Insert molding gate design for encapsulating electronic ceramics with thermoplastic materials

Claim 1

An insert molding gate for completely encapsulating leaded electronic ceramic substrates with thermoplastic materials comprising: an upper member and a lower member of said gate, said members being separable along a parting line; said upper and said lower members defining a mold cavity within said gate; complementary sawtooth edges comprised of a plurality of teeth, each tooth having truncated peaks, integrally formed with and dividing one side of said upper and said lower gate members such that the truncated peaks of said teeth define small orifices along said parting line to serve as a lead clamp comb for gripping the terminal leads of said electronic ceramic substrates; complementary sawtooth edges comprised of a plurality of teeth, said edges integrally formed with and dividing said upper and lower gate members along a section of said parting line of the side of said upper and lower gate members opposed to said lead clamp comb, configured such that peaks of alternate teeth of said edges extend above and below said parting line of said gate, said teeth being truncated to define orifices on both sides of said parting line near the edges of said cavity, said orifices positioned such that said orifices permit the injection of thermoplastic material on all free sides of said electronic ceramic substrate to effect the complete encapsultation thereof.