US4514765A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solid-state image sensor
Assignee: Panasonic Holdings Corp
•
Filing: 1982-08-16
•
Granted: 1985-04-30
•
Expires: 2002-08-16
Abstract
Abstract A solid-state image sensor has a semiconductor substrate and a photoconductive film formed on the semiconductor substrate. The photoconductive film has a charge transfer function and subjects each field or group of picture elements to interlaced scanning. Flicker which otherwise results from inevitable differences between the magnitudes of setting voltages or areas of the photoconductive film portions with respect to the respective fields or groups of picture elements is significantly suppressed by changing the voltages applied to the photoconductive film portions with respect to each field or group of the interlaced picture element.
Inventors
- 👤 Yutaka Miyata
- 👤 Takao Chikamura
- 👤 Shinji Fujiwara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 18:23
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/191; Y; Y10; Y10S; Y10S348/00; Y10S348/91
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
92 words
A solid-state image sensor comprising a semiconductor substrate having a plurality of groups of picture-element diodes and a signal scanning means for interlaced scanning of said groups of diodes; a photoconductive film formed on said semiconductor substrate and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and voltage means for differentially applying a voltage to said photoconductive film corresponding to each group of said diodes in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 2
Dependent Claim
92 words
A solid-state image sensor comprising a semiconductor substrate having a plurality of groups of picture-element diodes and a signal scanning means for interlaced scanning of said groups of diodes; a photoconductive film formed on said semiconductor substrate and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and voltage means for differentially applying a voltage to said photoconductive film corresponding to each group of said diodes in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 3
Dependent Claim
14 words
A sensor according to claim 1, wherein said scanning circuit comprises CCDs or BBDs.
Claim 4
Dependent Claim
46 words
A sensor according to claim 1 or 2, wherein said scanning means includes vertical scanning signal-transfer electrodes each connected in common to a said group of diodes, and said voltage means comprises means for applying a different voltage magnitude to each said group of signal-transfer electrodes.
Claim 5
Dependent Claim
49 words
A sensor according to claim 1 or 2, wherein said scanning means incudes vertical scanning signal-transfer electrodes each connected in common to a said group of diodes, and said voltage means comprises means for applying a transfer pulse signal of a different duty ratio to each said signal-transfer electrode.
Claim 6
Dependent Claim
31 words
A sensor according to claim 1 or 2, wherein pulses for reading out signal charges from said diodes have an amplitude which is varied corresponding to the first and second fields.
Claim 7
Dependent Claim
27 words
A sensor according to claim 1 or 2, wherein said transparent electrode is applied with a voltage which is varied corresponding to the first and second fields.
Claim 8
Dependent Claim
97 words
A solid-state image sensor comprising a semiconductor substrate including a plurality of groups of diodes and signal scanning means for scanning said diodes group-by-group, said signal scanning means including vertical scanning signal-transfer electrodes each connected in common to a said group of diodes; a photoconductive film formed over and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and means for applying a different voltage magnitude to each said signal-transfer electrode in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 9
Dependent Claim
97 words
A solid-state image sensor comprising a semiconductor substrate including a plurality of groups of diodes and signal scanning means for scanning said diodes group-by-group, said signal scanning means including vertical scanning signal-transfer electrodes each connected in common to a said group of diodes; a photoconductive film formed over and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and means for applying a different voltage magnitude to each said signal-transfer electrode in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 10
Dependent Claim
102 words
A solid-state image sensor comprising a semiconductor substrate including a plurality of groups of diodes and signal scanning means for scanning said diodes group-by-group, said signal scanning means including vertical scanning signal-transfer electrodes each connected in common to a said group of diodes; a photoconductive film formed over and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and means for applying a transfer pulse voltage of a different duty cycle to each said signal-transfer electrode in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 11
Dependent Claim
102 words
A solid-state image sensor comprising a semiconductor substrate including a plurality of groups of diodes and signal scanning means for scanning said diodes group-by-group, said signal scanning means including vertical scanning signal-transfer electrodes each connected in common to a said group of diodes; a photoconductive film formed over and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and means for applying a transfer pulse voltage of a different duty cycle to each said signal-transfer electrode in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 12
Dependent Claim
87 words
A solid-state image sensor comprising a semiconductor substrate having first and second fields of diodes and signal scanning means including signal read-out electrodes for interlaced-scanning of said diodes field-by-field; a photoconductive film formed over and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and means for applying a pulse of a different amplitude to each field of signal read-out electrodes in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 13
Dependent Claim
87 words
A solid-state image sensor comprising a semiconductor substrate having first and second fields of diodes and signal scanning means including signal read-out electrodes for interlaced-scanning of said diodes field-by-field; a photoconductive film formed over and electrically connected to said diodes; a transparent electrode formed on said photoconductive film; and means for applying a pulse of a different amplitude to each field of signal read-out electrodes in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 14
Dependent Claim
90 words
A solid-state image sensor comprising a semiconductor substrate having first and second field of diodes and signal scanning means for interlaced scanning of said diodes field-by-field; a photoconductive film formed over and electrically connected to said diodes; transparent electrode portions formed on said photoconductive film corresponding to each said first and second fields of diodes; and means for applying voltages of different magnitudes to said transparent electrode portions in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
Claim 15
Dependent Claim
90 words
A solid-state image sensor comprising a semiconductor substrate having first and second field of diodes and signal scanning means for interlaced scanning of said diodes field-by-field; a photoconductive film formed over and electrically connected to said diodes; transparent electrode portions formed on said photoconductive film corresponding to each said first and second fields of diodes; and means for applying voltages of different magnitudes to said transparent electrode portions in order to compensate for possible differences of setting voltages or areas of the photoconductive film for the respective groups of diodes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-04-29 | 1988-10-29 | 1989-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-04-29 | 1992-10-29 | 1993-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-04-29 | 1996-10-29 | 1997-04-30 | $7700.00 | Window Closed / Lapsed |