Multi-layer conductor plate and a method of making

Claim 1

A multi-layer conductor plate, comprising: a base plate means made of electrical insulation material, said base plate means being of substantial facial extent; a first layer of copper provided on a face of said base plate means in the form of at least one conductor path which is continuous along at least a portion of said face, said one conductor path having laterally opposite edges, and in the form of at least another conductor path which would crossingly intersect said one conductor path if said other conductor path were to be continuous, but said other conductor path being discontinuous adjacent said lateral edges of said one conductor path so as to provide two respective piers; a layer of etch-resistant, electrically conductive varnish superimposed upon at least some of said first layer of copper in said conductor paths; a layer of electrical insulation material superimposed upon said face at least in said portion so as to cover all of said etch-resistant electrically conductive varnished copper layer conductor paths except for being apertured by aperture means at a plurality of conductor attachment sites, including ones coinciding with both of said piers; a layer of galvanizable electrically conductive varnish, this layer being selectively applied upon said layer of electrical insulation material and upon selected ones of said sites so as to define a second layer of electrical conductor paths, this second layer including an electrical conductor path which electrically connects between said piers of said second conductor path while crossing-over but being electrically insulated from said first conductor path by said layer of electrical insulation material; and a galvanically-applied metal layer provided upon said galvanizable electrically conductive varnish, thereby bridging said piers.