US4557946A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Moisture impermeability or organosilicone films
Assignee: POLYPLASMA Inc A CORP OF CANADA
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Filing: 1983-06-03
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Granted: 1985-12-10
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Expires: 2003-06-03
Abstract
Abstract The invention comprises a method of controlling the water permeability of a coating applied to a substrate, in particular for the case of organosilicone coatings.
Inventors
- 👤 Edward Sacher
- 👤 Michael R. Wertheimer
- 👤 Henry P. Schreiber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 20:23
CPC Classifications
B; B05; B05D; B05D1/00; B05D1/62; C; C09; C09D; C09D4/00
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
110 words
A method of forming a protective film having a controlled moisture permeability on a substrate, said protective film comprising a plasma polymerized organosilicone material having an inorganic component, the proportion of said inorganic component in said film determining its moisture permeability, said method comprising: (a) providing a substrate to be protected; (b) heating said substrate to a temperature of between 25° and 1000° C.; (c) plasma polymerizing an organosilicone film on said substrate; and (d) controlling the power level of the plasma in step (c) to between 0.1 and 10 watts per cubic centimeter, the power level and the substrate temperature determining the proportion of inorganic component in said film.
Claim 2
Independent Claim
110 words
A method of forming a protective film having a controlled moisture permeability on a substrate, said protective film comprising a plasma polymerized organosilicone material having an inorganic component, the proportion of said inorganic component in said film determining its moisture permeability, said method comprising: (a) providing a substrate to be protected; (b) heating said substrate to a temperature of between 25° and 1000° C.; (c) plasma polymerizing an organosilicone film on said substrate; and (d) controlling the power level of the plasma in step (c) to between 0.1 and 10 watts per cubic centimeter, the power level and the substrate temperature determining the proportion of inorganic component in said film.
Claim 3
Dependent Claim
30 words
The method of claim 1, wherein said substrate is heated to a temperature of between 400° C. and 1000° C. and plasma polymerizing the organosilicone film in a glow discharge.
Claim 4
Dependent Claim
12 words
The method of claim 1, wherein said plasma polymerized film is hexamethyldisiloxane.
Claim 5
Dependent Claim
19 words
The method of claim 3, wherein said film is formed to have a thickness of less than 5000 Å.
Claim 6
Dependent Claim
16 words
The method of claim 1, wherein said organosilicone film is plasma polymerized in a microwave discharge.
Claim 7
Dependent Claim
56 words
The method of claim 1, wherein the step of plasma polymerizing the organosilicone film comprises the step of plasmapolymerizing the film utilizing an organisilicone monomer having a vapour pressure in excess of 0.01 of a Torr at a substrate temperature of between 400° C. and 1000° C. to have a thickness of less than 5000 Å.
Claim 8
Dependent Claim
19 words
The method of claim 6, wherein the organosilicone film is hexamethyldisiloxane and is plasma polymerized in a glow discharge.
References Cited (Backward Citations)
US3518108A
Cited
US3822298A
Cited
US4137365A
Cited
JPS538669A
Cited
US4242188A
Cited
US4260647A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-12-09 | 1989-06-10 | 1989-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-12-09 | 1993-06-10 | 1993-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-12-09 | 1997-06-10 | 1997-12-10 | $7700.00 | Window Closed / Lapsed |