Abstract A processor apparatus is provided in which a blackbody radiator having a constant planar energy flux characteristic is placed in opposition to semiconductor material. The blackbody source produces a constant planar energy flux to uniformly heat the material. The source is heated to a sufficiently high temperature for a sufficient time to anneal or activate a semiconductor wafer or to epitaxially regrow a thin epitaxial film. The processor is operated by accomplishing the steps of presenting a blackbody radiator in opposition to semiconductor material to be thermally treated, radiatively heating the material to a sufficiently high temperature for a sufficient time to accomplish the desired process result, and cooling and removing the material. In the interval between presentation of successive samples of the material to the source, the source may be shuttered or idled to reduce energy consumption.
A device for heat treatment of a semiconductor wafer comprising: a blackbody radiation source made from a sheet of electrically resistive material configured in a generally planar, serpentine pattern and adapted for parallel, closely spaced alignment with said wafer, said source including means for conserving energy by establishing a prescribed radiation intensity over a region not substantially larger than said wafer and for providing substantially uniform blackbody radiation intensity within said region over the surface of said wafer, said means including a thinned central portion of said resistive sheet which produces higher radiation intensity than the peripheral portion; and electrical means for connecting said blackbody radiation source to a source of electrical energy.
Claim 2
Independent Claim
113 words
A device for heat treatment of a semiconductor wafer comprising: a blackbody radiation source made from a sheet of electrically resistive material configured in a generally planar, serpentine pattern and adapted for parallel, closely spaced alignment with said wafer, said source including means for conserving energy by establishing a prescribed radiation intensity over a region not substantially larger than said wafer and for providing substantially uniform blackbody radiation intensity within said region over the surface of said wafer, said means including a thinned central portion of said resistive sheet which produces higher radiation intensity than the peripheral portion; and electrical means for connecting said blackbody radiation source to a source of electrical energy.
Claim 3
Dependent Claim
13 words
The device as defined in claim 1 wherein said resistive material is graphite.