Method of producing printed circuit boards

Claim 1

In a method of producing a printed circuit board on an insulating or non-insulating substrate supplied with a thermosetting adhesive layer, comprising roughening the surface of said adhesive layer, contacting said roughened surface with a liquid capable of providing said roughened surface with metal nuclei capable of being intensified to form a metal layer by an electroless metal plating solution, exposing said metal nuclei to an electroless metal plating solution thereby forming a metal layer on said roughened surface and then heating the resultant assembly, the improvement comprising roughening the surface of said adhesive layer by spraying the surface of said adhesive layer with a suspension of hard particles having a particle size of between 50 and 200 μm, spraying the thus roughened surface with a suspension of particles of a light sensitive semiconductor metal oxide, which metal oxide, after exposure to light, is capable of releasing copper and/or a metal nobler than copper from a solution of the relevant metal salt, the spraying with the suspension of said metal oxide particles being carried out in such a manner that said metal oxide particles reach said roughened surface in a substantially dry state without drops of the suspension liquid being deposited on said surface, thus providing said roughened surface with a uniformly distributed layer of said metal oxide particles, exposing said layer to light and, either before or after said layer is exposed to light, spraying said layer with a solution of a salt of copper or a metal nobler than copper in a manner such that the particles of said salt reach said layer in a substantially dry state without drops of the liquid of said solution being deposited on said layer, thereby forming metal nuclei in exposed areas of said layer.