Metallization of ceramics

Claim 2

In a process for metallizing a surface of a ceramic substrate which includes treating the surface to adherently receive metal and depositing metal on the treated surface, the improvement which comprises: treating the surface with a melt comprising one or more alkali metal compounds to adhesion promote or etch the surface; and in a later step exposing said surface to an adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, said nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanidine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of catalyst on the surface and eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof; treating said surface with a catalyst solution for rendering said surface receptive to deposition of metal; and exposing the thus treated surface or selected parts of said surface to a metal depositing bath solution thus forming a uniform metal layer on said surface or selected parts thereof.

Claim 3

A process as defined in claim 1 wherein said melt further includes up to about 60% by weight of one or more materials which depress the melting point of said alkali metal compound(s).

Claim 4

A process as defined in claim 1 wherein said melt further includes up to about 20% by weight of one or more materials which depress the melting point of said alkali metal compound(s).

Claim 5

A process as defined in claim 1, wherein said alkali metal compound is selected from hydroxide, carbonates, nitrates and hydrogen sulfates and mixtures thereof.

Claim 6

A process as defined in claim 1, wherein said alkali metal compound is selected from carbonates and nitrates and mixtures thereof.

Claim 7

A process as defined in claim 1, wherein the adsorption promoter comprises said ethoxylated non-ionic compound.

Claim 8

A process as defined in claim 6 wherein said ethoxylated nonionic compound is present in an aqueous solution having a pH between about 4 and about 11 and at a concentration between about 10 mg/l and about 50 g/l.

Claim 9

A process as defined in claim 7 wherein said ethoxylated non-ionic compound comprises an alkylphenoxypolyglycidol.

Claim 10

A process as defined in claim 1, wherein the adsorption promoter comprises said nitrogen-containing compound.

Claim 11

A process as defined in claim 9 wherein said nitrogen-containing compound is present in an aqueous solution at an acidic pH and at a concentration between about 10 mg/l and about 10 g/l.

Claim 12

A process as defined in claim 10, wherein the adsorption promoter is selected from quaternary ammonium and pyridinium compound(s).

Claim 13

A process as defined in claim 9, wherein the adsorption promoter is selected from amine oxides.

Claim 14

A process as defined in claim 9, wherein the adsorption promoter is selected from the alkanolamines.

Claim 15

A process as defined in claim 13, wherein the alkanolamine comprises ethanolamine, the ethanolamine being present in an aqueous solution with an acidic pH.

Claim 16

A process as defined in claim 9, wherein the adsorption promoter is selected from amides.

Claim 17

A process as defined in claim 9, wherein the adsorption promoter is selected from the amino acids and guanadine derivatives.

Claim 18

A process as defined in claim 9, wherein the adsorption promoter is a betaine.

Claim 19

A process as defined in claim 15, wherein the betaine comprises a tallow betaine surfactant, the tallow betaine surfactant being present in an aqueous solution with an acidic pH.

Claim 20

A process as defined in claim 9, wherein a first metal layer is electrolessly formed and said layer is further plated up with one or more metals employing electroless or electroplating methods.

Claim 21

A process as defined in claim 1, wherein the alkali metal compound is heated above 150° C.

Claim 22

A process as defined in claim 1, wherein the alkali metal compound is heated above 300° C.

Claim 23

A process as defined in claim 1, wherein the alkali metal compound is heated between about 300° C. and about 600° C.

Claim 24

A process for making a printed circuit on a ceramic substrate comprising: (a) treating the ceramic surface with a melt comprising one or more alkali metal compounds to adhesion promote or etch the surface; (b) exposing the surface to a adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of catalyst on the surface and eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof; (c) treating the ceramic surface exposed to the adsorption promoter with a catalyst for electroless metal deposition; (d) depositing metal onto the catalyzed surface; (e) removing portions of the deposited metal to produce a metal printed circuit conductor pattern adhering to the surface of the ceramic substrate.

Claim 25

A process for making a printed circuit on a ceramic substrate comprising: (a) treating the ceramic surface with a melt comprising one or more alkali metal compounds to adhesion promote or etch the surface; (b) exposing the surface to a adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of catalyst on the surface and eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof; (c) treating the ceramic surface exposed to the adsorption promoter with a catalyst for electroless metal deposition; (d) depositing metal onto the catalyzed surface; (e) removing portions of the deposited metal to produce a metal printed circuit conductor pattern adhering to the surface of the ceramic substrate.

Claim 26

A process as defined in claim 23, wherein the substrate is exposed to the adsorption promoter prior to catalyzing with a catalyst for electroless metal deposition.

Claim 27

A process as defined in claim 23, wherein metal is deposited by electroplating.

Claim 28

A process as defined in claim 23, wherein portions of the deposited metal are removed by etching.

