Method for controlling the edge gradient of a layer of deposition material

Claim 1

A method for controlling the edge gradient of a layer of material deposited through a preformed mask onto a substrate wherein the substrate-to-mask distance is fixed comprising the steps of forming a flux of material to be deposited onto a said substrate wherein the flux of material has a distribution characteristic along a plurality of predetermined paths emanating from at least one source having a known cross-sectional area and shape and located at a selected source position wherein the mask-to-source distance is fixed; aligning a preformed mask having a plurality of apertures extending therethrough which define a pattern for the layer of material to be deposited onto a said substrate such that the preformed mask is in a spaced relationship from a said at least one source of the flux of material located at said selected source position defining a mask-to-source distance and positioned in said flux of material to permit selected portions of said flux of material along the predetermined paths to pass through said apertures in the preformed mask; registering a substrate in a spaced relationship from the preformed mask defining a mask-to-substrate distance to permit the selected portions of said flux of material passing through the apertures in said preformed mask to impinge onto said substrate to form a layer of material thereon having a pattern defined by the apertures in said preformed mask, the substrate-to-mask distance, the mask-to-source distance and the cross-sectional area and shape of the effective source producing the flux of material; controlling the cross-sectional area and shape of said effective source, the magnitude of the substrate-to-mask distance or the magnitude of the mask-to-source distance to direct the selected portions of said flux of material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient to produce an edge on the deposited layer of material having a desired edge gradient; and varying the effective source cross-sectional area and shape producing the flux of material to control the slopes of the edge gradient of the deposited layers.

Claim 2

A method for controlling the edge gradient of a layer of material deposited through a preformed mask onto a substrate wherein the substrate-to-mask distance is fixed comprising the steps of forming a flux of material to be deposited onto a said substrate wherein the flux of material has a distribution characteristic along a plurality of predetermined paths emanating from at least one source having a known cross-sectional area and shape and located at a selected source position wherein the mask-to-source distance is fixed; aligning a preformed mask having a plurality of apertures extending therethrough which define a pattern for the layer of material to be deposited onto a said substrate such that the preformed mask is in a spaced relationship from a said at least one source of the flux of material located at said selected source position defining a mask-to-source distance and positioned in said flux of material to permit selected portions of said flux of material along the predetermined paths to pass through said apertures in the preformed mask; registering a substrate in a spaced relationship from the preformed mask defining a mask-to-substrate distance to permit the selected portions of said flux of material passing through the apertures in said preformed mask to impinge onto said substrate to form a layer of material thereon having a pattern defined by the apertures in said preformed mask, the substrate-to-mask distance, the mask-to-source distance and the cross-sectional area and shape of the effective source producing the flux of material; controlling the cross-sectional area and shape of said effective source, the magnitude of the substrate-to-mask distance or the magnitude of the mask-to-source distance to direct the selected portions of said flux of material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient to produce an edge on the deposited layer of material having a desired edge gradient; and varying the effective source cross-sectional area and shape producing the flux of material to control the slopes of the edge gradient of the deposited layers.

Claim 8

A method for controlling the edge gradient of a layer of vapor deposition material deposited onto a substrate from an evaporation source of vapor deposition material comprising the steps of forming a flux of vapor deposition material having an effective source cross-sectional area and shape located at a known position from an evaporation source of a vapor deposition material; indexing a deposition mask having a plurality of apertures extending therethrough which define a pattern for a layer of vapor deposition material to be deposited onto a substrate such that the deposition mask is in a spaced relationship from the source of vapor deposition material defining a source-to-mask distance and positioned in the flux of vapor deposition material to permit selected portions of the flux of vapor deposition material to pass through the apertures in the deposition mask; registering a substrate in a spaced relationship from the deposition mask defining a mask-to-substrate distance to permit the selected portions of the flux of vapor deposition material passing through the apertures in the deposition mask to impinge onto the substrate to form a layer of vapor deposited material thereon having a pattern which is defined by the apertures in the deposition mask, said substrate-to-mask distance, said mask-to-source distance and said effective source cross-sectional area and shape producing the flux of vapor deposition material; and controlling the said effective source cross-sectional area and shape of said flux of vapor deposition material or the magnitude of said substrate-to-mask distance while keeping said mask-to-source distance fixed to direct the selected portions of said flux of vapor deposition material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of vapor deposition material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of vapor deposition material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient which varies the edge gradient of the deposited layer to produce an edge on the deposited layer of vapor deposition material having a desired edge gradient.

