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US4512864A Expired / Lapsed US ⏱️ 0.0 years remaining

Low resistance indium oxide films

Assignee: PPG Industries Ohio Inc
•
Filing: 1983-11-30
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Granted: 1985-04-23
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Expires: 2003-11-30
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Abstract

Abstract A method for depositing an indium oxide film by magnetron sputtering is disclosed wherein the resistance of the film is lowered by maintaining the substrate at an elevated temperature during the magnetron sputtering process.

Inventors

  • 👤 F. Howard Gillery

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 09:57
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/54; C23C14/541; C23C14/06; C23C14/08; C23C14/086; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12597

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 86 words
In a method for sputtering a metal oxide containing film onto a substrate surface from a cathode comprising a metal selected from the group consisting of indium, tin and mixtures thereof, in which a magnetic field is formed adjacent the cathode sputtering surface, the improvement which comprises maintaining the substrate at a temperature sufficiently higher than the ambient temperature during sputtering to produce a metal oxide containing film with a resistance significantly lower than that of a film similarly deposited on a substrate at ambient temperature.
Claim 2
Dependent Claim 86 words
In a method for sputtering a metal oxide containing film onto a substrate surface from a cathode comprising a metal selected from the group consisting of indium, tin and mixtures thereof, in which a magnetic field is formed adjacent the cathode sputtering surface, the improvement which comprises maintaining the substrate at a temperature sufficiently higher than the ambient temperature during sputtering to produce a metal oxide containing film with a resistance significantly lower than that of a film similarly deposited on a substrate at ambient temperature.
Claim 3
Dependent Claim 21 words
The improved method according to claim 1, wherein the substrate is maintained at a temperature of at least about 90° C.
Claim 4
Dependent Claim 21 words
The improved method according to claim 2, wherein the substrate is maintained at a temperature of at least about 200° C.
Claim 5
Dependent Claim 12 words
The improved method according to claim 3, wherein the substrate is glass.
Claim 6
Dependent Claim 22 words
The improved method according to claim 4, wherein the cathode is an alloy comprising about 90 percent indium and 10 percent tin.
Claim 7
Dependent Claim 29 words
The improved method according to claim 5, wherein the film is formed to a thickness of about 300 Angstroms and has a resistance of about 100 ohms per square.
Claim 8
Dependent Claim 32 words
The improved method according to claim 5, wherein the film is formed to a thickness exhibiting first order red interference effects and has a resistance less than about 20 ohms per square.
Claim 9
Dependent Claim 32 words
The improved method according to claim 5, wherein the film is formed to a thickness exhibiting fourth order red interference effects and has a resistance less than about 10 ohms per square.
Claim 10
Dependent Claim 19 words
The improved method according to claim 8, wherein the film has a resistance of about 5 ohms per square.

References Cited (Backward Citations)

US3907660A Cited
US4094763A Cited
US4166018A Cited
US4201649A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-04-22 1988-10-22 1989-04-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-04-22 1992-10-22 1993-04-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-04-22 1996-10-22 1997-04-23 $7700.00 Window Closed / Lapsed

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