US4500383A
Expired / Lapsed
US
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Process for bonding copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
Assignee: Meidensha Corp
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Filing: 1983-02-08
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Granted: 1985-02-19
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Expires: 2003-02-08
Abstract
Abstract A process for bonding a copper or copper-chromium alloy body and a ceramic body of components of an electrical or electronic device to each other includes a step of directly sandwiching a layer of chromium oxide between the ceramic and copper or copper-chromium bodies, a step of heating a temporary assembly of the ceramic and copper or copper-chromium alloy bodies and the layer of chromium oxide, under an atmosphere which can oxidize chromium without oxidizing copper, at a temperature of at least 900° C. but below the melting point of copper or the alloy, and then a step of slowly cooling the resulting bonded assembly. In particular, in a process for bonding the alloy body to the ceramic body, the chromium oxide sandwiching step is performed concurrently with the temporary assembly heating step. The bonding process can produce a hermetic envelope, particularly a vacuum envelope of a vacuum interrupter. The process for bonding the copper or alloy body to the ceramic body of this invention is more advantageous than bonding processes employing the so-called Telefunken method, in terms of cost and steps.
Inventors
- 👤 Yoshiyuki Kashiwagi
- 👤 Tsutai Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 19:33
CPC Classifications
H; H01; H01H; H01H33/00; H01H33/60; H01H33/66; H01H33/662; H01H33/66207; C; C04; C04B; C04B37/00; C04B37/02; C04B37/021; C04B37/023; C04B37/026; C04B2237/00; C04B2237/02; C04B2237/04; C04B2237/06; C04B2237/068; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/343; C04B2237/40; C04B2237/407; C04B2237/50; C04B2237/70; C04B2237/708; C04B2237/76; C04B2237/765; H01H2033/66215; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/38; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12535; Y10T428/12597
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
103 words
A process for bonding a copper body and a ceramic body to each other, said ceramic body having a melting point higher than that of copper, said process comprising the steps of: directly sandwiching a layer of chromium oxide between the copper and ceramic bodies; heating a temporary assembly of the ceramic and copper bodies and the chromium oxide in an atmosphere in which copper will not oxidize, at a temperature of at least 900° C. but below the melting point of copper; and then slowly cooling the resulting bonded assembly in which a bonded portion of the copper body is plastically deformed.
Claim 2
Dependent Claim
103 words
A process for bonding a copper body and a ceramic body to each other, said ceramic body having a melting point higher than that of copper, said process comprising the steps of: directly sandwiching a layer of chromium oxide between the copper and ceramic bodies; heating a temporary assembly of the ceramic and copper bodies and the chromium oxide in an atmosphere in which copper will not oxidize, at a temperature of at least 900° C. but below the melting point of copper; and then slowly cooling the resulting bonded assembly in which a bonded portion of the copper body is plastically deformed.
Claim 3
Dependent Claim
38 words
A process as defined in claim 1, wherein said chromium oxide sandwiching step includes the steps of forming a chromium film at least 10 nm thick on a surface of the ceramic body, and oxidizing the chromium film.
Claim 4
Dependent Claim
49 words
A process as defined in claim 2, wherein said chromium film oxidizing step is performed by continuously heating the chromium film in an atmosphere of air at a pressure of at least 10 -5 Torr and at a temperature of at least 100° C. for at least 10 minutes.
Claim 5
Dependent Claim
37 words
A process as defined in claim 1, wherein the atmosphere in the temporary assembly heating step is a vacuum of at least 10 -4 Torr and heating is maintained in such atmosphere for at least 10 minutes.
Claim 6
Dependent Claim
33 words
A process as defined in claim 1, wherein the atmosphere in the temporary assembly heating step is of a non-oxidizing gas and heating is maintained in such atmosphere for at least 10 minutes.
Claim 7
Dependent Claim
35 words
A process as defined in claim 1, wherein said chromium oxide sandwiching step includes the step of forming a chromium oxide film at least 10 nm thick on the ceramic body by vacuum ion deposition.
