US4498969A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Sputtering apparatus and method
Assignee: National Research Council Canada
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Filing: 1983-11-17
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Granted: 1985-02-12
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Expires: 2003-11-17
Abstract
Abstract A apparatus and method is described for the magnetron sputtering of a workpiece to deposit a thin metallic film. A rotating magnetic field is provided in the vicinity of the workpiece to produce higher yield from a given cathode target.
Inventors
- 👤 Kovilvila Ramachandran
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 20:19
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; H01J37/3402; H01J37/3405
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
120 words
Sputtering apparatus adapted to form a metallic film on a workpiece, comprising (a) a magnetron sputter device for establishing a glow discharge, (b) a cathode target of material to be sputtered so as to coat at least part of said workpiece with said material, (c) an anode at a different potential to said cathode target to form an electric field therebetween, (d) a magnet adjacent said cathode target, (e) an assembly supporting said magnet and capable of rotating said magnet to produce a rotating magnetic field in the vicinity of said cathode target and said workpiece, said magnet being disposed such that said magnetic field is substantially parallel to the surface of said target in the region to be sputtered.
Claim 2
Dependent Claim
120 words
Sputtering apparatus adapted to form a metallic film on a workpiece, comprising (a) a magnetron sputter device for establishing a glow discharge, (b) a cathode target of material to be sputtered so as to coat at least part of said workpiece with said material, (c) an anode at a different potential to said cathode target to form an electric field therebetween, (d) a magnet adjacent said cathode target, (e) an assembly supporting said magnet and capable of rotating said magnet to produce a rotating magnetic field in the vicinity of said cathode target and said workpiece, said magnet being disposed such that said magnetic field is substantially parallel to the surface of said target in the region to be sputtered.
Claim 3
Dependent Claim
39 words
Sputtering apparatus according to claim 1 wherein an air gap is provided in said magnet which in plan view comprises a spaced-apart pair of parallel straight lengths joined at each end by semi-circular portions to form a closed track.
Claim 4
Dependent Claim
36 words
Sputtering apparatus according to claim 1 wherein an air gap is provided in said magnet which in plan view comprises a closed track formed from a plurality of petal-like outlines extending outwardly from a central location.
Claim 5
Dependent Claim
23 words
Sputtering apparatus according to claim 1 wherein an air gap is provided in said magnet which in plan view is of closed-rectangular outline.
Claim 6
Dependent Claim
33 words
Sputtering apparatus according to claim 1 wherein the magnetic field is concentrated along a closed, endless track on the cylindrical surface, and the cathode target is a hollow cylinder closely surrounding the magnet.
Claim 7
Dependent Claim
19 words
Sputtering apparatus according to claim 1, 2 or 3 including means for cooling said cathode target by cooling fluid.
Claim 8
Independent Claim
70 words
A method of forming a metallic film on a workpiece including the steps of (a) magnetron sputtering a cathode target and establishing a glow discharge, (b) establishing an electric field in the vicinity of said cathode target, and (c) establishing a magnetic field in the vicinity of said cathode target substantially parallel to the surface of said target in the region to be sputtered, and (d) rotating said magnetic field.
Claim 9
Independent Claim
70 words
A method of forming a metallic film on a workpiece including the steps of (a) magnetron sputtering a cathode target and establishing a glow discharge, (b) establishing an electric field in the vicinity of said cathode target, and (c) establishing a magnetic field in the vicinity of said cathode target substantially parallel to the surface of said target in the region to be sputtered, and (d) rotating said magnetic field.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-02-12 | 1988-08-13 | 1989-02-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-02-12 | 1992-08-13 | 1993-02-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-02-12 | 1996-08-13 | 1997-02-12 | $7700.00 | Window Closed / Lapsed |