Abstract Printed circuits are produced by an additive technique wherein a metal-loaded resinous ink is first printed on the board, the circuit next being covered with a conductive metal powder while the ink is still wet. The powder is then pressed into the ink and the circuit cured. Next, a solder stratum is alloyed with the powder as by a solder paste printed over the circuit and the board heated to cause the solder to alloy with the ink and powder substrates. A solder resist may then be applied selectively over the circuit and multiple layers of circuits may be built up on the board. The conductive ink is an epoxy resin loaded with a metallic powder, preferably copper, with a catalyst added to the ink. The solder paste is a lead-tin alloy containing antimony suspended in a binder and a flux. The apparatus employed to carry out the procedure includes silk screens and a roller arrangement for pressing the metallic powder into the ink. The press includes a plurality of progressively harder rollers. The process may be used to manufacture original circuits, or to repair or make changes to conventional printed circuits.
An electrically conductive ink for use in printing an electrically conductive circuit on a dielectric surface, consisting essentially of: (a) a thermosetting resin; (b) conductive metal particles dispersed in said resin; (c) a catalyst; (d) said resin, said particles and said catalyst being present in said ink by weight percent respectively of approximately 23%, 71% and 6%; (e) said resin being a phenolic resin; (f) said particles being formed of copper having an average particle size of approximately 325 mesh; (g) said catalyst being comprised of substantially equal parts by weight of anhydrous isoproponol and an inorganic acid; and (h) said acid being phosphoric acid.
Claim 2
Dependent Claim
105 words
An electrically conductive ink for use in printing an electrically conductive circuit on a dielectric surface, consisting essentially of: (a) a thermosetting resin; (b) conductive metal particles dispersed in said resin; (c) a catalyst; (d) said resin, said particles and said catalyst being present in said ink by weight percent respectively of approximately 23%, 71% and 6%; (e) said resin being a phenolic resin; (f) said particles being formed of copper having an average particle size of approximately 325 mesh; (g) said catalyst being comprised of substantially equal parts by weight of anhydrous isoproponol and an inorganic acid; and (h) said acid being phosphoric acid.
Claim 3
Dependent Claim
13 words
An electrically conductive ink, according to claim 1, wherein said resin is resorcinol.