US4487828A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing printed circuit boards
Assignee: AT&T Inc
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Filing: 1983-06-03
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Granted: 1984-12-11
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Expires: 2003-06-03
Abstract
Abstract A method for manufacturing a printed wiring board having a solder layer existing on circuit paths located on surfaces of the board and a solder layer on the walls of thru holes located in the board involves coating the surface of the board with a layer of photopolymer resist. A shield is placed over selected areas of the solder layer on the surface and the shielded surface is exposed to ultra violet light until the unshielded resist hardens. The shielded resist which has remained soft is removed and the board is washed with solder resist to remove the solder layer not covered by a coating of hardened resist.
Inventors
- 👤 Raymond C. Hladovcak
- 👤 Walter W. Keating
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 11:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/0094; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3473; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09581; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/0756; H05K2203/0759; H05K3/0073; H05K3/0082; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/10; H05K3/108; H05K3/3452; H05K3/40; H05K3/42; H05K3/425; H05K3/427
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
240 words
The method of manufacturing a printed circuit board comprising the steps of: (a) processing an insulative substrate (1) to form on a surface of such substrate on one side thereof a plurality of fine line conductor paths, and terminals pads therefor, in such manner that said paths are separated by narrow interpath areas of such surface, and that both said paths and said pads comprise inner and outer layers of copoper and solder, respectively, and (2) to further form in said substrate a plurality of through holes in centered relation with said pads and having on the sides of their interiors said inner and outer layers of copper and solder, (b) coating said substrate on said side thereof with photopolymer resist so as to cover by such resist all of said pluralities of paths, pads and holes, (c) exposing to energetic radiation only portions of the resist coating which are on said pads and holes, so as to harden only those resist portions, (d) removing the unhardened resist so as to leave bare said conductor paths, (e) applying a liquid solder stripping medium to said substrate so as to strip from said circuit paths the solder layer thereof without removal of the copper layer thereof, and (f) after termination of said stripping step, removing said hardened resist portions so as to leave bare the solder layer areas of said pads and holes which were previously covered by said hardened portions.
Claim 2
Independent Claim
240 words
The method of manufacturing a printed circuit board comprising the steps of: (a) processing an insulative substrate (1) to form on a surface of such substrate on one side thereof a plurality of fine line conductor paths, and terminals pads therefor, in such manner that said paths are separated by narrow interpath areas of such surface, and that both said paths and said pads comprise inner and outer layers of copoper and solder, respectively, and (2) to further form in said substrate a plurality of through holes in centered relation with said pads and having on the sides of their interiors said inner and outer layers of copper and solder, (b) coating said substrate on said side thereof with photopolymer resist so as to cover by such resist all of said pluralities of paths, pads and holes, (c) exposing to energetic radiation only portions of the resist coating which are on said pads and holes, so as to harden only those resist portions, (d) removing the unhardened resist so as to leave bare said conductor paths, (e) applying a liquid solder stripping medium to said substrate so as to strip from said circuit paths the solder layer thereof without removal of the copper layer thereof, and (f) after termination of said stripping step, removing said hardened resist portions so as to leave bare the solder layer areas of said pads and holes which were previously covered by said hardened portions.
Claim 3
Dependent Claim
73 words
The method of manufacturing a printed circuit board according to claim 1 comprising the further steps of: (g) coating said solder-free copper conductive paths with a solder mask material, (h) inserting component leads in the solder-coated through holes, and (i) passing the component bearing printed wiring board through a wave soldering station, so as to couple such leads by solder to said prexisting solder layer areas on said pads and in said holes.
References Cited (Backward Citations)
US3266125A
Cited
US3677849A
Cited
US3607474A
Cited
US3589004A
Cited
US3574933A
Cited
US3565707A
Cited
US3778900A
Cited
GB1396481A
Cited
DE2614059A1
Cited
JPS53142337A
Cited
US4229879A
Cited
US4104111A
Cited
JPS555877A
Cited
US4283480A
Cited
US4325780A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-12-11 | 1988-06-11 | 1988-12-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-12-11 | 1992-06-11 | 1992-12-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-12-11 | 1996-06-11 | 1996-12-11 | $7700.00 | Window Closed / Lapsed |