US4461567A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of and apparatus for the positioning of disk-shaped workpieces, particularly semiconductor wafers
Assignee: MERCOTRUST AKTIENGESELLSCHAFT A CORP OF LIECOTENSTEIN
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Filing: 1982-09-28
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Granted: 1984-07-24
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Expires: 2002-09-28
Abstract
Abstract In the photoexposure of semiconductor wafers for the production of circuit elements, the wafers are placed in a prealignment position before being transferred to the exposure stage. A chuck acting as a prepositioning stage is rotatable by one servomotor to set the wafer in its appropriate angular position (φ adjustment) and is shiftable by respective servomotors in the X and Y directions. Servomotor control is effected by optical means detecting a noncircular edge portion of the wafer as well as alignment marks on the wafer inwardly of the edge thereof.
Inventors
- 👤 Herbert E. Mayer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:40
CPC Classifications
G; G03; G03F; G03F9/00; G03F9/70; H; H10; H10P; H10P72/00; H10P72/50; H10P72/53; H10P72/57
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
148 words
A method of preparing a semiconductor wafer for the formation of a pattern of circuit elements at predetermined locations on a surface thereof by selective illumination of a photosensitive layer on such surface through a mask in an exposure station after orthogonal and angular prealignment of the wafer in a prepositioning station, comprising the steps of: (a) providing the wafer with a peripheral edge having a distinctive portion and with a relatively wide surface marking and a multiplicity of relatively narrow optical surface markings inwardly from said edge; (b) coarsely prealigning the wafer in the prepositioning station by optical detection of said distinctive edge portion and of said relatively wide surface marking; (c) transferring the wafer to the exposure station with the orientation imparted thereto in the prepositioning station; and (d) more precisely adjusting the wafer in said exposure station by optically detecting said relatively narrow surface markings.
Claim 2
Independent Claim
148 words
A method of preparing a semiconductor wafer for the formation of a pattern of circuit elements at predetermined locations on a surface thereof by selective illumination of a photosensitive layer on such surface through a mask in an exposure station after orthogonal and angular prealignment of the wafer in a prepositioning station, comprising the steps of: (a) providing the wafer with a peripheral edge having a distinctive portion and with a relatively wide surface marking and a multiplicity of relatively narrow optical surface markings inwardly from said edge; (b) coarsely prealigning the wafer in the prepositioning station by optical detection of said distinctive edge portion and of said relatively wide surface marking; (c) transferring the wafer to the exposure station with the orientation imparted thereto in the prepositioning station; and (d) more precisely adjusting the wafer in said exposure station by optically detecting said relatively narrow surface markings.
Claim 3
Dependent Claim
35 words
The method defined in claim 1 wherein said relatively wide surface marking comprises two sets of closely juxtaposed parallel lines at spaced-apart locations, the lines of one set being perpendicular to those of the other.
Claim 4
Dependent Claim
16 words
The method defined in claim 1 wherein said relatively wide surface marking is of light-scattering character.
Claim 5
Dependent Claim
23 words
The method defined in claim 3 wherein said relatively wide surface marking is disposed on a light-transmissive area transluminated by a position-detecting beam.
Claim 6
Dependent Claim
23 words
The method defined in claim 1, 2, 3 or 4 wherein light is directed upon said relatively wide surface marking from a laser.
Claim 7
Dependent Claim
272 words
In an apparatus for preparing semiconductor wafers for the formation of a pattern of circuit elements at predetermined locations on a surface thereof, including a prepositioning station with a first wafer-supporting chuck, first photoelectric sensing means in said prepositioning station for detecting the orientation of a wafer carried on said first chuck, first drive means coupled with said first chuck and controlled by said first sensing means for imparting a predetermined orthogonal and angular prealignment position to such wafer, an exposure station with a second wafer-supporting chuck, second photoelectric sensing means in said exposure station for detecting narrow alignment marks on a wafer carried on said second chuck, transport means engageable with the so oriented wafer for transferring same in said prealignment position from said first to said second chuck, projection means in said exposure station trained upon said second chuck for selectively illuminating a photosensitive surface layer of a wafer on said second chuck through a mask conforming to the pattern of circuit elements to be produced, and second drive means coupled with said second chuck for precisely aligning the wafer to be illuminated with said mask under the control of said second sensing means, the improvement wherein said first sensing means comprises a plurality of contour-scanning photodetectors responsive to a noncircular edge portion of a wafer carried on said first chuck and at least one surface-scanning photodetector responsive to at least one indexing mark substantially wider than and spaced from said alignment marks on the wafer surface, said surface-scanning photodetector emitting a corrective signal supplementing an output signal of said contour-scanning photodetectors in the control of said first drive means.
Claim 8
Dependent Claim
272 words
In an apparatus for preparing semiconductor wafers for the formation of a pattern of circuit elements at predetermined locations on a surface thereof, including a prepositioning station with a first wafer-supporting chuck, first photoelectric sensing means in said prepositioning station for detecting the orientation of a wafer carried on said first chuck, first drive means coupled with said first chuck and controlled by said first sensing means for imparting a predetermined orthogonal and angular prealignment position to such wafer, an exposure station with a second wafer-supporting chuck, second photoelectric sensing means in said exposure station for detecting narrow alignment marks on a wafer carried on said second chuck, transport means engageable with the so oriented wafer for transferring same in said prealignment position from said first to said second chuck, projection means in said exposure station trained upon said second chuck for selectively illuminating a photosensitive surface layer of a wafer on said second chuck through a mask conforming to the pattern of circuit elements to be produced, and second drive means coupled with said second chuck for precisely aligning the wafer to be illuminated with said mask under the control of said second sensing means, the improvement wherein said first sensing means comprises a plurality of contour-scanning photodetectors responsive to a noncircular edge portion of a wafer carried on said first chuck and at least one surface-scanning photodetector responsive to at least one indexing mark substantially wider than and spaced from said alignment marks on the wafer surface, said surface-scanning photodetector emitting a corrective signal supplementing an output signal of said contour-scanning photodetectors in the control of said first drive means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-07-24 | 1988-01-23 | 1988-07-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-07-24 | 1992-01-23 | 1992-07-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-07-24 | 1996-01-23 | 1996-07-24 | $7700.00 | Window Closed / Lapsed |