Reversible electrodeposition switching device

Claim 2

An electrical switching device comprising: a pair of spaced dielectric substrates, a high resistance molecular metallic layer on one surface of each of the dielectric substrates, means holding the substrates with the metallic layers in spaced relationship adjacent each other, an electrolytic solution having metal ions in the space between the adjacent metallic layers, a pair of terminals contacting one of said metallic layers at separate points that are spaced from each other, and means for applying a voltage pulse of a first polarity across the electrodes to cause electrodeposition of the metal ions in the electrolyte on said one of the metallic layers, the electrodeposited metal substantially reducing the electrical resistance between said terminals.

Claim 3

Apparatus of claim 1 further including means for applying a voltage pulse across the electrodes of reverse polarity to cause the metal to go back into solution in the electrolyte.

Claim 4

Apparatus of claim 1 further including a second pair of terminals contacting the other of said metallic layers, said means applying a voltage pulse of reverse polarity providing a pulse of sufficient duration to electrodeposit metal on said other metallic layer between the second pair of terminals.

Claim 5

Apparatus of claim 1 wherein the metallic ions are silver.

Claim 6

A microwave device comprising: a waveguide section for conducting microwave energy, a control device including a pair of spaced dielectric substrates and a high resistance molecular metallic layer on each dielectric substrate, the layers having a thickness that is substantially transparent to any microwave energy transmitted by the waveguide section, means holding the substrates with the metallic layers in spaced relationship adjacent to each other, an electrolytic solution having metal ions in the space between the adjacent metallic layers, and means for applying a voltage pulse of a first polarity across the electrodes to cause electrodeposition of the metal ions in the electrolyte on said one of the metallic layers to a thickness that reflects a substantial portion of the microwave energy transmitted by the waveguide section.

Claim 7

A microwave device comprising: a waveguide section for conducting microwave energy, a control device including a pair of spaced dielectric substrates and a high resistance molecular metallic layer on each dielectric substrate, the layers having a thickness that is substantially transparent to any microwave energy transmitted by the waveguide section, means holding the substrates with the metallic layers in spaced relationship adjacent to each other, an electrolytic solution having metal ions in the space between the adjacent metallic layers, and means for applying a voltage pulse of a first polarity across the electrodes to cause electrodeposition of the metal ions in the electrolyte on said one of the metallic layers to a thickness that reflects a substantial portion of the microwave energy transmitted by the waveguide section.

Claim 8

The microwave device of claim 5 wherein said metallic layers extend parallel to the longitudinal axis of the waveguide.

Claim 9

The microwave device of claim 6 further including: a branch waveguide section forming a T-junction with the first-named waveguide section, said metallic layers being extended diagonally to and positioned at the intersecting axes of the waveguide sections of the T-junction whereby microwave energy reflected by the metallic layers is directed into the branch waveguide.

Claim 10

A variable impedance device comprising: first and second dielectric substrates, a high resistance molecular metallic layer deposited on at least one side of the substrates forming first and second electrodes, the electrodes being adjacent each other, an electrolytic fluid containing metal ions in solution filling the space between the electrodes, means for applying an electrical potential between the electrodes for causing the metal ions to deposit out of solution onto the first of said electrodes, means forming a conductive surface on the opposite side of said first substrate, and terminal means electrically connected to the first electrode and the conductive surface on the two sides of the first substrate.

Claim 11

A variable impedance device comprising: first and second dielectric substrates, a high resistance molecular metallic layer deposited on at least one side of the substrates forming first and second electrodes, the electrodes being adjacent each other, an electrolytic fluid containing metal ions in solution filling the space between the electrodes, means for applying an electrical potential between the electrodes for causing the metal ions to deposit out of solution onto the first of said electrodes, means forming a conductive surface on the opposite side of said first substrate, and terminal means electrically connected to the first electrode and the conductive surface on the two sides of the first substrate.

Claim 12

Apparatus of claim 8 further including a third substrate adjacent said opposite side of the first substrate from the second substrate, the adjacent surfaces of the first and third substrates each having a high resistance molecular metallic layer deposited thereon forming electrodes, an electrolyte fluid between the first and third substrates, the fluid containing metal ions in solution, means applying a potential between the adjacent surfaces of the first and third substances for causing the metal ions to deposit on the surface of the first substrate to form said conductive surface.

Claim 13

Apparatus of claim 9 wherein the high resistance molecular layers on the opposite sides of the first substrate have an elongated serpentine shape with substantial portions of the respective serpentine shaped layers being aligned with each other, and terminal means for providing electrical connections to opposite ends of both serpentine shaped layers.

Claim 14

A variable impedance device comprising: first and second dielectric substrates, a high resistance molecular metallic layer deposited on at least one side of both substrates forming first and second electrodes, an electrolytic fluid containing metal ions in solution filling the space between the electrodes, means for applying an electrical potential between the electrodes for causing the metal ions to deposit out of solution onto the first electrode, and a pair of spaced terminals contacting the metallic layer of the first electrode.

Claim 15

A variable impedance device comprising: first and second dielectric substrates, a high resistance molecular metallic layer deposited on at least one side of both substrates forming first and second electrodes, an electrolytic fluid containing metal ions in solution filling the space between the electrodes, means for applying an electrical potential between the electrodes for causing the metal ions to deposit out of solution onto the first electrode, and a pair of spaced terminals contacting the metallic layer of the first electrode.