US4547652A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for the laser soldering of flexible wiring
Assignee: Siemens AG
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Filing: 1983-12-12
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Granted: 1985-10-15
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Expires: 2003-12-12
Abstract
Abstract A method for laser soldering of soldered connections of flexible wiring, which are provided at their contact points with a flux. The parts to be joined are held together by a clamp made of translucent material. The transmission of heat for the soldering process is provided by a non-contact laser beam. When the laser beam is applied the solder on both strip conductors melts. Upon removing the heat source the connection hardens to a solid solder joint.
Inventors
- 👤 Hermann Raisig
- 👤 Gregor Unger
- 👤 Oscar Wirbser
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:44
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; B; B23; B23K; B23K1/00; B23K1/005; B23K1/0056; H01; H01R; H01R43/00; H01R43/02; H01R43/0221; B23K2101/00; B23K2101/36; B23K2101/38; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0108; H05K2203/00; H05K2203/10; H05K2203/107; H05K3/30; H05K3/32; H05K3/34; H05K3/3494
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
99 words
A method for laser soldering of soldered connections of flexible wiring, wherein said method comprises the steps of: (a) arranging said wiring on a transparent carrying film; (b) providing said wiring at their respective contact points with a flux to promote thermal conduction therebetween; (c) holding said contact points together by a clamp of transparent material so that they may be joined, said contact points being arranged so that surfaces to be joined are in contact with each other; and (d) applying a non-contact heat source from a laser beam to said contact points to generate a solder connection.
Claim 2
Independent Claim
99 words
A method for laser soldering of soldered connections of flexible wiring, wherein said method comprises the steps of: (a) arranging said wiring on a transparent carrying film; (b) providing said wiring at their respective contact points with a flux to promote thermal conduction therebetween; (c) holding said contact points together by a clamp of transparent material so that they may be joined, said contact points being arranged so that surfaces to be joined are in contact with each other; and (d) applying a non-contact heat source from a laser beam to said contact points to generate a solder connection.
Claim 3
Dependent Claim
21 words
A process according to claim 1, wherein the step of applying includes generating said laser beam using a solid-state Nd:YAG laser.
Claim 4
Dependent Claim
16 words
A process according to claim 1, wherein the step of applying includes defocusing said laser beam.
Claim 5
Dependent Claim
23 words
A process according to claim 2, wherein the step of generating includes operating said solid-state Nd:YAG laser at a wavelength of 1.064μ meter.
Claim 6
Dependent Claim
29 words
A process according to claim 3, wherein the defocusing of said laser beam melts the transparent carrying film so it penetrates between said wiring to strengthen said solder connection.
References Cited (Backward Citations)
US3614832A
Cited
DE2735231A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-10-14 | 1989-04-15 | 1989-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-10-14 | 1993-04-15 | 1993-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-10-14 | 1997-04-15 | 1997-10-15 | $7700.00 | Window Closed / Lapsed |