surface of the dielectric with a solution comprising: ______________________________________
grams/liter
______________________________________
copper salt 50-350
hypophosphorous acid salt
50-350
stabilizing agent 0.004-250
water up to 1 liter
______________________________________ (b) heat-treating at least the portion of the surface of the dielectric wetted with the solution at a temperature in the range of 80° to 350° C. to evaporate the water and decompose the solution whereby a conductive layer is formed.
Claim 3
Dependent Claim
16 words
A process of claim 1 wherein the heat-treating is carried out by irradiation with IR radiation.
Claim 4
Dependent Claim
16 words
A process of claim 2 wherein the conductivity of the conductive layer is increased by electroplating.
Claim 5
Dependent Claim
16 words
A process of claim 2 wherein the heat-treatment is at a temperature of from 220°-270° C.
Claim 6
Dependent Claim
19 words
A process of claim 4 wherein the heat-treating is done for a period of from 7 to 20 seconds.
Claim 7
Dependent Claim
16 words
A process of claim 4 wherein the conductivity of the conductive layer is increased by electroplating.
Claim 8
Dependent Claim
18 words
A process of claim 1 wherein the heat-treating is carried out by irradiation with IR and UV radiation.
Claim 9
Dependent Claim
16 words
A process of claim 7 wherein the conductivity of the conductive layer is increased by electroplating.
Claim 10
Dependent Claim
18 words
A process of claim 7 wherein the heat-treatment is at a temperature of from 180° to 220° C.
Claim 11
Dependent Claim
16 words
A process of claim 9 wherein the heat-treatment is carried out for 5 to 12 seconds.
Claim 12
Dependent Claim
16 words
A process of claim 9 wherein the conductivity of the conductive layer is increased by electroplating.
Claim 13
Dependent Claim
19 words
A process of claim 1 wherein the heat-treating is done for a period of less than about 10 minutes.
Claim 14
Dependent Claim
16 words
A process of claim 1 wherein the conductivity of the conductive layer is increased by electroplating.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-03-17 | 1989-09-16 | 1990-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-03-17 | 1993-09-16 | 1994-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-03-17 | 1997-09-16 | 1998-03-18 | $7700.00 | Window Closed / Lapsed |