Claim 9

A method for controlling the edge gradient of a layer of vapor deposition material deposited onto a substrate from an evaporation source of vapor deposition material comprising the steps of forming a flux of vapor deposition material having an effective source cross-sectional area and shape located at a known position from an evaporation source of a vapor deposition material; indexing a deposition mask having a plurality of apertures extending therethrough which define a pattern for a layer of vapor deposition material to be deposited onto a substrate such that the deposition mask is in a spaced relationship from the source of vapor deposition material defining a source-to-mask distance and positioned in the flux of vapor deposition material to permit selected portions of the flux of vapor deposition material to pass through the apertures in the deposition mask; registering a substrate in a spaced relationship from the deposition mask defining a mask-to-substrate distance to permit the selected portions of the flux of vapor deposition material passing through the apertures in the deposition mask to impinge onto the substrate to form a layer of vapor deposited material thereon having a pattern which is defined by the apertures in the deposition mask, said substrate-to-mask distance, said mask-to-source distance and said effective source cross-sectional area and shape producing the flux of vapor deposition material; and controlling the said effective source cross-sectional area and shape of said flux of vapor deposition material or the magnitude of said substrate-to-mask distance while keeping said mask-to-source distance fixed to direct the selected portions of said flux of vapor deposition material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of vapor deposition material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of vapor deposition material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient which varies the edge gradient of the deposited layer to produce an edge on the deposited layer of vapor deposition material having a desired edge gradient.

Claim 12

A method for controlling the edge gradient of a layer of vapor deposition material deposited onto a substrate from an evaporation source of vapor deposition material comprising the steps of forming a flux of vapor deposition material having an effective source cross-sectional area and shape located at a known position from an evaporation source of a vapor deposition material; indexing a deposition mask having a plurality of apertures extending therethrough which define a pattern for a layer of vapor deposition material to be deposited onto a substrate such that the deposition mask is in a spaced relationship from the source of vapor deposition material defining a source-to-mask distance and positioned in the flux of vapor deposition material to permit selected portions of the flux of vapor deposition material to pass through the apertures in the deposition mask; registering a substrate in a spaced relationship from the deposition mask defining a mask-to-substrate distance to permit the selected portions of the flux of vapor deposition material passing through the apertures in the deposition mask to impinge onto the substrate to form a layer of vapor deposited material thereon having a pattern which is defined by the apertures in the deposition mask, said substrate-to-mask distance, said mask-to-source distance and said effective source cross-sectional area and shape producing the flux of vapor deposition material; positioning the effective source of vapor deposition at a fixed substrate-to-mask distance and a fixed mask-to-source distance; and varying the effective source cross-sectional area and shape of said flux of vapor deposition material to direct the selected portions of said flux of vapor deposition material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of vapor deposition material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of vapor deposition material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient which varies the edge gradient of the deposited layer to produce an edge on the deposited layer of vapor deposition material having a desired edge gradient.

Claim 13

A method for controlling the edge gradient of a layer of vapor deposition material deposited onto a substrate from an evaporation source of vapor deposition material comprising the steps of forming a flux of vapor deposition material having an effective source cross-sectional area and shape located at a known position from an evaporation source of a vapor deposition material; indexing a deposition mask having a plurality of apertures extending therethrough which define a pattern for a layer of vapor deposition material to be deposited onto a substrate such that the deposition mask is in a spaced relationship from the source of vapor deposition material defining a source-to-mask distance and positioned in the flux of vapor deposition material to permit selected portions of the flux of vapor deposition material to pass through the apertures in the deposition mask; registering a substrate in a spaced relationship from the deposition mask defining a mask-to-substrate distance to permit the selected portions of the flux of vapor deposition material passing through the apertures in the deposition mask to impinge onto the substrate to form a layer of vapor deposited material thereon having a pattern which is defined by the apertures in the deposition mask, said substrate-to-mask distance, said mask-to-source distance and said effective source cross-sectional area and shape producing the flux of vapor deposition material; positioning the effective source of vapor deposition at a fixed substrate-to-mask distance and a fixed mask-to-source distance; and varying the effective source cross-sectional area and shape of said flux of vapor deposition material to direct the selected portions of said flux of vapor deposition material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of vapor deposition material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of vapor deposition material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient which varies the edge gradient of the deposited layer to produce an edge on the deposited layer of vapor deposition material having a desired edge gradient.

