US4535012A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fast curing solderable conductor
Assignee: National Starch and Chemical Investment Holding Corp
•
Filing: 1983-09-30
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Granted: 1985-08-13
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Expires: 2003-09-30
Abstract
Abstract A solderable electrically conductive composition includes metallic silver particles embedded in a matrix of carboxylated vinyl and epoxy. The composition is formed by dissolving the vinyl in a solvent to form a solution. The solution is then mixed with the metallic silver particles and the epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvent and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix of vinyl and epoxy, on the substrate.
Inventors
- 👤 F. Wayne Martin
- 👤 Samson Shahbazi
- 👤 Ronald J. Schoonejongen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 00:44
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H01; H01B; H01B1/00; H01B1/20; H01B1/22
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
71 words
A method for forming a solderable electrically conductive film comprising the steps of dissolving carboxylated vinyl in a solvent to form a solution, mixing said solution with metallic silver particles and an moderate chain length epoxy to form an ink, applying said ink to a substrate to form a film thereon and applying heat to said film to evaporate said solvent to leave a solderable electrically conductive film on said substrate.
Claim 2
Independent Claim
71 words
A method for forming a solderable electrically conductive film comprising the steps of dissolving carboxylated vinyl in a solvent to form a solution, mixing said solution with metallic silver particles and an moderate chain length epoxy to form an ink, applying said ink to a substrate to form a film thereon and applying heat to said film to evaporate said solvent to leave a solderable electrically conductive film on said substrate.
Claim 3
Dependent Claim
26 words
A method as in claim 1 in which said substrate is a circuit board and said ink is applied to said circuit board by screen printing.
Claim 4
Dependent Claim
14 words
A method as in claim 1 in which said substrate is formed from aluminum.
Claim 5
Dependent Claim
19 words
A method as in claim 1 in which said solution makes up approximately 11.8% by weight of said ink.
Claim 6
Dependent Claim
19 words
A method as in claim 4 in which said silver makes up approximately 77.5% by weight of said ink.
Claim 7
Dependent Claim
19 words
A method as in claim 5 in which said epoxy makes up approximately 9.7% by weight of said ink.
Claim 8
Dependent Claim
21 words
A method as in claim 6 in which said carboxylated vinyl powder makes up approximately 30% by weight of said solution.
Claim 9
Dependent Claim
19 words
A method as in claim 7 in which said solvent makes up approximately 70% by weight of said solution.
Claim 10
Dependent Claim
13 words
A method as in claim 8 in which said solvent is ester alcohol.
Claim 11
Dependent Claim
22 words
A method as in claim 1 in which said film is cured by providing a 350° C. ambient temperature for 10 minutes.
Claim 12
Dependent Claim
17 words
A method as in claim 10 in which the said film is cured in a belt furnace.
Claim 13
Dependent Claim
27 words
A method as in claim 1 in which said film is cured by providing an ambient temperature from 345° to 355° C. for 8 to 12 minutes.
Claim 14
Dependent Claim
16 words
A method as in claim 12 in which said curing takes place in a convection oven.
Claim 15
Independent Claim
115 words
A method for forming a solderable electrically conductive film comprising the steps of dissolving carboxylated vinyl in a solvent to form a solution, mixing said solution with metallic silver particles and a moderate chain length epoxy to form an ink, in which said solution makes up from 10 to 13% by weight of said ink, said metallic silver particles make up from 75 to 80% by weight of said ink and said epoxy makes up from 9 to 11% by weight of said ink, applying said ink to a substrate to form a film thereon and applying heat to said film to evaporate said solvent to leave a solderable electrically conductive film on said substrate.
Claim 16
Independent Claim
115 words
A method for forming a solderable electrically conductive film comprising the steps of dissolving carboxylated vinyl in a solvent to form a solution, mixing said solution with metallic silver particles and a moderate chain length epoxy to form an ink, in which said solution makes up from 10 to 13% by weight of said ink, said metallic silver particles make up from 75 to 80% by weight of said ink and said epoxy makes up from 9 to 11% by weight of said ink, applying said ink to a substrate to form a film thereon and applying heat to said film to evaporate said solvent to leave a solderable electrically conductive film on said substrate.
Claim 17
Dependent Claim
22 words
A method as in claim 14 in which said film is cured by providing a 350° C. ambient temperature for 10 minutes.
Claim 18
Dependent Claim
17 words
A method as in claim 15 in which the said film is cured in a belt furnace.
Claim 19
Dependent Claim
27 words
A method as in claim 14 in which said film is cured by providing an ambient temperature from 345° to 355° C. for 8 to 12 minutes.
Claim 20
Dependent Claim
16 words
A method as in claim 17 in which said curing takes place in a convection oven.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-08-12 | 1989-02-11 | 1989-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-08-12 | 1993-02-11 | 1993-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-08-12 | 1997-02-11 | 1997-08-13 | $7700.00 | Window Closed / Lapsed |