US4456641A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic substrate for semiconductor package
Assignee: Narumi China Corp
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Filing: 1982-06-14
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Granted: 1984-06-26
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Expires: 2002-06-14
Abstract
Abstract A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate.
Inventors
- 👤 Hiroshi Ohtani
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 23:44
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10W70/00; H10W70/60; H10W70/67; H10W70/68; Y; Y10; Y10T; Y10T428/00; Y10T428/13; Y10T428/131; Y10T428/24; Y10T428/24273; Y10T428/24777
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
95 words
A ceramic substrate for use as a semiconductor package comprising: a plate member having a first face portion and having a peripheral surface located adjacent said first face portion and a stepped edge portion formed of a first and second crest, said edge portion being located between said peripheral surface and said first face portion so as to increase impact resistance to chipping and cracking of said ceramic substrate upon being impacted with an adjacent ceramic substrate wherein said first and second crest have a radius of curvature of between 0.04 and 0.06 mm inclusive.
Claim 2
Dependent Claim
95 words
A ceramic substrate for use as a semiconductor package comprising: a plate member having a first face portion and having a peripheral surface located adjacent said first face portion and a stepped edge portion formed of a first and second crest, said edge portion being located between said peripheral surface and said first face portion so as to increase impact resistance to chipping and cracking of said ceramic substrate upon being impacted with an adjacent ceramic substrate wherein said first and second crest have a radius of curvature of between 0.04 and 0.06 mm inclusive.
Claim 3
Dependent Claim
29 words
A ceramic substrate as set forth in claim 1, wherein said peripheral surface has a notched portion formed therein for assisting insertion of said plate member into a package.
Claim 4
Dependent Claim
39 words
A ceramic substrate as set forth in claim 1, wherein said plate member further comprises a second face portion opposite said first face portion, said second face portion having a cavity formed therein for insertion of a semiconductor element.
Claim 5
Dependent Claim
21 words
A ceramic substrate as set forth in claim 1, wherein said first and second crests form an approximately 0.1 mm step.
Claim 6
Dependent Claim
21 words
A ceramic substrate as set forth in claim 3, wherein said first and second crests form an approximately 0.1 mm step.
References Cited (Backward Citations)
US4277528A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-06-26 | 1987-12-26 | 1988-06-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-06-26 | 1991-12-26 | 1992-06-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-06-26 | 1995-12-26 | 1996-06-26 | $7700.00 | Window Closed / Lapsed |