US4499163A
Expired / Lapsed
US
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Soldering mask formed from a photosensitive resin composition and a photosensitive element
Assignee: Resonac Corp
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Filing: 1983-07-11
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Granted: 1985-02-12
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Expires: 2003-07-11
Abstract
Abstract A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40° to 150° C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
Inventors
- 👤 Toshiaki Ishimaru
- 👤 Katsushige Tsukada
- 👤 Nobuyuki Hayashi
- 👤 Shigeru Koibuchi
- 👤 Asao Isobe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 15:32
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; C; C08; C08F; C08F2/00; C08F2/46; C08F2/48; C08F2/50; C08F299/00; C08F299/02; C08F299/06; C08F299/065; C08G; C08G18/00; C08G18/06; C08G18/28; C08G18/67; C08G18/671; C08G18/672
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
163 words
A photosensitive resin composition forming a soldering mask comprising: (a) 20 to 75 parts by weight of at least one urethane diacrylate or urethane dimethacrylate compound which has acryloyl or methacryloyl groups in an amount of 1×10 -3 to 4.3×10 -3 equivalent/g. and which is obtained by reacting (i) at least one diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate and isophorone diisocyanate, (ii) a dihydric alcohol, and (iii) an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymer having a glass transition temperature of about 40° to 150° C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total amounts of components (a) and (b); said composition having been heated to 80° to 200° C. and exposed to actinic light after development by image-wise exposure and treatment with a developing solution.
Claim 2
Dependent Claim
163 words
A photosensitive resin composition forming a soldering mask comprising: (a) 20 to 75 parts by weight of at least one urethane diacrylate or urethane dimethacrylate compound which has acryloyl or methacryloyl groups in an amount of 1×10 -3 to 4.3×10 -3 equivalent/g. and which is obtained by reacting (i) at least one diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate and isophorone diisocyanate, (ii) a dihydric alcohol, and (iii) an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymer having a glass transition temperature of about 40° to 150° C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total amounts of components (a) and (b); said composition having been heated to 80° to 200° C. and exposed to actinic light after development by image-wise exposure and treatment with a developing solution.
Claim 3
Dependent Claim
14 words
A composition according to claim 1, wherein the diisocyanate compound (i) is trimethylhexamethylene diisocyanate.
Claim 4
Dependent Claim
14 words
A composition according to claim 1, wherein the diisocyanate compound (i) is isophorone diisocyanate.
Claim 5
Dependent Claim
71 words
A composition according to claim 1, wherein the urethane diacrylate or dimethacrylate compound (a) is represented by the following formula: ##STR2## wherein R 1 is H or CH 3 ; R 2 is a residue of a dihydric alcohol; R 3 is a residue of a dihydric alcohol; X is a residue of isophorone diisocyanate or a trimethylhexamethylene group; and n is zero or a positive integer of 1 to 3.
Claim 6
Dependent Claim
22 words
A composition according to claim 1, wherein the dihydric alcohol of (ii) and that in (iii) have 1 to 23 carbon atoms.
Claim 7
Dependent Claim
19 words
A composition according to claim 1, wherein the dihydric alcohol of (ii) is 1,4-butanediol, 1,3-butanediol, 1,5-pentanediol, 1,6-hexanediol or 1,4-cyclohexanedimethanol.
Claim 8
Dependent Claim
27 words
A composition according to claim 1, wherein the acrylic or methacrylic monoester (iii) of a dihydric alcohol is hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate or hydroxypropyl methacrylate.
Claim 9
Dependent Claim
17 words
A composition according to claim 1, wherein the linear polymeric compound (b) is a vinyl series copolymer.
Claim 10
Dependent Claim
23 words
A composition according to claim 1, wherein the linear polymeric compound (b) contains bromine atoms in an amount up to 40% by weight.
Claim 11
Dependent Claim
28 words
A composition according to claim 1, wherein the linear polymeric compound (b) contains 5 to 65% by weight of tribromophenyl acrylate or tribromophenyl methacrylate as a copolymer component.
Claim 12
Dependent Claim
42 words
A composition according to claim 1, which additionally contains (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total amount of components (a) and (b).
Claim 13
Dependent Claim
19 words
A composition according to claim 1, which additionally contains antimony trioxide in an amount up to 5% by weight.
Claim 14
Dependent Claim
177 words
A photosensitive element forming a soldering mask comprising (I) a layer of a photosensitive resin composition comprising (a) 20 to 75 parts by weight of at least one urethane diacrylate or urethane dimethacrylate compound which has acryloyl or methacryloyl groups in an amount of 1×10 -3 to 4.3×10 -3 equivalent/g. and which is obtained by reacting (i) at least one diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate and isophorone diisocyanate, (ii) a dihydric alcohol and (iii) an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymer having a glass transition temperature of about 40° C. to 150° C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total amounts of components (a) and (b); said composition having been heated to 80° to 200° C. and exposed to actinic light after development by image-wise exposure and solvent treatment, and (II) a support film supporting said layer.
