Solder composition for high-density circuits

Claim 2

A solder composition especially adapted for soldering components in high-density electronic circuitry, whereby following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) a thixotropic agent, (b) an organic solvent and (c) a flux, the particle size of said metal ranging from about 0.2 to about 35 microns, said liquid vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.

Claim 3

The composition of claim 1, the particle size of said metal ranging from about 0.5 to about 10 microns.

Claim 4

The composition of claim 1, the metal particles of said solder metal being round.

Claim 5

The composition of claim 1, said flux being a rosin type flux or a paraffin wax.

Claim 6

The composition of claim 1, employing 13.5% of said liquid vehicle and 86.5% of said solder metal by weight.

Claim 7

The composition of claim 1, said solder metal being selected from the group consisting of tin, lead and silver, and alloys and mixtures thereof.

Claim 8

The composition of claim 1, said metal being alloys or mixtures of tin, lead and silver; tin and lead: tin and silver; and lead and silver.

Claim 9

The composition of claim 1, said thixotropic agent being hydrogenated caster oil or carboxy methyl cellulose.

Claim 10

The composition of claim 1, said organic solvent being 2-butoxy (ethyl) ethyl acetate, 2-butoxy ethyl acetate, ethylene glycol or beta-terpineol.

Claim 11

The composition of claim 1, said flux comprising abietic acid.

Claim 12

The composition of claim 1, wherein said vehicle consists of 0.5-10% of (a), 30-60% (b) and 20-65% of (c), by weight.

Claim 13

The composition of claim 1, said thixotropic agent (a) being hydrogenated castor oil, said organic solvent (b) being 2-butoxy (ethyl) ethyl acetate, and said flux (c) comprising abietic acid.

Claim 14

A solder composition especially adapted for soldering components in high-density electronic circuitry, whereby efficient electrical connections can be made between small components and following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) 0.5-10% hydrogenated castor oil, (b) 30-60% 2-butoxy (ethyl) ethyl acetate and (c) 20-65% of a rosin type flux comprising abietic acid, the particle size of said metal ranging from about 0.2 to about 35 microns, said liquid vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.

Claim 15

A solder composition especially adapted for soldering components in high-density electronic circuitry, whereby efficient electrical connections can be made between small components and following soldering essentially no solder balls are formed, said solder composition comprising finely divided solder metal dispersed in a liquid vehicle containing (a) 0.5-10% hydrogenated castor oil, (b) 30-60% 2-butoxy (ethyl) ethyl acetate and (c) 20-65% of a rosin type flux comprising abietic acid, the particle size of said metal ranging from about 0.2 to about 35 microns, said liquid vehicle being present in an amount of 10 to 14%, and said solder metal being present in an amount of 86 to 90%, by weight of said composition.

Claim 16

The composition of claim 13, said vehicle including 0.01-10% isopropyl amine.

Claim 17

The composition of claim 14, said vehicle consisting of 59% abietic acid, 31% 2-butoxy (ethyl) ethyl acetate, 8% hydrogenated castor oil and 2% isopropyl amine, by weight.

Claim 18

The composition of claim 15, said liquid vehicle being present in an amount of 13.5% and said solder metal being present in an amount of 86.5%, by weight of said composition.

Claim 19

The composition of claim 16, the particle size of said metal ranging from about 0.5 to about 10 microns.

Claim 20

The composition of claim 13, said metal being alloys or mixtures of tin, lead and silver; tin and lead; tin and silver; and lead and silver.

Claim 21

The composition of claim 17, said solder metal being a tin-lead-silver alloy.

Claim 22

The composition of claim 1, said solder metal being an alloy of 62% tin, 2% silver and 36% lead.

Claim 23

The composition of claim 1, said solder metal being a tin-lead alloy.

Claim 24

A solder composition especially adapted for soldering components in high-density electronic circuits, comprises by weight (a) 10-14% of a liquid vehicle containing a viscosity-controlling agent and a flux, and (b) 86 to 90% of a solder metal dispersed in said vehicle, the particle size of the solder metal ranging from about 0.2 to about 35 microns.

Claim 25

A solder composition especially adapted for soldering components in high-density electronic circuits, comprises by weight (a) 10-14% of a liquid vehicle containing a viscosity-controlling agent and a flux, and (b) 86 to 90% of a solder metal dispersed in said vehicle, the particle size of the solder metal ranging from about 0.2 to about 35 microns.

Claim 26

The composition of claim 22, the particle size of said metal ranging from about 0.5 to about 10 microns.

Claim 27

The composition of claim 22, said flux being a rosin type flux or a paraffin wax.