US4558171A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetic enclosure for electronic components with an optionally transparent cover and a method of making the same
Assignee: General Electric Co
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Filing: 1984-10-12
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Granted: 1985-12-10
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Expires: 2004-10-12
Abstract
Abstract The present invention deals with an improved hermetic enclosure impervious to moisture, suitable for single or multiple chips. The enclosure is sealable at a low temperature safe for the enclosed electronic components. In particular, the enclosure employs matching direct bond copper surfaces on the substrate and on the cover which may be sealed together with solder. The cover is of a high temperature material which may be transparent. Transparent materials such as fused quartz, or garnet, or sapphire are suitable. The enclosure is economical at both small sizes and relatively large sizes; and the transparent cover material permits for optical signalling into the package.
Inventors
- 👤 Francis C. Gantley
- 👤 Jack Chervenic
- 👤 David J. Suconick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 17:51
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; Y; Y10; Y10S; Y10S174/00; Y10S174/35; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
149 words
A hermetic enclosure permitting safe low temperature enclosure of electronic components comprising: A. a substrate for supporting one or more electronic components having a layer of non-porous insulating material capable of withstanding thick film processing and glass sealing temperatures; B. a frame for surrounding substrate-supported electronic components, of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature, having its under surface sealed to said substrate and a copper layer bonded on its upper surface; C. a cover for completing the enclosure of said substrate-supported electronic components, of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature, and having a copper layer bonded thereto in a configuration matching said layer on said frame; and D. a solder joint attaching said copper layer on said cover to said copper layer on said frame to permit completion of said enclosure at a low temperature safe for said components.
Claim 2
Dependent Claim
149 words
A hermetic enclosure permitting safe low temperature enclosure of electronic components comprising: A. a substrate for supporting one or more electronic components having a layer of non-porous insulating material capable of withstanding thick film processing and glass sealing temperatures; B. a frame for surrounding substrate-supported electronic components, of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature, having its under surface sealed to said substrate and a copper layer bonded on its upper surface; C. a cover for completing the enclosure of said substrate-supported electronic components, of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature, and having a copper layer bonded thereto in a configuration matching said layer on said frame; and D. a solder joint attaching said copper layer on said cover to said copper layer on said frame to permit completion of said enclosure at a low temperature safe for said components.
Claim 3
Dependent Claim
20 words
The enclosure set forth in claim 1 wherein: said frame is sealed to said substrate layer by a glass seal.
Claim 4
Dependent Claim
54 words
The enclosure set forth in claim 1 wherein; conduction runs are applied by a thick film process over said substrate layer for a safe low temperature connection to said electronic components, said frame being sealed to said substrate over said conduction runs, and to exposed portions of said substrate layer by a glass seal.
Claim 5
Dependent Claim
29 words
The enclosure set forth in claim 3 wherein; the composition of said substrate layer is alumina (Al 2 O 3 ), beryllia (Be 0), or aluminum nitride (Al N).
Claim 6
Dependent Claim
15 words
The enclosure set forth in claim 3 wherein; said cover is of a transparent material.
Claim 7
Dependent Claim
28 words
The enclosure set forth in claim 3 wherein; said material of said cover is silicon oxide (Si O 2 ) or aluminum oxide (Al 2 O 3 ).
Claim 8
Dependent Claim
18 words
The enclosure set forth in claim 3 wherein; said substrate layer, said frame, and said cover are alumina.
Claim 9
Dependent Claim
19 words
The enclosure set forth in claim 3 wherein; the material of said cover is alumina, beryllia, quartz or sapphire.
