Escapsulated chip capacitor assemblies

Claim 1

An encapsulated chip capacitor comprising (a) a tantalum body of generally rectangular cross-section having front, rear, bottom, top and side surfaces with portions of said bottom and side surfaces being provided with a cathode metallization, (b) an axial tantalum lead wire extending from said front surface, (c) encapsulated insulating material substantially conformally molded around said tantalum body covering said front, top rear and side surfaces, of said body, and said bottom surface of said body except for a relatively small region thereof spaced from the respective side surfaces of said body whereby a slot is provided in said encapsulant communicating with and exposing a portion of said cathode metallization in said tantalum body, (d) a copper metallization on a portion of the encapsulant covering the bottom surface and adjacent rear surface of said tantalum body and in said slot and on the cathode metallization of the tantalum body exposed by said slot to provide a cathode terminal, (e) a thin metal strip abutting the encapsulant covering the front surface of said capacitor body having a width which is coextensive with a portion of said axial tantalum lead wire extending from said encapsulant and being welded thereto to provide an anode terminal.