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US4488824A Expired / Lapsed US ⏱️ 0.0 years remaining

Method and apparatus for precision temperature measurement

Assignee: MIT TRADING CORP
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Filing: 1982-05-14
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Granted: 1984-12-18
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Expires: 2002-05-14
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Abstract

Abstract A bandgap voltage reference and temperature sensor is used to determine accurately the temperature of the cold junction of a thermocouple for algebraic combination with the thermocouple signal to provide precision temperature measurements with thermocouple speed. In a discrete component embodiment copper slugs function as thermal inertial elements to equalize the thermal response rates of the temperature sensor and thermocouple. In an IC embodiment the cold junction is located on the chip in close proximity to the temperature sensor component in the chip thereby avoiding any thermal differential between cold junction and sensor.

Inventors

  • 👤 Robert J. Salem

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 20:35
CPC Classifications
G; G01; G01K; G01K7/00; G01K7/02; G01K7/10; G01K7/12; G01K7/13; G01K7/04

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 228 words
A temperature measuring device for providing a signal representative of a temperature to be measured, comprising in combination a thermocouple for sensing the temperature to be measured, said thermocouple having a hot and cold junction for providing a first signal as a function of the temperature difference between said hot and cold junctions, means comprising a semiconductor thermal sensitive component arranged in a common structure with said cold junction to provide a second signal as a function of the actual temperature of said cold junction and based upon the absolute scale of temperature, and means coupled responsively to said first mentioned means and thermocouple for providing a third signal representative of the algebraic addition of said first and second signals, said third signal being representative of said temperature to be measured, said cold junction and said semiconductor component being coupled to a thermionic inertia element for equalizing the thermal response rates of said thermocouple cold junction and said semiconductor component, said thermionic inertia element comprising two bodies of the same conductive metal disposed side by side separated by a thin layer of electrically insulating but thermally conductive material, said bodies being of different metal from that of said thermocouple hot junction and connected to said thermocouple hot junction to provide said cold junction, said bodies defining an internal cavity, and said semiconductor component is mounted within said cavity.
Claim 2
Dependent Claim 228 words
A temperature measuring device for providing a signal representative of a temperature to be measured, comprising in combination a thermocouple for sensing the temperature to be measured, said thermocouple having a hot and cold junction for providing a first signal as a function of the temperature difference between said hot and cold junctions, means comprising a semiconductor thermal sensitive component arranged in a common structure with said cold junction to provide a second signal as a function of the actual temperature of said cold junction and based upon the absolute scale of temperature, and means coupled responsively to said first mentioned means and thermocouple for providing a third signal representative of the algebraic addition of said first and second signals, said third signal being representative of said temperature to be measured, said cold junction and said semiconductor component being coupled to a thermionic inertia element for equalizing the thermal response rates of said thermocouple cold junction and said semiconductor component, said thermionic inertia element comprising two bodies of the same conductive metal disposed side by side separated by a thin layer of electrically insulating but thermally conductive material, said bodies being of different metal from that of said thermocouple hot junction and connected to said thermocouple hot junction to provide said cold junction, said bodies defining an internal cavity, and said semiconductor component is mounted within said cavity.
Claim 3
Dependent Claim 20 words
A temperature measuring device according to claim 1, wherein said semiconductor component is selected from the silicon family of semiconductors.

References Cited (Backward Citations)

US3280630A Cited
US3461380A Cited
US3903743A Cited
US3921453A Cited
US4133700A Cited
JPS5241570A Cited
US4120201A Cited
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GB2074734A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-12-18 1988-06-18 1988-12-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-12-18 1992-06-18 1992-12-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-12-18 1996-06-18 1996-12-18 $7700.00 Window Closed / Lapsed

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