Contacting a surface for plating thereon

Claim 2

Apparatus for plating on a first surface of an article comprising: a conductor disposed adjacent to the first surface and means for connecting said conductor to a source of electrical current; means for contacting the conductor and the first surface, including a first portion in contact with the conductor and a second portion in contact with the first surface, each of said portions having a substantially nonconductive matrix supporting a plurality of conductive elements having first and second ends, said first ends of elements in the first portion being in contact with the conductor and said first ends of elements in the second portion being in contact with the first surface; and at least one coupling member in contact with and interconnecting the second ends of the conductive elements in the first and second portions of the contact means thereby completing conductive paths from the conductor through the elements of the first portion to the coupling member and therefrom through the elements of the second portion to the first surface.

Claim 3

Apparatus as in claim 1 wherein the conductive elements are sufficient in number, cross-section and inherent material conductivity in the first and second portions to readily conduct current desired to plate on the first surface.

Claim 4

Apparatus as in claim 2 wherein the matrix material is selected with respect to the impinging force, temperature and composition of a given plating solution and the conditions on the first surface to compress sufficiently against and to seal peripheral regions of said first surface, thereby preventing unwanted wetting of other surfaces.

Claim 5

Apparatus as in claim 3 wherein the conductive elements are longitudinally, resiliently shaped to sufficiently force the first and second ends against contact surfaces such that conduction of the desired current is readily achieved.

Claim 6

Apparatus for plating on a first surface of a wafer, comprising: a holder board having at least one pocket for holding a wafer therein; an annular conductor disposed concentrically of, and adjacent the peripheral edge of, a wafer in the pocket and means for connecting the conductor to a current source; a substantially annular, composite member having a first portion for contacting the conductor and a second portion for contacting peripheral regions of the first surface of a wafer, each of said portions having a substantially nonconductive matrix supporting a plurality of conductive elements having first and second ends, said first ends of the first portion provided for contacting the conductor and said first ends of the second portion provided for contacting the first surface; a substantially annular coupling member in contact with and interconnecting the second ends of the conductive elements in the composite member for completing conductive paths from the conductor through the elements of the first portion to the coupling member and therefrom through the elements of the second portion to the first surface; means for applying, with coupling member attached, the composite member to the conductor and the peripheral regions of the first surface; and means for compressing the conductor and wafer, the composite member and coupling member together to sufficiently press against and thereby seal peripheral regions of the first surface and to sufficiently longitudinally force the first and second ends of the conductive elements against contact surfaces to conduct the desired current for the plating.

Claim 7

Apparatus for plating on a first surface of a wafer, comprising: a holder board having at least one pocket for holding a wafer therein; an annular conductor disposed concentrically of, and adjacent the peripheral edge of, a wafer in the pocket and means for connecting the conductor to a current source; a substantially annular, composite member having a first portion for contacting the conductor and a second portion for contacting peripheral regions of the first surface of a wafer, each of said portions having a substantially nonconductive matrix supporting a plurality of conductive elements having first and second ends, said first ends of the first portion provided for contacting the conductor and said first ends of the second portion provided for contacting the first surface; a substantially annular coupling member in contact with and interconnecting the second ends of the conductive elements in the composite member for completing conductive paths from the conductor through the elements of the first portion to the coupling member and therefrom through the elements of the second portion to the first surface; means for applying, with coupling member attached, the composite member to the conductor and the peripheral regions of the first surface; and means for compressing the conductor and wafer, the composite member and coupling member together to sufficiently press against and thereby seal peripheral regions of the first surface and to sufficiently longitudinally force the first and second ends of the conductive elements against contact surfaces to conduct the desired current for the plating.

Claim 8

Apparatus as in claim 5 wherein the means for applying the composite member and means for compressing further comprise: a substantially annular masking ring for holding the coupling member and composite member; a hinge assembly connecting the masking ring to the holder board for removably applying the masking ring to the pocket, and with coupling member attached, the composite member to the conductor and a wafer held in the pocket; said hinge assembly providing an interference fit between the composite member and the conductor and wafer; and at least one camming lug disposed on the holder board at the periphery of the masking ring to draw the ring toward the board and compress, with the coupling member attached, the composite member to the wafer and the conductor.

Claim 9

The apparatus as in claim 5 wherein the means for applying the composite member and the means for compressing further comprise: inserted within the pocket, an annular member having a substantially annular ledge to support the coupling member with the composite member thereagainst, the conductor and a wafer being applied against the composite member; and a plug for insertion into the pocket and means for applying pressure via the plug to compress the wafer and conductor against the composite member, the coupling member and the ledge.

Claim 10

The apparatus as in claim 5 wherein the coupling member is sufficiently compliant to conform to the matrix in the composite member and contact the conductive elements.

Claim 13

A method as in claim 9 wherein contacting the conductor and the first surface further comprises: contacting with conductive elements that are sufficient in number, cross-section and inherent material conductivity in the first and second portions to readily conduct current desired to plate on the first surface.

Claim 14

A method as in claim 10 wherein contacting the conductor and the first surface further comprises: contacting with matrix material selected with respect to the impinging force, temperature and composition of a given plating solution and the conditions on the first surface to compress sufficiently against and to seal peripheral regions of said first surface, thereby preventing unwanted wetting of other surfaces.

Claim 15

A method as in claim 11 wherein contacting the conductor and the first surface further comprises: contacting with conductive elements that are longitudinally, resiliently shaped to sufficiently repeatably force the first and second ends against contact surfaces such that conduction of the desired current is readily achieved.