Claim 16

A method for controlling the edge gradient of a layer of material deposited through a preformed mask onto a substrate comprising the steps of forming a flux of material to be deposited onto a said substrate wherein the flux of material has a distribution characteristic along a plurality of predetermined paths emanating from an effective source having a known cross-sectional area and shape and located at a known position; aligning a preformed mask having a plurality of apertures extending therethrough which define a pattern for the layer of material to be deposited onto a said substrate such that the preformed mask is in a spaced relationship from said source of the flux of material defining a mask-to-source distance and positioned in said flux of material along the predetermined paths to pass through said apertures in the preformed mask; registering a substrate in a spaced relationship from the preformed mask defining a mask-to-substrate distance to permit the selected portions of said flux of material passing through the apertures in said preformed mask to impinge onto said substrate to form a layer of material thereon having a pattern defined by the apertures in said preformed mask, the substrate-to-mask distance, the mask-to-source distance and the cross-sectional area and shape of the effective source producing the flux of material; and controlling the the cross-sectional area and shape of said effective source or the magnitude of the substrate-to-mask distance while keeping the magnitude of the mask-to-source distance fixed to direct the selected portions of said flux of material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient to produce an edge on the deposited layer of material having a desired edge gradient.

Claim 17

A method for controlling the edge gradient of a layer of material deposited through a preformed mask onto a substrate comprising the steps of forming a flux of material to be deposited onto a said substrate wherein the flux of material has a distribution characteristic along a plurality of predetermined paths emanating from an effective source having a known cross-sectional area and shape and located at a known position; aligning a preformed mask having a plurality of apertures extending therethrough which define a pattern for the layer of material to be deposited onto a said substrate such that the preformed mask is in a spaced relationship from said source of the flux of material defining a mask-to-source distance and positioned in said flux of material along the predetermined paths to pass through said apertures in the preformed mask; registering a substrate in a spaced relationship from the preformed mask defining a mask-to-substrate distance to permit the selected portions of said flux of material passing through the apertures in said preformed mask to impinge onto said substrate to form a layer of material thereon having a pattern defined by the apertures in said preformed mask, the substrate-to-mask distance, the mask-to-source distance and the cross-sectional area and shape of the effective source producing the flux of material; and controlling the the cross-sectional area and shape of said effective source or the magnitude of the substrate-to-mask distance while keeping the magnitude of the mask-to-source distance fixed to direct the selected portions of said flux of material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient to produce an edge on the deposited layer of material having a desired edge gradient.

Claim 22

A method for controlling the edge gradient of a layer of vapor deposition material deposited onto a substrate from an evaporation source of vapor deposition material comprising the steps of forming a flux of vapor deposition material having an effective source cross-sectional area and shape located at a known position from an evaporation source of a vapor deposition material; indexing a deposition mask having a plurality of apertures extending therethrough which define a pattern for a layer of vapor deposition material to be deposited onto a substrate such that the deposition mask is in a spaced relationship from the source of vapor deposition material defining a source-to-mask distance and positioned in the flux of vapor deposition material to permit selected portions of the flux of vapor deposition material to pass through the apertures in the deposition mask; registering a substrate in a spaced relationship from the deposition mask defining a mask-to-substrate distance to permit the selected portions of the flux of vapor deposition material passing through the apertures in the deposition mask to impinge onto the substrate to form a layer of vapor deposited material thereon having a pattern which is defined by the apertures in the deposition mask, said substrate-to-mask distance, said mask-to-source distance and said effective source cross-sectional area and shape producing the flux of vapor deposition material; and controlling said effective source cross-sectional area, shape of said flux of vapor deposition material and the magnitude of said substrate-to-mask distance while keeping said mask-to-source distance fixed to direct the selected portions of said flux of vapor deposition material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of vapor deposition material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer definng the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of vapor deposition material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient which varies the edge gradient of the deposited layer to produce an edge on the deposited layer of vapor deposition material having a desired edge gradient.

