US4504850A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Disc-type semiconductor mounting arrangement with force distribution spacer
Assignee: Sundstrand Corp
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Filing: 1981-10-02
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Granted: 1985-03-12
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Expires: 2001-10-02
Abstract
Abstract A disc-type semiconductor mounting arrangement is provided with force distribution spacers. One side of each spacer contains a counterbore which prevents contact between the center of the spacer and other elements of a stack of semiconductors and associated heat sinks and bus bars. Compressive force applied to the assembly is thereby distributed across the semiconductor pole area.
Inventors
- 👤 David D. Pollard
- 👤 Ting-Long Ho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 18:01
CPC Classifications
H; H10; H10W; H10W72/00; H10W40/00; H10W40/60; H10W40/611; H10W40/613; H10W90/00
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
143 words
A semiconductor device mounting arrangement comprising: a disc-type semiconductor device having opposing contact faces; a metal sheet for making electrical and thermal contact with one of said contact faces of said device; a spacer having a counterbore in one side, said counterbored side being disposed in contact with said metal sheet on the opposite side of said metal sheet as said device; means for applying a predetermined pressure to force said device, said metal sheet, and said spacer into intimate contact, with said counterbore having sufficient depth to preclude contact between the center of said counterbore and said metal sheet, when said predetermined pressure is applied, and wherein the forces on the spacer side of said metal sheet are effectively averaged on the device side of said metal sheet; and means for centering said predetermined pressure on a second side of said spacer.
Claim 2
Dependent Claim
143 words
A semiconductor device mounting arrangement comprising: a disc-type semiconductor device having opposing contact faces; a metal sheet for making electrical and thermal contact with one of said contact faces of said device; a spacer having a counterbore in one side, said counterbored side being disposed in contact with said metal sheet on the opposite side of said metal sheet as said device; means for applying a predetermined pressure to force said device, said metal sheet, and said spacer into intimate contact, with said counterbore having sufficient depth to preclude contact between the center of said counterbore and said metal sheet, when said predetermined pressure is applied, and wherein the forces on the spacer side of said metal sheet are effectively averaged on the device side of said metal sheet; and means for centering said predetermined pressure on a second side of said spacer.
Claim 3
Dependent Claim
34 words
A semiconductor device mounting arrangement as recited in claim 1, wherein said means for centering said predetermined pressure is a convex surface on a second side of said spacer, opposite to said counterbored side.
Claim 4
Dependent Claim
153 words
A semiconductor device mounting arrangement comprising: a disc-type semiconductor device having opposing contact faces; a metal sheet for making electrical and thermal contact with each of said contact faces of said devices; two spacers each having a counterbore in one side, said counterbored sides being disposed in contact with said metal sheets on the opposite side of said metal sheets as said device; means for applying a predetermined pressure to force said device, said metal sheets, and said spacers into intimate contact, with each of said counterbores having sufficient depth to preclude contact between the center of each counterbore and the adjacent metal sheet, when said predetermined pressure is applied, and wherein the forces on the spacer side of each of said metal sheets are effectively averaged on the device side of each of said metal sheets; and means for centering said predetermined pressure on a second side of each of said spacers.
Claim 5
Dependent Claim
153 words
A semiconductor device mounting arrangement comprising: a disc-type semiconductor device having opposing contact faces; a metal sheet for making electrical and thermal contact with each of said contact faces of said devices; two spacers each having a counterbore in one side, said counterbored sides being disposed in contact with said metal sheets on the opposite side of said metal sheets as said device; means for applying a predetermined pressure to force said device, said metal sheets, and said spacers into intimate contact, with each of said counterbores having sufficient depth to preclude contact between the center of each counterbore and the adjacent metal sheet, when said predetermined pressure is applied, and wherein the forces on the spacer side of each of said metal sheets are effectively averaged on the device side of each of said metal sheets; and means for centering said predetermined pressure on a second side of each of said spacers.
Claim 6
Dependent Claim
36 words
A semiconductor device mounting arrangement as recited in claim 3, wherein said means for centering said predetermined pressure is a convex surface on a second side of each of said spacers, opposite to said counterbored side.
Claim 7
Dependent Claim
157 words
A semiconductor device mounting arrangement comprising: a plurality of disc-type semiconductors, each having opposing contact faces; a plurality of metal sheets for making electrical and thermal contact with each of said contact faces; a plurality of spacers, each having a counterbore in one side, said counterbored sides being disposed in contact with said metal sheets on the opposite side of said metal sheets as said contact faces; means for applying a predetermined pressure to force said device, said metal sheets, and said spacers into intimate contact, with each of said counterbores having sufficient depth to preclude contact between the center of each counterbore and the adjacent metal sheet, when said predetermined pressure is applied, and wherein the forces on the spacer side of each of said metal sheets are effectively averaged on the device side of each of said metal sheets; and means for centering said predetermined pressure on a second side of each of said spacers.
Claim 8
Dependent Claim
157 words
A semiconductor device mounting arrangement comprising: a plurality of disc-type semiconductors, each having opposing contact faces; a plurality of metal sheets for making electrical and thermal contact with each of said contact faces; a plurality of spacers, each having a counterbore in one side, said counterbored sides being disposed in contact with said metal sheets on the opposite side of said metal sheets as said contact faces; means for applying a predetermined pressure to force said device, said metal sheets, and said spacers into intimate contact, with each of said counterbores having sufficient depth to preclude contact between the center of each counterbore and the adjacent metal sheet, when said predetermined pressure is applied, and wherein the forces on the spacer side of each of said metal sheets are effectively averaged on the device side of each of said metal sheets; and means for centering said predetermined pressure on a second side of each of said spacers.
Claim 9
Dependent Claim
36 words
A semiconductor device mounting arrangement as recited in claim 5, wherein said means for centering said predetermined pressure is a convex surface on a second side of each of said spacers, opposite to said counterbored side.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-03-11 | 1988-09-10 | 1989-03-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-03-11 | 1992-09-10 | 1993-03-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-03-11 | 1996-09-10 | 1997-03-12 | $7700.00 | Window Closed / Lapsed |