Universal circuit prototyping board

Claim 1

A prototyping board, comprising: at least one dielectric layer intermediate of first and second electrically conductive layers forming a sandwich having a top side for component insertion and a bottom side for circuit wiring; said sandwich having, coextensive in each layer, a layout area in which a pattern of socket pin holes on a standard 0.1 inch center is repeated in contiguous substantially 1.0 inch wide ranks and 1.6 inch wide files; each one of said patterns having 10 equal sized rows in said ranks and 16 equal sized columns in said files, wherein ten of said columns in each one of said patterns defines socket pin holes in every row, and wherein two pairs of adjacent columns in each one of said patterns excludes socket pin holes, said pairs of said adjacent columns being separated by six columns, and wherein said rows comprise a pattern of repeated columns of said socket pin holes ("hole") and excluded socket pin holes ("space") as follows: hole, space, space, hole, hole, hole, space, hole, hole, space, space, hole, hole, space, hole, hole, thereby to accommodate dual-in-line package (DIP) circuits of various standard widths at various locations relative to said pattern.