Claim 15
Dependent Claim
177 words
A photosensitive element forming a soldering mask comprising (I) a layer of a photosensitive resin composition comprising (a) 20 to 75 parts by weight of at least one urethane diacrylate or urethane dimethacrylate compound which has acryloyl or methacryloyl groups in an amount of 1×10 -3 to 4.3×10 -3 equivalent/g. and which is obtained by reacting (i) at least one diisocyanate compound selected from the group consisting of trimethylhexamethylene diisocyanate and isophorone diisocyanate, (ii) a dihydric alcohol and (iii) an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymer having a glass transition temperature of about 40° C. to 150° C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total amounts of components (a) and (b); said composition having been heated to 80° to 200° C. and exposed to actinic light after development by image-wise exposure and solvent treatment, and (II) a support film supporting said layer.
Claim 16
Dependent Claim
24 words
A photosensitive element according to claim 13, wherein the diisocyanate compound (i) in the layer (I) of the photosensitive resin composition is trimethylhexamethylene diisocyanate.
Claim 17
Dependent Claim
24 words
A photosensitive element according to claim 13, wherein the diisocyanate compound (i) in the layer (I) of the photosensitive resin composition is isophorone diisocyanate.
Claim 18
Dependent Claim
77 words
A photosensitive element according to claim 13, wherein the urethane diacrylate or dimethacrylate compound (a) in the layer (I) of the photosensitive resin composition is represented by the following formula: ##STR3## wherein R 1 is H or CH 3 ; R 2 is a residue of a dihydric alcohol; R 3 is a residue of a dihydric alcohol; X is a residue of isophorone diisocyanate or a trimethylhexamethylene group; and n is zero or a positive integer.
Claim 19
Dependent Claim
32 words
A photosensitive element according to claim 13, wherein the dihydric alcohol of (ii) and that in (iii) in the layer (I) of the photosensitive resin composition have 1 to 23 carbon atoms.
Claim 20
Dependent Claim
29 words
A photosensitive element according to claim 13, wherein the dihydric alcohol of (ii) in the layer (I) of the photosensitive resin composition is 1,4-butanediol, 1,3-butanediol, 1,5-pentanediol, 1,6-hexanediol or 1,4-cyclohexanedimethanol.
Claim 21
Dependent Claim
33 words
A photosensitive element according to claim 13, wherein the acrylic or methacrylic monoester (iii) in the layer (I) of the photosensitive resin composition is hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate or hydroxypropyl methacrylate.
Claim 22
Dependent Claim
27 words
A photosensitive element according to claim 13, wherein the linear polymeric compound (b) in the layer (I) of the photosensitive resin composition is a vinyl series copolymer.
Claim 23
Dependent Claim
33 words
A photosensitive element according to claim 13, wherein the linear polymeric compound (b) in the layer (I) of the photosensitive resin composition contains bromine atoms in an amount up to 40% by weight.
Claim 24
Dependent Claim
41 words
A photosensitive element according to claim 13, 20 or 21, wherein the linear polymeric compound (b) in the layer (I) of the photosensitive resin composition contains 5 to 65% by weight of tribromophenyl acrylate or tribromophenyl methacrylate as a polymerization component.
Claim 25
Dependent Claim
51 words
A photosensitive element according to claim 13, wherein the layer (I) of the photosensitive resin composition additionally contains (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total amount of components (a) and (b).
Claim 26
Dependent Claim
28 words
A photosensitive element according to claim 13, wherein the layer (I) of the photosensitive resin composition additionally contains antimony trioxide in an amount up to 5% by weight.
Claim 27
Dependent Claim
24 words
A photosensitive element according to claim 13, wherein the layer (I) of the photosensitive resin composition has a thickness of 20 to 200 μm.
Claim 28
Dependent Claim
29 words
A photosensitive element according to claim 13, wherein the support film (II) is a polyester film, a polyimide film, a polyamide-imide film, a polypropylene film or a polystyrene film.
Claim 29
Dependent Claim
23 words
A photosensitive element according to claim 13, which further laminates a releasable covering film on the layer (I) of the photosensitive resin composition.
Claim 30
Dependent Claim
33 words
A composition according to claim 1, wherein the urethane diacrylate or dimethacrylate compound (A) is obtained by effecting reaction of components (i), (ii) and (iii) at a temperature from 40° to 100° C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-02-12 | 1988-08-13 | 1989-02-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-02-12 | 1992-08-13 | 1993-02-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-02-12 | 1996-08-13 | 1997-02-12 | $7700.00 | Window Closed / Lapsed |