Patent US4001569A successfully refreshed from Google Patents.
US4451000A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Soldering apparatus exhaust system
Assignee: Speedline Technologies Inc
•
Filing: 1982-06-11
•
Granted: 1984-05-29
•
Expires: 2002-06-11
Abstract
Abstract The present invention provides an improvement in a circuit board mass soldering apparatus wherein a circuit board is contacted with molten solder at a soldering station and excess solder is removed from the surface of the board while still molten by impingement of a high velocity heated gas stream thereon, by providing a substantially horizontal louvered exhaust system adjacent to and in advance of the mass soldering station, below the travel path of the boards. The louvers extend and open into the path of the effluent gas stream such that the momentum of the gas stream carries it and entrained soldering fumes and particulates into the louvers to the underside thereof from which it may be exhausted by conventional means.
Inventors
- 👤 David E. Stephens
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:47
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B08; B08B; B08B15/00; B08B15/02; B23; B23K; B23K1/00; B23K1/08; B23K1/085; H05K2203/00; H05K2203/08; H05K2203/081
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
215 words
In apparatus for mass joining with solder electrical and electronic components assembled in a circuit board and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder onto said board underside whereby to join said board and said components; an excess solder removal station adjacent and downstream of said soldering station, said excess solder removal station comprising at least one gas jet disposed below the travel path of said board and adapted to direct a fluid gas stream onto the freshly deposited solder on said board underside, a source of pressurized fluid, and means connecting said source and said at least one fluid jet; said excess solder removal station being adapted to relocate or remove a portion of the molten solder deposited on said board before said molten solder solidifies; and means for transporting said circuit board in line-through said mass soldering station, and said excess solder removal station; the improvement which comprises a louvered exhaust system adjacent and upstream of said soldering station, said louvered exhaust system having a generally horizontal louvered surface located below the path of said circuit board, the louvers of which extend and open into the path of said gas stream, and including exhaust means for removing gases from the underside of said louvered surface.
Claim 2
Dependent Claim
215 words
In apparatus for mass joining with solder electrical and electronic components assembled in a circuit board and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder onto said board underside whereby to join said board and said components; an excess solder removal station adjacent and downstream of said soldering station, said excess solder removal station comprising at least one gas jet disposed below the travel path of said board and adapted to direct a fluid gas stream onto the freshly deposited solder on said board underside, a source of pressurized fluid, and means connecting said source and said at least one fluid jet; said excess solder removal station being adapted to relocate or remove a portion of the molten solder deposited on said board before said molten solder solidifies; and means for transporting said circuit board in line-through said mass soldering station, and said excess solder removal station; the improvement which comprises a louvered exhaust system adjacent and upstream of said soldering station, said louvered exhaust system having a generally horizontal louvered surface located below the path of said circuit board, the louvers of which extend and open into the path of said gas stream, and including exhaust means for removing gases from the underside of said louvered surface.
Claim 3
Dependent Claim
37 words
In apparatus according to claim 1, the improvement wherein said gas stream has a substantial horizontal width, and said louvered surface has a horizontal width which exceeds said gas stream horizontal width by at least about 16%.
Claim 4
Dependent Claim
16 words
In apparatus according to claim 1, the improvement wherein the angle of said louvers is adjustable.
Claim 5
Dependent Claim
48 words
In apparatus of any one of claims 1 to 3, and further including an upper exhaust system extending at least in part over said generally horizontal louvered surface, said mass soldering device and solder removal station, said upper exhaust system having second exhaust means for exhausting gases therefrom.
Claim 6
Dependent Claim
42 words
In apparatus according to claim 4, and further including at least one gas jet disposed above travel path of said board upstream of said generally horizontal louvered surface, and adapted to direct a fluid gas stream onto said generally horizontal louvered surface.
Claim 7
Dependent Claim
210 words
Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder onto said board underside whereby to join said board and said components; an excess solder removal station adjacent and downstream of said soldering station, said excess solder removal station comprising at least one gas jet disposed below the travel path of said board and adapted to direct a fluid gas stream onto the freshly deposited solder on said board underside, a source of pressurized fluid, and means connecting said source and said at least one fluid jet, said excess solder removal station being adapted to relocate or remove a portion of the molten solder deposited on said board before said molten solder solidifies; a louvered exhaust system adjacent and upstream of said soldering station, said louvered exhaust system having a generally horizontal louvered surface located below the path of said circuit board, the louvers of which extend and open into the path of said gas stream, and including exhaust means for removing gases from the underside of said louvered surface; and means for transporting said circuit board in line-through said mass soldering station, and said excess solder removal station.
Claim 8
Dependent Claim
210 words
Apparatus for mass joining with solder electrical and electronic components assembled in a circuit board and comprising in combination: a mass soldering station adapted to deposit a quantity of molten solder onto said board underside whereby to join said board and said components; an excess solder removal station adjacent and downstream of said soldering station, said excess solder removal station comprising at least one gas jet disposed below the travel path of said board and adapted to direct a fluid gas stream onto the freshly deposited solder on said board underside, a source of pressurized fluid, and means connecting said source and said at least one fluid jet, said excess solder removal station being adapted to relocate or remove a portion of the molten solder deposited on said board before said molten solder solidifies; a louvered exhaust system adjacent and upstream of said soldering station, said louvered exhaust system having a generally horizontal louvered surface located below the path of said circuit board, the louvers of which extend and open into the path of said gas stream, and including exhaust means for removing gases from the underside of said louvered surface; and means for transporting said circuit board in line-through said mass soldering station, and said excess solder removal station.
Claim 9
Dependent Claim
34 words
Apparatus according to claim 6, wherein said gas stream has a substantial horizontal width, and said louvered surface has a horizontal width which exceeds said gas stream horizontal width by at least about 16%.
Claim 10
Dependent Claim
13 words
Apparatus according to claim 1, wherein the angle of said louvers is adjustable.
Claim 11
Dependent Claim
47 words
Apparatus of any one of claims 6 to 8, and further including an upper exhaust system extending at least in part over said generally horizontal louvered surface, said mass soldering device and solder removal station, said upper exhaust system having second exhaust means for exhausting gases therefrom.
Claim 12
Dependent Claim
41 words
Apparatus according to claim 9, and further including at least one gas jet disposed above travel path of said board upstream of said generally horizontal louvered surface, and adapted to direct a fluid gas stream onto said generally horizontal louvered surface.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-05-29 | 1987-11-28 | 1988-05-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-05-29 | 1991-11-28 | 1992-05-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-05-29 | 1995-11-28 | 1996-05-29 | $7700.00 | Window Closed / Lapsed |