Claim 29

A process as defined in claim 23, wherein the printed circuit comprises plated holes with metal plated walls.

Claim 30

A process of making a printed circuit on a ceramic substrate comprising: (a) exposing the surface of the ceramic substate to one or more molten alkali metal compound(s) to roughen or adhesion promote the surface; (b) exposing the surface to a adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of a catalyst for electroless metal deposition and eliminate bare spots in an adherent metal layer formed on selected parts of the surface; (c) catalyzing the surface with a catalyst for electroless metal deposition; (d) applying a resist image on the catalyzed surface leaving exposed a printed circuit conductor pattern; and (e) electrolessly depositing metal on the exposed parts of the catalyzed surface to form an adherent metal printed circuit conductor pattern on the substrate.

Claim 31

A process of making a printed circuit on a ceramic substrate comprising: (a) exposing the surface of the ceramic substate to one or more molten alkali metal compound(s) to roughen or adhesion promote the surface; (b) exposing the surface to a adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of a catalyst for electroless metal deposition and eliminate bare spots in an adherent metal layer formed on selected parts of the surface; (c) catalyzing the surface with a catalyst for electroless metal deposition; (d) applying a resist image on the catalyzed surface leaving exposed a printed circuit conductor pattern; and (e) electrolessly depositing metal on the exposed parts of the catalyzed surface to form an adherent metal printed circuit conductor pattern on the substrate.

Claim 32

A process as defined in claim 26 wherein catalyzing the surface includes applying a stannous ion sensitizer and a noble metal ion activator on the surface.

Claim 33

A process for producing a metallized conductor pattern on a ceramic substrate comprising: contacting a surface of said substrate with a melt comprised of one or more alkali metal compounds for a time period sufficient to etch said surface; rinsing said surface with an aqueous solution; neutralizing said surface with an acid; repeating said rinsing step; contacting said surface with a adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of an activator solution, and eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof; contacting said surface with an activator solution which provides a noble metal catalyst, in the presence of said adsorption promoter, to render said surface receptive to electroless deposition of a metal; and contacting said surface or selected parts thereof with a metal depositing solution for a time period sufficient to form a metal layer thereon.

Claim 34

A process for producing a metallized conductor pattern on a ceramic substrate comprising: contacting a surface of said substrate with a melt comprised of one or more alkali metal compounds for a time period sufficient to etch said surface; rinsing said surface with an aqueous solution; neutralizing said surface with an acid; repeating said rinsing step; contacting said surface with a adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of an activator solution, and eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof; contacting said surface with an activator solution which provides a noble metal catalyst, in the presence of said adsorption promoter, to render said surface receptive to electroless deposition of a metal; and contacting said surface or selected parts thereof with a metal depositing solution for a time period sufficient to form a metal layer thereon.

Claim 35

In a process for metallizing ceramic substrates which includes treating the surface to adherently receive a metal, and depositing metal on the treated surface, the improvement which comprises: treating the surface with a melt comprising one or more alkali metal compounds to adhesion promote or etch the surface; providing the surface with a conductive connector area for cathodic connection in subsequent electroplating; exposing said surface to an adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of metal ions selected from Group Ib and Group VIII of the Periodic Table of Elements and eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof; treating said surface with a solution comprising a metal selected from Group Ib and Group VIII of the Periodic Table of Elements to deposit metallic sites on the surface; connecting said connectors area to the cathode pole of a power supply; contacting the surface with a solution for electroplating a second metal, said solution being in contact with the anode of the power supply; and electroplating the second metal on the surface to form a complete layer of said second metal on said surface or selected parts thereof.

Claim 36

In a process for metallizing ceramic substrates which includes treating the surface to adherently receive a metal, and depositing metal on the treated surface, the improvement which comprises: treating the surface with a melt comprising one or more alkali metal compounds to adhesion promote or etch the surface; providing the surface with a conductive connector area for cathodic connection in subsequent electroplating; exposing said surface to an adsorption promoter selected from the group consisting of ethoxylated non-ionic compounds and nitrogen-containing compounds, the nitrogen-containing compounds being selected from the group consisting of quaternary compounds, amine oxides, alkanolamines, amides, betaines, amino acids and guanadine derivatives, in an amount sufficient to, and at a pH which will promote adsorption of metal ions selected from Group Ib and Group VIII of the Periodic Table of Elements and eliminate bare spots in an adherent metal layer formed on the surface or selected parts thereof; treating said surface with a solution comprising a metal selected from Group Ib and Group VIII of the Periodic Table of Elements to deposit metallic sites on the surface; connecting said connectors area to the cathode pole of a power supply; contacting the surface with a solution for electroplating a second metal, said solution being in contact with the anode of the power supply; and electroplating the second metal on the surface to form a complete layer of said second metal on said surface or selected parts thereof.