US4544091A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Target bonding process
Assignee: Osram Sylvania Inc
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Filing: 1984-06-06
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Granted: 1985-10-01
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Expires: 2004-06-06
Abstract
Abstract A process for bonding one or more target parts, such as yttrium oxide target parts, to a copper backing plate to provide improved mechanical support and improved heat transfer. The process is one in which a noble metal, preferably platinum, is applied to the target to provide an oxide free layer to which indium/lead solder joins. The solder step is performed so that contamination by flux or by formation of an oxide is prevented.
Inventors
- 👤 Henry Hidler
- 👤 Ernest Davey
- 👤 Lawrence L. Hope
- 👤 Robert Shimer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 23:40
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/3407; B; B23; B23K; B23K20/00; B23K20/22; B23K20/233; Y; Y10; Y10S; Y10S228/00; Y10S228/903
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
196 words
A process for bonding a sputtering target to a heat conductive backing plate for subsequent use in a sputtering operation, said process comprising the steps of: applying a substantially oxide-free noble metal layer over one side of said sputtering target, said step of applying the noble metal layer comprising providing the noble metal in an organometallic paint, applying said paint to said sputtering target, heating said sputtering target to drive off organics and leave substantially only the noble metal as a layer covering at least a part of said sputtering target; applying a first solder layer to a specific area of said backing plate; removing traces of flux used in applying said first solder; maintaining said backing plate and said sputtering target in a dry atmosphere; applying a second solder layer over said noble metal layer on said sputtering target and maintaining said second solder layer soft; and heating said first solder layer on said backing plate and joining said first solder layer on said backing plate and said second solder layer on said sputtering target to form a combination solder and noble metal layer as a bond between said sputtering target and said backing plate.
Claim 2
Dependent Claim
196 words
A process for bonding a sputtering target to a heat conductive backing plate for subsequent use in a sputtering operation, said process comprising the steps of: applying a substantially oxide-free noble metal layer over one side of said sputtering target, said step of applying the noble metal layer comprising providing the noble metal in an organometallic paint, applying said paint to said sputtering target, heating said sputtering target to drive off organics and leave substantially only the noble metal as a layer covering at least a part of said sputtering target; applying a first solder layer to a specific area of said backing plate; removing traces of flux used in applying said first solder; maintaining said backing plate and said sputtering target in a dry atmosphere; applying a second solder layer over said noble metal layer on said sputtering target and maintaining said second solder layer soft; and heating said first solder layer on said backing plate and joining said first solder layer on said backing plate and said second solder layer on said sputtering target to form a combination solder and noble metal layer as a bond between said sputtering target and said backing plate.
Claim 3
Dependent Claim
32 words
A process as set forth in claim 1 wherein said heating step to drive off organics provides heating at on the order of 340° C. for on the order of five hours.
Claim 4
Dependent Claim
19 words
A process as set forth in claim 1 further including cooling said target after heating to drive off organics.
Claim 5
Dependent Claim
21 words
A process as set forth in claim 1 wherein said backing plate is cleaned prior to applying the solder layer thereto.
Claim 6
Dependent Claim
27 words
A process as set forth in claim 1 wherein said backing plate and said target are maintained in a dry atmosphere by means of a dry box.
Claim 7
Dependent Claim
44 words
A process as set forth in claim 5 including providing first and second hot plates in said dry box, said second hot plate for applying and maintaining said second solder layer on said target, and said first hot plate for heating said backing plate.
Claim 8
Dependent Claim
23 words
A process as set forth in claim 6 wherein said first hot plate heats to a temperature on the order of 220° C.
Claim 9
Dependent Claim
23 words
A process as set forth in claim 6 wherein said second hot plate heats to a temperature on the order of 220° C.
Claim 10
Dependent Claim
31 words
A process as set forth in claim 6 wherein a small amount of solder is added to said first solder layer on said backing plate as said backing plate is heated.
Claim 11
Dependent Claim
26 words
A process as set forth in claim 1 wherein weights are placed upon said sputtering target after said sputtering target is placed upon said backing plate.
Claim 12
Dependent Claim
16 words
A process as set forth in claim 1 wherein said oxide free noble metal is platinum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-09-30 | 1989-04-01 | 1989-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-09-30 | 1993-04-01 | 1993-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-09-30 | 1997-04-01 | 1997-10-01 | $7700.00 | Window Closed / Lapsed |