US4531986A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder composition
Assignee: McDonnell Douglas Corp
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Filing: 1984-10-15
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Granted: 1985-07-30
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Expires: 2004-10-15
Abstract
Abstract Novel solder composition or solder cream, particularly adapted for high speed soldering of components in electronic circuits, whereby movement of components is avoided and essentially no solder balls are formed, comprising between 10 and 14% of a vehicle and between 86 and 90% of solder metal dispersed in the vehicle, preferably employing solder metal of particle size ranging from about 40 to about 70 microns, and utilizing as solvent in the vehicle a low volatile high molecular weight alcohol, preferably a primary aliphatic monoalcohol containing about 8 to about 18 carbon atoms, e.g., cetyl alcohol, in an amount of about 10 to about 50% by weight of the vehicle.
Inventors
- 👤 Felix Barajas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:54
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/36; B23K35/3612
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
63 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, which comprises finely divided solder metal dispersed in a vehicle containing as solvent a low volatile high molecular weight alcohol, said vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.
Claim 2
Dependent Claim
63 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, which comprises finely divided solder metal dispersed in a vehicle containing as solvent a low volatile high molecular weight alcohol, said vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.
Claim 3
Dependent Claim
22 words
The composition of claim 1, said low volatile alcohol being a primary aliphatic monolcohol containing about 8 to about 18 carbon atoms.
Claim 4
Dependent Claim
26 words
The composition of claim 2, said alcohol being present in an amount in the range of about 10 to about 50% by weight of the vehicle.
Claim 5
Dependent Claim
10 words
The composition of claim 3, said alcohol being cetyl alcohol.
Claim 6
Dependent Claim
107 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, whereby movement of said components is avoided and essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a vehicle containing (a) a viscosity-controlling agent, (b) an organic solvent in the form of a low volatile high molecular weight alcohol, and (c) a flux, the particle size of said metal ranging from about 40 to about 70 microns, said vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.
Claim 7
Dependent Claim
107 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, whereby movement of said components is avoided and essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a vehicle containing (a) a viscosity-controlling agent, (b) an organic solvent in the form of a low volatile high molecular weight alcohol, and (c) a flux, the particle size of said metal ranging from about 40 to about 70 microns, said vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.
Claim 8
Dependent Claim
17 words
The composition of claim 5, said low volatile alcohol being a high molecular weight primary aliphatic monoalcohol.
Claim 9
Dependent Claim
26 words
The composition of claim 6, said alcohol being present in an amount in the range of about 10 to about 50% by weight of the vehicle.
Claim 10
Dependent Claim
124 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, whereby movement of said components is avoided and essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a vehicle containing (a) a thixotropic agent, (b) an organic solvent comprised of a primary aliphatic monoalcohol containing about 8 to about 18 carbon atoms, in an amount of about 10 to about 50% by weight of the vehicle, and (c) a flux, said vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition, the particle size of said metal ranging from about 40 to about 70 microns.
Claim 11
Dependent Claim
124 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, whereby movement of said components is avoided and essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a vehicle containing (a) a thixotropic agent, (b) an organic solvent comprised of a primary aliphatic monoalcohol containing about 8 to about 18 carbon atoms, in an amount of about 10 to about 50% by weight of the vehicle, and (c) a flux, said vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition, the particle size of said metal ranging from about 40 to about 70 microns.
Claim 12
Dependent Claim
11 words
The composition of claim 8, said alcohol being a saturated alcohol.
Claim 13
Dependent Claim
22 words
The composition of claim 9, said alcohol employed in an amount of about 10 to about 30% by weight of the vehicle.
Claim 14
Dependent Claim
10 words
The composition of claim 8, said alcohol being cetyl alcohol.
Claim 15
Dependent Claim
14 words
The composition of claim 8, the metal particles of said solder metal being round.
Claim 16
Dependent Claim
16 words
The composition of claim 8, said flux being a rosin type flux or a paraffin wax.
Claim 17
Dependent Claim
19 words
The composition of claim 8, employing 13.5% of said liquid vehicle and 86.5% of said solder metal by weight.
Claim 18
Dependent Claim
24 words
The composition of claim 8, said solder metal being selected from the group consisting of tin, lead and silver, and alloys and mixtures thereof.
Claim 19
Dependent Claim
15 words
The composition of claim 8, said alcohol containing about 12 to about 18 carbon atoms.
Claim 20
Dependent Claim
16 words
The composition of claim 8, said thixotropic agent being hydrogenated castor oil or carboxy methyl cellulose.
Claim 21
Dependent Claim
12 words
The composition of claim 8, said rosin type flux comprising abietic acid.
Claim 22
Dependent Claim
21 words
The composition of claim 8, wherein said vehicle consists of 0.5-10% of (a); 10-50% (b) and 20-65% of (c), by weight.
Claim 23
Dependent Claim
122 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, whereby movement of said components is avoided and following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a generally liquid vehicle containing (a) 0.5-10% hydrogenated castor oil, (b) 10-50% of a saturated primary aliphatic monoalcohol containing about 12 to about 18 carbon atoms, (c) 20-65% of a flux comprising abietic acid or a paraffin wax, the particle size of said metal ranging from about 40 to about 70 microns, said liquid vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.
Claim 24
Dependent Claim
122 words
A solder composition especially adapted for high speed soldering of components in electronic circuitry, whereby movement of said components is avoided and following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a generally liquid vehicle containing (a) 0.5-10% hydrogenated castor oil, (b) 10-50% of a saturated primary aliphatic monoalcohol containing about 12 to about 18 carbon atoms, (c) 20-65% of a flux comprising abietic acid or a paraffin wax, the particle size of said metal ranging from about 40 to about 70 microns, said liquid vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.
Claim 25
Dependent Claim
12 words
The composition of claim 20, said vehicle including 0.01-10% of isopropyl amine.
Claim 26
Dependent Claim
25 words
The composition of claim 20, said monoalcohol being cetyl alcohol employed in an amount of about 10 to about 30% by weight of said vehicle.
Claim 27
Dependent Claim
31 words
The composition of claim 22, said liquid vehicle being present in an amount of 13.5% and said solder metal being present in an amount of 86.5%, by weight of said composition.
Claim 28
Dependent Claim
26 words
The composition of claim 20, said metal being alloys or mixtures of tin, lead and silver; tin and lead; tin and silver; and lead and silver.
Claim 29
Dependent Claim
19 words
The composition of claim 20, said solder metal being an alloy of 62% tin, 2% silver and 36% lead.
Claim 30
Dependent Claim
12 words
The composition of claim 20, said solder metal being a tin-lead alloy.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-07-29 | 1989-01-28 | 1989-07-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-07-29 | 1993-01-28 | 1993-07-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-07-29 | 1997-01-28 | 1997-07-30 | $7700.00 | Window Closed / Lapsed |