Process for preparation of metallic bottles

Claim 2

A process for the preparation of metallic bottles which comprises lap-bonding circumferential open end portions of upper and lower members, each consisting of a formed cup of a metal having a circumferential open end, applying an adhesive to at least one of the outer and inner faces of the open ends to be lap-bonded, fitting the two circumferential open ends to each other through the adhesive layer, melting the adhesive layer present in the lap portion, and cooling the adhesive layer to form a circumferential seam for a metallic bottle, said adhesive comprising at least one thermoplastic resin adhesive having a water absorption of less than 2%, as measured at a temperature of 23° C. and a relative humidity of 80%, and an elasticity contribution ratio (R(t) t=1 ) of from 1×10 -4 to 5×10 -1 , defined by the following formula R(t).sub.t=1 =J(t).sub.rec,t=1 /J(t).sub.t=1 wherein J(t) t=1 represents a creep compliance at a time constant of 1 second when the adhesive is caused to creep at a temperature higher by 30° C. Than the melting point of the adhesive under a shear stress of 50 to 5,000 dyne/cm 2 , and J(t) rec ,t=1 represents an equilibrium recovery creep compliance when the adhesive is caused to creep under the same conditions as described above and the adhesive is then let to recover, and containing in the main or side chain groups ##STR21## at a concentration 10 to 1400 milliequivalents per 100 g of the adhesive.

Claim 3

A process for the preparation of metallic bottles which comprises preparing upper and lower members, each consisting of a formed cup of a metal having a circumferential open end, applying an adhesive to at least one of the outer and inner faces of the open ends to be lap bonded, fitting the two circumferential ends to each other through the adhesive layer, melting the adhesive layer present in the lap portion, and cooling the adhesive layer to form a circumferential seam for a metallic bottle, said adhesive comprising at least one thermoplastic resin adhesive having a water absorption of less than 2%, as measured at a temperature of 23° C. and a relative humidity of 80%, and an eleasticity contribution ratio (R(t) t=1 ) of from 1×10 -4 to 5×10 -1 , defined by the following formula R(t).sub.t=1 =J(t).sub.rec,t=1 /J(t).sub.t=1 wherein J(t) t=1 represents a creep compliance at a time constant of 1 second when the adhesive is caused to creep at a temperature higher by 30° C. than the melting point of the adhesive under a shear stress of 50 to 5,000 dyne/cm 2 , and J(t) rec ,t=1 represents an equilibrium recovery creep compliance when the adhesive is caused to creep under the same conditions as described above and the adhesive is then let to recover, and containing in the main or side chain groups ##STR22## at a concentration of 10 to 1400 milliequivalents per 100 g of the adhesive, wherein the upper member, the lower member and the adhesive layer have a dimensional relationship satisfying the requirements of D O ≧D I and D I +2d A >D O , wherein D I stands for the outer diameter of the open end portion to be formed into an inner side of the lap-bonded portion, D O stands for the inner diameter of the open end portion to be formed into an outer side of the lap-bonded portion, and d A stands for the thickness of the adhesive before the lap-bonding.

Claim 4

A process for the preparation of metallic bottles which comprises preparing upper and lower members, each consisting of a formed cup of a metal having a circumferential open end, applying an adhesive to at least one of the outer and inner faces of the open ends to be lap bonded, fitting the two circumferential ends to each other through the adhesive layer, melting the adhesive layer present in the lap portion, and cooling the adhesive layer to form a circumferential seam for a metallic bottle, said adhesive comprising at least one thermoplastic resin adhesive having a water absorption of less than 2%, as measured at a temperature of 23° C. and a relative humidity of 80%, and an eleasticity contribution ratio (R(t) t=1 ) of from 1×10 -4 to 5×10 -1 , defined by the following formula R(t).sub.t=1 =J(t).sub.rec,t=1 /J(t).sub.t=1 wherein J(t) t=1 represents a creep compliance at a time constant of 1 second when the adhesive is caused to creep at a temperature higher by 30° C. than the melting point of the adhesive under a shear stress of 50 to 5,000 dyne/cm 2 , and J(t) rec ,t=1 represents an equilibrium recovery creep compliance when the adhesive is caused to creep under the same conditions as described above and the adhesive is then let to recover, and containing in the main or side chain groups ##STR22## at a concentration of 10 to 1400 milliequivalents per 100 g of the adhesive, wherein the upper member, the lower member and the adhesive layer have a dimensional relationship satisfying the requirements of D O ≧D I and D I +2d A >D O , wherein D I stands for the outer diameter of the open end portion to be formed into an inner side of the lap-bonded portion, D O stands for the inner diameter of the open end portion to be formed into an outer side of the lap-bonded portion, and d A stands for the thickness of the adhesive before the lap-bonding.

Claim 5

A process according to claim 1, wherein the resin constituting the adhesive has a number average molecular weight of at least 6,000 on the average.

Claim 6

A process according to claim 1, wherein the thermoplastic resin has a softening point of 80° to 280° C.

Claim 7

A process according to claim 1, wherein the thermoplastic resin is at least one copolyester.

Claim 8

A process according to claim 5, wherein the copolyester is a copolyester containing terephthalic acid units and other dibasic acid units as the dibasic acid component and tetramethylene glycol units as the diol component.

Claim 9

A process according to claim 5, wherein the copolyester is a copolyester containing benzene-dicarboxylic acid units as the dibasic acid component and tetramethylene glycol units and other diol units as the diol component.

Claim 10

A process according to claim 1, wherein the thermoplastic resin is at least one nylon containing 4 to 12 amide groups per 100 carbon atoms.

Claim 11

A process according to claim 2, wherein the resin constituting the adhesive has a number average molecular weight of at least 6,000 on the average.

Claim 12

A process according to claim 2, wherein the thermoplastic resin has a softening point of 80° to 280° C.

Claim 13

A process according to claim 2, wherein the thermoplastic resin is at least one copolyester.

Claim 14

A process according to claim 2, wherein the copolyester is a copolyester containing terephthalic acid units and other dibasic acid units as the dibasic acid component and tetramethylene glycol units as the diol component.

Claim 15

A process according to claim 2, wherein the copolyester is a copolyester containing benzene-dicarboxylic acid units as the dibasic acid component and tetramethylene glycol units and other diol units as the diol component.

Claim 16

A process according to claim 2, wherein the thermoplastic resin is at least one nylon containing 4 to 12 amide groups per 100 carbon atoms.