US4554183A
Expired / Lapsed
US
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Process for pretreating polyamide substrates for electroless metallization
Assignee: Bayer AG
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Filing: 1984-10-29
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Granted: 1985-11-19
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Expires: 2004-10-29
Abstract
Abstract A mild activation process for the electroless metallization of polyamide mouldings comprises treating the mouldings with a solution of a mixture of halides of elements of the 1st and 2nd main group of the Periodic Table (for example CaCl 2 ) with salts of weak inorganic bases and strong inorganic acids (for example AlCl 3 ) in a swelling agent or solvent for polyamides and with a metal-organic complex compound of elements of the 1st or 8th sub-group of the Periodic Table. The sequence is here immaterial.
Inventors
- 👤 Kirkor Sirinyan
- 👤 Gerhard D. Wolf
- 👤 Rudolf Merten
- 👤 Ulrich VON Gizycki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 03:51
CPC Classifications
C; C08; C08J; C08J7/00; C08J7/12; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; C08J2377/00; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/38; H05K3/381
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
83 words
Process for pretreating substrate surfaces of polyamide mouldings for the electroless metallisation, characterised in that the substrates are treated, in any desired sequence, with (a) a solution of a mixture of halides of elements of the 1st and 2nd main groups of the Periodic Table with salts of weak inorganic bases and strong inorganic acids in a non-etching organic swelling agent or solvent for polyamides and (b) a metal-organic complex compound of elements of the 1st and/or 8th sub-group of the Periodic Table.
Claim 2
Dependent Claim
83 words
Process for pretreating substrate surfaces of polyamide mouldings for the electroless metallisation, characterised in that the substrates are treated, in any desired sequence, with (a) a solution of a mixture of halides of elements of the 1st and 2nd main groups of the Periodic Table with salts of weak inorganic bases and strong inorganic acids in a non-etching organic swelling agent or solvent for polyamides and (b) a metal-organic complex compound of elements of the 1st and/or 8th sub-group of the Periodic Table.
Claim 3
Dependent Claim
31 words
Process according to claim 1, characterised in that the substrates are first treated with an activator solution containing the metal-organic complex compounds and then with the solution of the salt mixture.
Claim 4
Dependent Claim
19 words
Process according to claim 1, characterised in that the substrates thus treated are introduced directly into the metallising baths.
Claim 5
Dependent Claim
40 words
Process according to claim 1, characterised in that a mixture of LiCl, BeCl 2 , MgCl 2 or CaCl 2 with FeCl 2 , FeCl 3 , TiCl 3 , TiCl 4 , BCl 3 or AlCl 3 is used.
Claim 6
Dependent Claim
18 words
Process according to claim 1, characterised in that a mixture of CaCl 2 and AlCl 3 is used.
Claim 7
Dependent Claim
22 words
Process according to claim 1, characterised in that the salt mixture is used in a solution in lower aliphatic or araliphatic alcohols.
Claim 8
Dependent Claim
24 words
Process according to claim 1, characterised in that the pretreatment is carried out with a solution of CaCl 2 and AlCl 3 in methanol.
Claim 9
Dependent Claim
21 words
Process according to claim 1, characterised in that the complex compound used is a palladium-II complex of 1,3-dienes or α,β-unsaturated ketones.
Claim 10
Dependent Claim
56 words
Process according to claim 1, characterised in that the complex compound used is an olefine complex of palladium-II, the ligands of which contain, in addition to the groups required for the metal bond, at least one further functional group, such as, for example, --COOH, --COCl, --COF, --COBr, --CO--O--CO--, --CONH 2 , COO-alkyl, --CO--NH--CO, --CO-- and --NHCO--.
Claim 11
Dependent Claim
22 words
Process according to claim 1, characterised in that the pretreated substrates are treated in a reducing bath containing aminoborane, hydrazine or formalin.
References Cited (Backward Citations)
EP0081129A1
Cited
US4493861A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-11-18 | 1989-05-20 | 1989-11-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-11-18 | 1993-05-20 | 1993-11-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-11-18 | 1997-05-20 | 1997-11-19 | $7700.00 | Window Closed / Lapsed |