Claim 23

A method for controlling the edge gradient of a layer of vapor deposition material deposited onto a substrate from an evaporation source of vapor deposition material comprising the steps of forming a flux of vapor deposition material having an effective source cross-sectional area and shape located at a known position from an evaporation source of a vapor deposition material; indexing a deposition mask having a plurality of apertures extending therethrough which define a pattern for a layer of vapor deposition material to be deposited onto a substrate such that the deposition mask is in a spaced relationship from the source of vapor deposition material defining a source-to-mask distance and positioned in the flux of vapor deposition material to permit selected portions of the flux of vapor deposition material to pass through the apertures in the deposition mask; registering a substrate in a spaced relationship from the deposition mask defining a mask-to-substrate distance to permit the selected portions of the flux of vapor deposition material passing through the apertures in the deposition mask to impinge onto the substrate to form a layer of vapor deposited material thereon having a pattern which is defined by the apertures in the deposition mask, said substrate-to-mask distance, said mask-to-source distance and said effective source cross-sectional area and shape producing the flux of vapor deposition material; and controlling said effective source cross-sectional area, shape of said flux of vapor deposition material and the magnitude of said substrate-to-mask distance while keeping said mask-to-source distance fixed to direct the selected portions of said flux of vapor deposition material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of vapor deposition material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer definng the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of vapor deposition material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient which varies the edge gradient of the deposited layer to produce an edge on the deposited layer of vapor deposition material having a desired edge gradient.

Claim 24

A method for controlling the edge gradient of a layer of material deposited through a preformed mask onto a substrate comprising the steps of forming a flux of material to be deposited onto a said substrate wherein the flux of material has a distribution characteristic along a plurality of predetermined paths emanating from an effective source having a known cross-sectional area and shape and located at a known position; aligning a preformed mask having a plurality of apertures extending therethrough which define a pattern for the layer of material to be deposited onto a said substrate such that the preformed mask is in a spaced relationship from a said source of the flux of material defining a mask-to-source distance and positioned in said flux of material along the predetermined paths to pass through said apertures in the preformed mask; registering a substrate in a spaced relationship from the preformed mask defining a mask-to-substrate distance to permit the selected portions of said flux of material passing through the apertures in said preformed maks to impinge onto said substrate to form a layer of material thereon having a pattern defined by the apertures in said preformed mask, the substrate-to-mask distance, the mask-to-source distance and the cross-sectional area and shape of the effective source producing the flux of material; and controlling the cross-sectional area, shape of said effective source and the magnitude of the substrate-to-mask distance while keeping the magnitude of the mask-to-source distance fixed to direct the selected portions of said flux of material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient to produce and edge on the deposited layer of material having a desired edge gradient.

Claim 25

A method for controlling the edge gradient of a layer of material deposited through a preformed mask onto a substrate comprising the steps of forming a flux of material to be deposited onto a said substrate wherein the flux of material has a distribution characteristic along a plurality of predetermined paths emanating from an effective source having a known cross-sectional area and shape and located at a known position; aligning a preformed mask having a plurality of apertures extending therethrough which define a pattern for the layer of material to be deposited onto a said substrate such that the preformed mask is in a spaced relationship from a said source of the flux of material defining a mask-to-source distance and positioned in said flux of material along the predetermined paths to pass through said apertures in the preformed mask; registering a substrate in a spaced relationship from the preformed mask defining a mask-to-substrate distance to permit the selected portions of said flux of material passing through the apertures in said preformed maks to impinge onto said substrate to form a layer of material thereon having a pattern defined by the apertures in said preformed mask, the substrate-to-mask distance, the mask-to-source distance and the cross-sectional area and shape of the effective source producing the flux of material; and controlling the cross-sectional area, shape of said effective source and the magnitude of the substrate-to-mask distance while keeping the magnitude of the mask-to-source distance fixed to direct the selected portions of said flux of material through each aperture at a controlled shift displacement onto the substrate forming a variable flux density of material at the surface of the substrate to define edges on the layer forming said pattern which extend from the extremities of the layer defining the pattern to the central portion of the layer defining the pattern wherein the thickness of the deposited layer of material decreases from the central portion of the layer to the extremities of the layer in a controlled gradient to produce and edge on the deposited layer of material having a desired edge gradient.