Claim 10
Independent Claim
228 words
A method of hermetically enclosing electronic components at safe low temperatures comprising the steps of: A. (1) providing a substrate for supporting one or more electronic components comprising a layer of high temperature insulating material suitable for providing thick film conduction runs, and (2) providing said conduction runs on said layer for subsequent connection to the terminals of said components by a low temperature connection process safe for said components; B. (1) providing a frame for surrounding substrate-supported electronic components, said frame being of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature, said frame having a copper layer bonded to its outer surface, and (2) attaching said frame by its inner surface to said conduction runs and the exposed surfaces of said substrate layer; C. placing said components on said substrate within said frame, and connecting the terminals thereof to said conduction runs by a safe low temperature process; and D. (1) providing a cover for completing the enclosure of said substrate-supported electronic components of a high temperature insulating material capable of withstanding the copper-oxygen eutectic temperature, having a copper layer bonded thereto having a configuration matched to the upper surface of said frame, and (2) soldering said copper layer on said cover to said copper layer on said frame to complete the enclosure of said components at a low temperature safe for said components.
Claim 11
Independent Claim
228 words
A method of hermetically enclosing electronic components at safe low temperatures comprising the steps of: A. (1) providing a substrate for supporting one or more electronic components comprising a layer of high temperature insulating material suitable for providing thick film conduction runs, and (2) providing said conduction runs on said layer for subsequent connection to the terminals of said components by a low temperature connection process safe for said components; B. (1) providing a frame for surrounding substrate-supported electronic components, said frame being of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature, said frame having a copper layer bonded to its outer surface, and (2) attaching said frame by its inner surface to said conduction runs and the exposed surfaces of said substrate layer; C. placing said components on said substrate within said frame, and connecting the terminals thereof to said conduction runs by a safe low temperature process; and D. (1) providing a cover for completing the enclosure of said substrate-supported electronic components of a high temperature insulating material capable of withstanding the copper-oxygen eutectic temperature, having a copper layer bonded thereto having a configuration matched to the upper surface of said frame, and (2) soldering said copper layer on said cover to said copper layer on said frame to complete the enclosure of said components at a low temperature safe for said components.
Claim 12
Dependent Claim
136 words
A hermetic enclosure permitting safe low temperature enclosure of electronic components comprising: A. a recessed substrate for enclosing one or more electronic components and supporting conductive runs, including runs accessible outside said recess, permitting safe low temperature electrical connection to enclosed electronic components; said substrate being of a non-porous insulating material, capable of withstanding the copper-oxide eutectic temperature, and a copper layer bonded on the perimeter of said recess; B. a cover for closing said recess of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature having a copper layer bonded thereto in a configuration matching said layer on said perimeter; and C. a solder joint attaching said copper layer on said cover to said copper layer on said substrate to permit completion of said enclosure at a low temperature safe for said components.
Claim 13
Dependent Claim
136 words
A hermetic enclosure permitting safe low temperature enclosure of electronic components comprising: A. a recessed substrate for enclosing one or more electronic components and supporting conductive runs, including runs accessible outside said recess, permitting safe low temperature electrical connection to enclosed electronic components; said substrate being of a non-porous insulating material, capable of withstanding the copper-oxide eutectic temperature, and a copper layer bonded on the perimeter of said recess; B. a cover for closing said recess of a non-porous insulating material capable of withstanding the copper-oxygen eutectic temperature having a copper layer bonded thereto in a configuration matching said layer on said perimeter; and C. a solder joint attaching said copper layer on said cover to said copper layer on said substrate to permit completion of said enclosure at a low temperature safe for said components.
Claim 14
Dependent Claim
15 words
The enclosure set forth in claim 10 wherein; said cover is of a transparent material.
Claim 15
Dependent Claim
28 words
The enclosure set forth in claim 11 wherein the composition of said cover is silicon oxide (Si O 2 ) or aluminum oxide (Al 2 O 3 ).
References Cited (Backward Citations)
US4262165A
Cited
US4322778A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-12-09 | 1989-06-10 | 1989-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-12-09 | 1993-06-10 | 1993-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-12-09 | 1997-06-10 | 1997-12-10 | $7700.00 | Window Closed / Lapsed |