Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
193 words
ln a semiconductor device of the type including a bulk substrate of one dopant type, a layer of opposite dopant type disposed atop the substrate, an isolation region of same dopant type as the substrate integrally connected to the substrate and adjoining the periphery of the layer, a first region of the opposite dopant type extending into the layer from the interior of the upper surface thereof, and a second region of the one dopant type extending into the layer from the upper surface thereof and surrounding the first region, the improvement comprising (a) a third highly doped region of the opposite dopant type disposed between the layer and the substrate, beneath the second region and surrounding the first region; (b) a fourth region of the one dopant type extending into the layer from the upper surface thereof, the fourth region surrounding the first region and, in turn, being surrounded by the second region; and (c) means for biasing the fourth region to a potential proximate that of the substrate so as to increase the maximum attainable voltage between the first and second regions when the semiconductor device is in a current-blocking state.
Claim 2
Dependent Claim
193 words
ln a semiconductor device of the type including a bulk substrate of one dopant type, a layer of opposite dopant type disposed atop the substrate, an isolation region of same dopant type as the substrate integrally connected to the substrate and adjoining the periphery of the layer, a first region of the opposite dopant type extending into the layer from the interior of the upper surface thereof, and a second region of the one dopant type extending into the layer from the upper surface thereof and surrounding the first region, the improvement comprising (a) a third highly doped region of the opposite dopant type disposed between the layer and the substrate, beneath the second region and surrounding the first region; (b) a fourth region of the one dopant type extending into the layer from the upper surface thereof, the fourth region surrounding the first region and, in turn, being surrounded by the second region; and (c) means for biasing the fourth region to a potential proximate that of the substrate so as to increase the maximum attainable voltage between the first and second regions when the semiconductor device is in a current-blocking state.
Claim 3
Dependent Claim
50 words
The invention according to claim 1, further comprising a fifth region of the opposite dopant type extending into the layer from the upper surface thereof and terminating in integral contact with the third region, the fifth region surrounding the second region, and, in turn, being surrounded by the isolation region.
Claim 4
Dependent Claim
49 words
The invention of claim 2, further comprising a sixth region of the opposite dopant type extending into the layer from the upper surface thereof and terminating in integral contact with the third region, the sixth region surrounding the fourth region, and, in turn, being surrounded by the second region.
Claim 5
Dependent Claim
40 words
The invention of claim 1, further comprising an additional region of the opposite dopant type being disposed between the layer and the substrate, beneath the fourth region, surrounding the first region, and, in turn, being surrounded by the third region.
Claim 6
Dependent Claim
42 words
The invention according to claim 1 or 2, further comprising an additional region of the opposite dopant type formed entirely within the second region and extending into the second region from the upper surface thereof so as to surround the first region.
Claim 7
Dependent Claim
26 words
The invention according to claim 1, wherein the means for biasing the fourth region comprises a conductor connecting together the fourth region and the isolation region.
Claim 8
Dependent Claim
22 words
The invention according to claim 1, wherein the one dopant type is P type and the opposite dopant type is N type.
Claim 9
Dependent Claim
14 words
The invention according to claim 7, wherein the semiconductor device comprises silicon semiconductor material.