US4496098A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing a tin/lead alloy solder joint with less wetting agent residue
Assignee: Individual
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Filing: 1982-03-25
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Granted: 1985-01-29
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Expires: 2002-03-25
Abstract
Abstract Surfaces of copper or brass which are to be joined by tin/lead alloy soldering in a non-oxydizing atmosphere are first wetted by a treating liquid containing an organic solvent typified by ethyl alcohol; a polyhydric alcohol derivative typified by ethylene glycol; and an organic, halogen-containing activator typified by aniline hydrochloride. In the resulting soldered joint, the solder has spread acceptably well and little oxidation or wetting agent resident is formed.
Inventors
- 👤 Ichiro Kawakatsu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 20:59
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/36; B23K35/3612
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
167 words
In a soldering process in which a tin/lead solder alloy is to be melted to form a joint with a surface of a piece of copper or brass while the surface is protected against oxidation by being surrounded by a non-oxidizing gaseous atmosphere, the improvement comprising: as a preliminary step, coating said surface with a liquid wetting agent which is a mixture consisting essentially of an organic solvent having a boiling point in the range of 30° C. to 160° C., a relatively viscous polyhydric alcohol derivative having a boiling point in the range of 170° C. to 320° C., and an organic halogen-containing activator, so that as the solder joint is made so little oxidation and wetting agent residue is formed that no residue removal step likely to generate corrosion is needed; and the step of melting the tin/lead solder alloy is conducted so soon after said coating step, that resulting vaporization of said organic solvent during the solder melting step contributes to said gaseous atmosphere.
Claim 2
Dependent Claim
167 words
In a soldering process in which a tin/lead solder alloy is to be melted to form a joint with a surface of a piece of copper or brass while the surface is protected against oxidation by being surrounded by a non-oxidizing gaseous atmosphere, the improvement comprising: as a preliminary step, coating said surface with a liquid wetting agent which is a mixture consisting essentially of an organic solvent having a boiling point in the range of 30° C. to 160° C., a relatively viscous polyhydric alcohol derivative having a boiling point in the range of 170° C. to 320° C., and an organic halogen-containing activator, so that as the solder joint is made so little oxidation and wetting agent residue is formed that no residue removal step likely to generate corrosion is needed; and the step of melting the tin/lead solder alloy is conducted so soon after said coating step, that resulting vaporization of said organic solvent during the solder melting step contributes to said gaseous atmosphere.
Claim 3
Dependent Claim
28 words
The improved soldering process of claim 1, wherein: the organic solvent is at least one constituent selected from the group consisting of isoproyl alcohol, ethyl alcohol, acetone, benzene.
Claim 4
Dependent Claim
27 words
The improved soldering process of claim 1, wherein: the polyhyric alcohol derivative is at least one constituent selected from the group consisting of glycerin and ethylene glycol.
Claim 5
Dependent Claim
30 words
The improved soldering process of claim 1, wherein: the organic halogen-containing activator is at least one constituent selected from the group consisting of dimethylamine hydrochloride, aniline hydrochloride and glutamine hydrochloride.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-01-29 | 1988-07-30 | 1989-01-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-01-29 | 1992-07-30 | 1993-01-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-01-29 | 1996-07-30 | 1997-01-29 | $7700.00 | Window Closed / Lapsed |