Reactive plastisol dispersion

Claim 2

A reactive plastisol dispersion composition comprising (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of either a thermal initiator or photoinitiator for group member plasticizers present in the composition.

Claim 3

The composition of claim 1 wherein (3) is a thermal initiator.

Claim 4

The composition of claim 1 wherein (3) is a photoinitiator.

Claim 5

The composition of claim 1 wherein (2) is (a) and (3) is a thermal initiator.

Claim 6

The composition of claim 1 wherein (2) is (b) and (3) is a thermal initiator.

Claim 7

The composition of claim 1 wherein (2) is (c) and (3) is a thermal initiator.

Claim 8

The process of forming a solidified homogeneous mass which comprises admixing a reactive plastisol dispersion composition comprising (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of a thermal initiator for group member plasticizers present in the composition; and, thereafter, heating the admixture for a time sufficient to flux the mass.

Claim 9

The process of forming a solidified homogeneous mass which comprises admixing a reactive plastisol dispersion composition comprising (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of a thermal initiator for group member plasticizers present in the composition; and, thereafter, heating the admixture for a time sufficient to flux the mass.

Claim 10

The process of claim 7 where in the composition, (2) is (a).

Claim 11

The process of claim 7 where in the composition, (2) is (b).

Claim 12

The process of claim 7 where in the composition, (2) is (c).

Claim 13

A composition comprising a reactive, solid, homogeneous, fluxed plastisol formed from (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of either a thermal initiator or photoinitiator for group member plasticizers present in the composition.

Claim 14

A composition comprising a reactive, solid, homogeneous, fluxed plastisol formed from (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of either a thermal initiator or photoinitiator for group member plasticizers present in the composition.

Claim 15

The composition of claim 11 wherein (3) is a thermal initiator.

Claim 16

The composition of claim 11 wherein (3) is a photoinitiator.

Claim 17

The composition of claim 11 wherein (2) is (a) and (3) is a thermal initiator.

Claim 18

The composition of claim 11 wherein (2) is (b) and (3) is a thermal initiator.

Claim 19

The composition of claim 11 wherein (2) is (c) and (3) is a thermal initiator.

Claim 20

The process of adhering two substrates which comprises applying therebetween a reactive plastisol dispersion composition comprising (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of a thermal initiator for group member plasticizers present in the composition; and, thereafter, heating said composition to a temperature in the range 100°-300° C. for a time sufficient to cause the adhesive to flux and become thermoset.

Claim 21

The process of adhering two substrates which comprises applying therebetween a reactive plastisol dispersion composition comprising (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of a thermal initiator for group member plasticizers present in the composition; and, thereafter, heating said composition to a temperature in the range 100°-300° C. for a time sufficient to cause the adhesive to flux and become thermoset.

Claim 22

The process of claim 17 where in the composition, (2) is (a).

Claim 23

The process of claim 17 where in the composition, (2) is (b).

Claim 24

The process of claim 17 where in the composition, (2) is (c).

Claim 25

The process of adhering two substrates at least one of which is transparent which comprises applying therebetween a reactive plastisol dispersion composition comprising (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of a photoinitiator for group member plasticizers present in the composition; heating said composition to a temperature in the range 100°-300° C. for a time sufficient to cause the adhesive to flux and, thereafter, exposing said composition to UV radiation to form a thermoset adhesive.

Claim 26

The process of adhering two substrates at least one of which is transparent which comprises applying therebetween a reactive plastisol dispersion composition comprising (1) at least one acrylonitrile-butadiene-styrene (ABS) copolymer in particle form having a particle size in the range from about 0.01 to about 1,500 microns; (2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer characterized by (1) containing at least one ethylenically unsaturated group and (2) capable of solvating the ABS copolymer at the fluxing temperature, and (c) a mixture of (a) and (b), said liquid reactive plasticizer being present in an amount ranging from 5 to 2,000 parts by weight; and (3) 0.01 to 10% by weight of a photoinitiator for group member plasticizers present in the composition; heating said composition to a temperature in the range 100°-300° C. for a time sufficient to cause the adhesive to flux and, thereafter, exposing said composition to UV radiation to form a thermoset adhesive.

Claim 27

The composition of claim 1 as a coating.

Claim 28

The composition of claim 1 as a sealant.

Claim 29

The composition of claim 1 as an adhesive.

Claim 30

The composition of claim 11 as a coating.

Claim 31

The composition of claim 11 as a sealant.

Claim 32

The composition of claim 11 as an adhesive.