← Back to Patent Explorer
US4462188A Expired / Lapsed US ⏱️ 0.0 years remaining

Silica sol compositions for polishing silicon wafers

Assignee: DuPont Electronic Materials Holding Inc
•
Filing: 1982-06-21
•
Granted: 1984-07-31
•
Expires: 2002-06-21
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Semi-conductors can be polished with greater efficiency using as a polishing agent a blend of colloidal silica or silica gel, a water-soluble amine and a water-soluble quaternary ammonium salt or base.

Inventors

  • 👤 Charles C. Payne

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 11:25
CPC Classifications
H; H10; H10P; H10P52/00; H10P52/40; H10P52/402

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 54 words
An improved method for polishing silicon wafers and like materials which comprises applying a polishing agent comprising: 1. An aqueous colloidal silica sol or gel having an average particle size diameter in the range 4-100 millimicrons, 2. A water-soluble amine which contains at least 1 primary amino group and from 2-8 carbon atoms and,
Claim 2
Dependent Claim 54 words
An improved method for polishing silicon wafers and like materials which comprises applying a polishing agent comprising: 1. An aqueous colloidal silica sol or gel having an average particle size diameter in the range 4-100 millimicrons, 2. A water-soluble amine which contains at least 1 primary amino group and from 2-8 carbon atoms and,
Claim 3
Dependent Claim 48 words
A water-soluble quaternary ammonium salt or base containing not more than 6 carbon atoms, and wherein both the amine and the quarternary ammonium salt or base is present at from 0.1-5.0% by weight based on the SiO 2 content of the silica sol; and then, polishing said wafers.
Claim 4
Dependent Claim 48 words
A water-soluble quaternary ammonium salt or base containing not more than 6 carbon atoms, and wherein both the amine and the quarternary ammonium salt or base is present at from 0.1-5.0% by weight based on the SiO 2 content of the silica sol; and then, polishing said wafers.

References Cited (Backward Citations)

US2060850A Cited
US3146208A Cited
US3170273A Cited
US3925229A Cited
US3715842A Cited
US3807979A Cited
US4129457A Cited
US4169337A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-07-31 1988-01-30 1988-07-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-07-31 1992-01-30 1992-07-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-07-31 1996-01-30 1996-07-31 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag