Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
202 words
A high-density electrical contact pad pattern positioned along at least one edge of a flat surface of an electronic component for connecting with a zero-insertion-force type connector, said connector including contact pins having corresponding contact regions each region disposed to contact and wipe one of said contact pads in a direction substantially perpendicular with said at least one edge of said electronic component during the actuation sequence of said connector, said contact pad pattern comprising: a first row and a second row of electrically insulated contact pads, aligned substantially parallel with the edge of said flat surface, each one of said contact pads enclosing a substantially identical respective elliptical area of high probability of contact with a corresponding contact region, each contact pad oriented so that the major axis of the respective enclosed elliptical area is substantially parallel with the direction of wipe of the corresponding contact region; wherein said second row of contact pads is offset with respect to and interleaved with said first row of contact pads, and wherein each enclosed elliptical area is spaced apart from adjacent enclosed elliptical areas within the same row a distance less than the length of the minor axis of each said elliptical area.
Claim 2
Dependent Claim
202 words
A high-density electrical contact pad pattern positioned along at least one edge of a flat surface of an electronic component for connecting with a zero-insertion-force type connector, said connector including contact pins having corresponding contact regions each region disposed to contact and wipe one of said contact pads in a direction substantially perpendicular with said at least one edge of said electronic component during the actuation sequence of said connector, said contact pad pattern comprising: a first row and a second row of electrically insulated contact pads, aligned substantially parallel with the edge of said flat surface, each one of said contact pads enclosing a substantially identical respective elliptical area of high probability of contact with a corresponding contact region, each contact pad oriented so that the major axis of the respective enclosed elliptical area is substantially parallel with the direction of wipe of the corresponding contact region; wherein said second row of contact pads is offset with respect to and interleaved with said first row of contact pads, and wherein each enclosed elliptical area is spaced apart from adjacent enclosed elliptical areas within the same row a distance less than the length of the minor axis of each said elliptical area.
Claim 3
Dependent Claim
17 words
A contact pad pattern according to claim 1 wherein said electronic component is a printed circuit board.
Claim 4
Dependent Claim
50 words
A high-density electrical contact pad pattern as recited in claim 1 wherein the length of the major axis and minor axis of elliptical area are proportional to the sum of the vertical and horizontal mechanical tolerances, respectively, affecting the relative positions of a contact pad and a corresponding contact region.
Claim 5
Dependent Claim
200 words
A high-density electrical contact pad pattern positioned along at least one edge of a flat surface of an electronic component for connecting with a zero-insertion-force type connector, said connector including contact pins having corresponding contact regions each region disposed to contact and wipe one of said contact pads in a direction substantially perpendicular with said at least one edge of said electronic component during the actuation sequence of said connector, said contact pad pattern comprising: a plurality of rows of electrically insulated contact pads aligned substantially parallel with the edge of said flat surface, each one of said contact pads enclosing a substantially identical respective elliptical area of high probability of contact with a corresponding contact region, each contact pad oriented so that the major axis of the respective enclosed elliptical area is substantially parallel with the direction of wipe of the corresponding contact region; and wherein each row of contact pads is offset with respect to and interleaved with each immediately adjacent row of contact pads, and wherein each enclosed elliptical area is spaced apart from adjacent enclosed elliptical areas within the same row a distance less than the length of the miror axis of each said elliptical area.
Claim 6
Dependent Claim
200 words
A high-density electrical contact pad pattern positioned along at least one edge of a flat surface of an electronic component for connecting with a zero-insertion-force type connector, said connector including contact pins having corresponding contact regions each region disposed to contact and wipe one of said contact pads in a direction substantially perpendicular with said at least one edge of said electronic component during the actuation sequence of said connector, said contact pad pattern comprising: a plurality of rows of electrically insulated contact pads aligned substantially parallel with the edge of said flat surface, each one of said contact pads enclosing a substantially identical respective elliptical area of high probability of contact with a corresponding contact region, each contact pad oriented so that the major axis of the respective enclosed elliptical area is substantially parallel with the direction of wipe of the corresponding contact region; and wherein each row of contact pads is offset with respect to and interleaved with each immediately adjacent row of contact pads, and wherein each enclosed elliptical area is spaced apart from adjacent enclosed elliptical areas within the same row a distance less than the length of the miror axis of each said elliptical area.
Claim 7
Dependent Claim
17 words
A contact pad pattern according to claim 4 wherein said electronic component is a printed circuit board.
Claim 8
Dependent Claim
50 words
A high-density electrical contact pad pattern as recited in claim 4 wherein the length of the major axis and minor axis of elliptical area are proportional to the sum of the vertical and horizontal mechanical tolerances, respectively, affecting the relative positions of a contact pad and a corresponding contact region.