US4562121A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Soldering foil for stress-free joining of ceramic bodies to metal
Assignee: Daimler Benz AG
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Filing: 1984-12-14
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Granted: 1985-12-31
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Expires: 2004-12-14
Abstract
Abstract A soldering foil having a multi-layer structure for the stress-free joining of ceramic bodies to metal is described along with a process for making the foil. The soldering foil contains two layers of an active solder, particularly a Cu/Ti solder, provided with an intermediate cushion layer, preferably of copper, which absorbs the stresses. Between the copper cushion layer and the active solder layers barrier layers of silver are arranged which are very thin in relation to the copper and solder layers. The soldering foil permits a low-stress and extremely durable connection to be established between metal and ceramic, simultaneously permitting relatively large deviations in the temperature and time parameters of the soldering process.
Inventors
- 👤 Karl-Heinz Thiemann
- 👤 Hans-Juergen Weinert
- 👤 Wilfried Rauchle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:28
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/001; B23K35/22; B23K35/24; B23K35/30; B23K35/302; C; C04; C04B; C04B37/00; C04B37/02; C04B37/023; C04B37/026; C04B2235/00; C04B2235/65; C04B2235/656; C04B2235/6565; C04B2237/00; C04B2237/02; C04B2237/12; C04B2237/123; C04B2237/124; C04B2237/125; C04B2237/126; C04B2237/127; C04B2237/30; C04B2237/32; C04B2237/40; C04B2237/405; C04B2237/406; C04B2237/50; C04B2237/70; C04B2237/708; C04B2237/72; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12882; Y10T428/12896
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
52 words
A soldering foil comprising: a cushion layer of a material selected from the group consisting of copper, iron, nickel, a copper-beryllium alloy, a nickel-iron alloy and low carbon steel, a silver barrier layer adjacent each side of said central cushion layer, and an active solder layer adjacent each said silver barrier layer.
Claim 2
Dependent Claim
52 words
A soldering foil comprising: a cushion layer of a material selected from the group consisting of copper, iron, nickel, a copper-beryllium alloy, a nickel-iron alloy and low carbon steel, a silver barrier layer adjacent each side of said central cushion layer, and an active solder layer adjacent each said silver barrier layer.
Claim 3
Dependent Claim
14 words
A soldering foil according to claim 1, wherein said active solder layer contains titanium.
Claim 4
Dependent Claim
14 words
A soldering foil according to claim 2, wherein said active solder layer contains copper.
Claim 5
Dependent Claim
23 words
A soldering foil according to claim 3, wherein said active solder layer has a titanium content of from 20 to 43% by weight.
Claim 6
Dependent Claim
23 words
A soldering foil according to claim 3, wherein said active solder layer has a titanium content of from 22 to 28% of weight.
Claim 7
Dependent Claim
20 words
A soldering foil according to claim 1, wherein said cushion layer has a thickness of about 50 to 300 μm
Claim 8
Dependent Claim
21 words
A soldering foil according to claim 6, wherein said active solder layer has a thickness of about 30 to 80 μm.
Claim 9
Dependent Claim
20 words
A soldering foil according to claim 7, wherein said barrier layer has a thickness of about 2 to 10 μm.
Claim 10
Dependent Claim
32 words
A soldering foil comprising: a cushion layer containing copper, a silver barrier layer adjacent each side of said central cushion layer, and an active solder layer adjacent each said silver barrier layer.
Claim 11
Dependent Claim
32 words
A soldering foil comprising: a cushion layer containing copper, a silver barrier layer adjacent each side of said central cushion layer, and an active solder layer adjacent each said silver barrier layer.
Claim 12
Dependent Claim
14 words
A soldering foil according to claim 9, wherein said active solder layer contains titanium.
Claim 13
Dependent Claim
14 words
A soldering foil according to claim 10, wherein said active solder layer contains copper.
Claim 14
Dependent Claim
46 words
A soldering soil according to claim 10, wherein said active solder layer has a thickness of 30 to 80 μm, said cushion layer has a thickness of from 50 to 300 μm and said silver barrier layer has a thickness of from 2 to 10 μm.
Claim 15
Dependent Claim
18 words
A soldering foil according to claim 2, wherein said barrier layer is electrolytically deposited on said cushion layer.
Claim 16
Dependent Claim
47 words
A process for making a soldering foil comprising: depositing a layer of silver onto each side of a foil layer selected from the group consisting of copper, iron, nickel, copper-beryllium alloy and nickel-iron alloy, and depositing a layer of titanium alloy onto each said layer of silver.
Claim 17
Dependent Claim
47 words
A process for making a soldering foil comprising: depositing a layer of silver onto each side of a foil layer selected from the group consisting of copper, iron, nickel, copper-beryllium alloy and nickel-iron alloy, and depositing a layer of titanium alloy onto each said layer of silver.
Claim 18
Dependent Claim
15 words
A process according to claim 14, wherein each said layer of silver is electrolytically deposited.
Claim 19
Dependent Claim
21 words
A process according to claim 15, wherein each said layer of titanium alloy is deposited by melt-extrusion of said titanium alloy.
Claim 20
Dependent Claim
18 words
A process according to claim 16, wherein said titanium alloy contains about 20 to 43% titanium by weight.
Claim 21
Dependent Claim
19 words
A process according to claim 17, wherein said foil layer has a thickness of about 50 to 300 μm.
Claim 22
Dependent Claim
19 words
A process according to claim 14, wherein each said layer of silver is between 2 and 10 μm thick.
Claim 23
Dependent Claim
19 words
A process according to claim 16, wherein said layer of titanium alloy is between 30 and 80 μm thick.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-12-30 | 1989-07-01 | 1989-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-12-30 | 1993-07-01 | 1993-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-12-30 | 1997-07-01 | 1997-12-31 | $7700.00 | Window Closed / Lapsed |