US4557807A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Static free molded plastic parts
Assignee: Battelle Memorial Institute Inc
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Filing: 1985-01-11
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Granted: 1985-12-10
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Expires: 2005-01-11
Abstract
Abstract A novel in-mold electrodeposition process is disclosed for the production of plastic parts having conductive polymeric coatings such as polypyrroles or polythiophenes. Parts produced according to the novel disclosed in-mold electrodeposition process would have wide applicability including static free plastic parts shielding devices and circuits. The disclosed process advances the art by enabling the utilization of conductive polymers many of which were heretofore considered too brittle for commercial adaptation.
Inventors
- 👤 Joseph R. Preston
- 👤 Louis J. Hillenbrand
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:00
CPC Classifications
C; C25; C25D; C25D1/00; C25D1/20; B; B29; B29C; B29C41/00; B29C41/006; C08; C08G; C08G61/00; C08G61/12; C08G61/122; C08G61/123; H; H01; H01M; H01M4/00; H01M4/02; H01M4/36; H01M4/60; B29K; B29K2025/00; B29K2055/00; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K3/00; H05K3/0011; H05K3/0014; H05K3/10; H05K3/20; Y; Y02; Y02E; Y02E60/00; Y02E60/10
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
124 words
An in-the-mold method for forming molded plastic parts having a conductive coating comprising: providing a mold cavity defined by a mold member having a catalytic surface connecting the mold member as an electrode to a current source electrodepositing a conductive polymer onto the catalytic surface of the mold member to form a conductive film introducing into the mold cavity a viscoelastic molding material compressing the molding material within the molding cavity so as to achieve greater adherence of the conductive film to the molding material than the adherence of the conductive film to the catalytic surface of the mold member solidifying and/or curing the viscoelastic molding material to form a molded part releasing the molded part with adhering conductive film from the mold cavity.
Claim 2
Dependent Claim
124 words
An in-the-mold method for forming molded plastic parts having a conductive coating comprising: providing a mold cavity defined by a mold member having a catalytic surface connecting the mold member as an electrode to a current source electrodepositing a conductive polymer onto the catalytic surface of the mold member to form a conductive film introducing into the mold cavity a viscoelastic molding material compressing the molding material within the molding cavity so as to achieve greater adherence of the conductive film to the molding material than the adherence of the conductive film to the catalytic surface of the mold member solidifying and/or curing the viscoelastic molding material to form a molded part releasing the molded part with adhering conductive film from the mold cavity.
Claim 3
Dependent Claim
21 words
The process according to claim 1 wherein said conductive polymer is selected from the group consisting of photochromic or electrochromic polymers.
Claim 4
Dependent Claim
13 words
The process according to claim 1 wherein said conductive polymer is a semi-conductor.
Claim 5
Dependent Claim
37 words
The process according to claim 1 wherein said electrodeposited conductive film is comprised of one or more polymers selected from the group consisting of polythiophene, B-substituted polythiophene, polypyrrole, N-substituted polypyrrole, N-alkyl-polypyrrole, poly(B,B'-dimethylpyrrole)polyacetylene, polyaromatic compounds, and dehydrohalogenated PVC.
Claim 6
Dependent Claim
12 words
The process according to claim 4 wherein said film includes a dopant.
Claim 7
Dependent Claim
44 words
The process according to claim 5 wherein said dopant is selected from the group consisting of rare earth salts, LiBF 4 , iron phthalocyanine, As flouride, Ag halides, Sb flouride, CF 3 SO 3 - , ruthenium oxide, and C 2 H 2 .
Claim 8
Dependent Claim
52 words
The process according to claim 1 wherein the electrodeposited conductive film is formed from the polymerization of monomers selected from the group consisting of thiophene, 2,2'-bithiophene, 3-methylthiophene, 3-bromothiophene, 3-thiopheneacetonitrile, 3,4-dibromothiophene, pyrrole, pyrrole doped with CF 3 SO 3 - , 3-methyl pyrrole, acetylene doped with As or Sb salts, and dehydrohalogenated PVC.
Claim 9
Dependent Claim
21 words
The process according to claim 1 wherein said mold is selected from the group consisting of compression, transfer, injection, or injection-compression.
Claim 10
Dependent Claim
23 words
The process according to claim 1 wherein the viscoelastic molding material is selected from the group consisting of thermoplastic and thermosetting molding materials.
Claim 11
Dependent Claim
50 words
The process according to claim 9 wherein the molding material is selected from the group consisting of polyalkene, polyethylene, polypropylene, polyamide, polyimide, polyester, alkyl ester, polyether-ester copolymer, polystyrene, acetonitrile-butadiene-styrene, allyl ester, polystyrene block copolymer, polyurethane, polycarbonate, polyacrylate, polymethacrylate, polyolefin, nitrile resin, epoxy, polysulfone, polyalkeneterephthalate, polyalkylalkene polyphenylene, phenolic, melamine and alkyd.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-12-09 | 1989-06-10 | 1989-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-12-09 | 1993-06-10 | 1993-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-12-09 | 1997-06-10 | 1997-12-10 | $7700.00 | Window Closed / Lapsed |