Arrangement for carrying electrical and/or electronic components

Claim 1

An arrangement comprising: at least one circuit component which operates with high power densities at high potential levels; a mass of insulating material which includes a major insulating material portion and a minor insulating material portion, each said portion having a uniform thickness, with said at least one component being directly mounted on said minor portion and in heat-conductive communication with said minor portion; a metal shield embedded between said insulating material portions, electrically insulated from said component by said minor portion and formed to partly surround the region occupied by said at least one component; and electrical conductor means connected to said metal shield for applying thereto an electrical potential selected to minimize the potential between said at least one component and said shield across said minor portion, wherein said shield and said insulating material portions are formed for enabling said shield to receive power dissipated by said at least one component through said minor portion at high heat flux density and for causing heat received by said shield to be removed through said major portion with low heat flux density.