High density planar interconnected integrated circuit package

Claim 2

A module to planar board interconnection system for mitigating solder joint failure, comprising; an integrated circuit module having circuit pads on one surface thereof; a printed circuit board having circuit pads on one surface thereof; a housing for said integrated circuit module; means for loading and retaining said module and said housing onto said circuit board; and a plurality of spring contacts, each of said contacts having a U-shapelike configuration, said configuration having an upper end portion adapted to make contact with a circuit pad of said integrated circuit module, and a bottom end portion surface bonded by a solder joint to a circuit pad of said printed circuit board, said spring contacts and said means coacting to place each aforesaid solder joint under compression when said module is loaded and retained by said means whereby solder joint failure is mitigated.

Claim 3

A module to planar board interconnection system for mitigating solder joint failure, comprising; an integrated circuit module having circuit pads on one surface thereof; a printed circuit board having circuit pads on one surface thereof; a housing for said integrated circuit module; a board stiffener fastened to said printed circuit board; means for pivotally connecting said module housing to said circuit board stiffener and loading the module and housing onto said circuit board; and a plurality of spring contacts, each of said contacts having a U-shapelike configuration, said configuration having an upper end portion adapted to make contact with a circuit pad of said integrated circuit module, and a bottom end portion surface bonded by a solder joint to a circuit pad of said printed circuit board, said spring contacts and said means coacting to place each aforesaid solder joint under compression when said module is loaded by said means, whereby solder joint failure is mitigated.

Claim 4

A module to planar board interconnection system for mitigating solder joint failure, comprising; an integrated circuit module having circuit pads on one surface thereof; a printed circuit board having circuit pads on one surface thereof; a housing for said integrated circuit module; a board stiffener fastened to said printed circuit board; means for pivotally connecting said module housing to said circuit board stiffener and loading the module and housing onto said circuit board; and a plurality of spring contacts, each of said contacts having a U-shapelike configuration, said configuration having an upper end portion adapted to make contact with a circuit pad of said integrated circuit module, and a bottom end portion surface bonded by a solder joint to a circuit pad of said printed circuit board, said spring contacts and said means coacting to place each aforesaid solder joint under compression when said module is loaded by said means, whereby solder joint failure is mitigated.

Claim 5

A module to planar board interconnection system as set forth in claim 1 wherein during loading of the module onto the circuit board, said upper end portions of the spring contacts come into engagement with the circuit pads on the module with a wiping action.

Claim 6

A module to planar board interconnection system as set forth in claim 2 wherein said circuit board stiffener includes a flexible trigger latch for retaining the module housing and module in its loaded position on the circuit board.

Claim 7

The module to planar board interconnection system as set forth in claim 1 wherein an intermediate portion between said upper end portion and said bottom end portion of each of said contacts clears the printed circuitry on said printed circuit board.

Claim 8

The module to planar board interconnection system as set forth in claim 3 wherein each of said upper end portions of said contacts include a contact point, for effecting said wiping action.