Claim 8
Dependent Claim
120 words
A process for bonding a copper body and a ceramic body to each other, said ceramic body having a melting point higher than that of copper, said process comprising the steps of: directly sandwiching a layer of a copper-chromium alloy consisting essentially of copper and about 0.1 to 0.6 weight percent chromium between the ceramic and copper bodies; heating a temporary assembly of the ceramic and copper bodies and the copper-chromium alloy in an atmosphere in which chromium will oxidize but copper will not oxidize, at a temperature of at least 900° C. but below the melting point of copper; and then slowly cooling the resulting bonded assembly in which a bonded portion of the copper body is plastically deformed.
Claim 9
Dependent Claim
120 words
A process for bonding a copper body and a ceramic body to each other, said ceramic body having a melting point higher than that of copper, said process comprising the steps of: directly sandwiching a layer of a copper-chromium alloy consisting essentially of copper and about 0.1 to 0.6 weight percent chromium between the ceramic and copper bodies; heating a temporary assembly of the ceramic and copper bodies and the copper-chromium alloy in an atmosphere in which chromium will oxidize but copper will not oxidize, at a temperature of at least 900° C. but below the melting point of copper; and then slowly cooling the resulting bonded assembly in which a bonded portion of the copper body is plastically deformed.
Claim 10
Dependent Claim
15 words
A process as defined in claim 7, wherein the copper-chromium alloy layer is a foil.
Claim 11
Dependent Claim
37 words
A process as defined in claim 7, wherein the atmosphere in the temporary assembly heating step is a vacuum of at least 10 -4 Torr and heating is maintained in such atmosphere for at least 10 minutes.
Claim 12
Dependent Claim
33 words
A process as defined in claim 7, wherein the atmosphere in the temporary assembly heating step is of a non-oxidizing gas and heating is maintained in such atmosphere for at least 10 minutes.
Claim 13
Dependent Claim
121 words
A process for bonding a body of a copper-based alloy consisting essentially of copper and about 0.1 to 0.6 weight percent chromium and a ceramic body to each other, said ceramic body having a melting point higher than that of copper, said process comprising the steps of: directly contacting the copper-based alloy body to the ceramic body; heating a temporary assembly of the copper-based alloy body and the ceramic body in an atmosphere in which chromium will oxidize but copper will not oxidize, at a temperature of at least 900° C. but below the melting point of the copper-based alloy; and then slowly cooling the resulting bonded assembly in which a bonded portion of the copper-based alloy body is plastically deformed.
Claim 14
Dependent Claim
121 words
A process for bonding a body of a copper-based alloy consisting essentially of copper and about 0.1 to 0.6 weight percent chromium and a ceramic body to each other, said ceramic body having a melting point higher than that of copper, said process comprising the steps of: directly contacting the copper-based alloy body to the ceramic body; heating a temporary assembly of the copper-based alloy body and the ceramic body in an atmosphere in which chromium will oxidize but copper will not oxidize, at a temperature of at least 900° C. but below the melting point of the copper-based alloy; and then slowly cooling the resulting bonded assembly in which a bonded portion of the copper-based alloy body is plastically deformed.
Claim 15
Dependent Claim
37 words
A process as defined in claim 11, wherein the atmosphere in the temporary assembly heating step is a vacuum of at least 10 -4 Torr and heating is maintained in such atmosphere for at least 10 minutes.
Claim 16
Dependent Claim
33 words
A process as defined in claim 11, wherein the atmosphere in the temporary assembly heating step is of a non-oxidizing gas and heating is maintained in such atmosphere for at least 10 minutes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-02-19 | 1988-08-20 | 1989-02-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-02-19 | 1992-08-20 | 1993-02-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-02-19 | 1996-08-20 | 1997-02-19 | $7700.00 | Window Closed / Lapsed |